Patents
Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286)
08/2010
08/18/2010EP2217637A1 Dimethylformamide-free formulations using dicyanadiamide as curing agent for thermosetting epoxy resins
08/18/2010CN101809089A Curable liquid epoxy resin composition and cured product thereof
08/18/2010CN101809088A Thermosetting resin composition for light reflection, substrate made therefrom for photosemiconductor element mounting, process for producing the same, and photosemiconductor device
08/18/2010CN101809057A Polyester composition for production of thermally cured film
08/18/2010CN101809056A Epoxy resin composition, cured object obtained therefrom, and light-emitting diode
08/18/2010CN101809055A Curable resin composition for molded bodies, molded body, and production method thereof
08/18/2010CN101807000A Photosensitive resin composition and method for producing same
08/18/2010CN101805505A PC/PMMA alloy and preparation method thereof
08/18/2010CN101805490A Organic silicon modified epoxy-composite estolide nanometer composite heavy anticorrosive material and preparation
08/18/2010CN101805442A Epoxy resin composition for large wind blades and preparation method thereof
08/18/2010CN101805441A Demineralizing, purifying and filtering device in epoxy resin production
08/18/2010CN101255225B Method for preparing high alpha-order dihydroxy diphenol A type epoxy resins
08/18/2010CN101113224B Colored resin composition, color filter, and liquid crystal display
08/17/2010CA2459379C Adhesive for gas barrier laminates and laminated films
08/12/2010WO2010091395A1 Two-part liquid shim compositions
08/12/2010WO2010091072A1 Room temperature curing epoxy adhesive
08/12/2010WO2010091069A1 Gasoline deposit control additive compositions
08/12/2010WO2010090246A1 Powdery vinyl polymer, curable resin composition, and cured object
08/12/2010WO2010088981A1 Curable composition based on epoxy resins and hetero-poly-cyclic polyamines
08/12/2010US20100204437 Polycarbonates made using highly selective catalysts
08/12/2010CA2751849A1 Two-part liquid shim compositions
08/12/2010CA2751226A1 Gasoline deposit control additive compositions
08/11/2010EP2216355A1 Silica-containing epoxy curing agent and epoxy resin cured body
08/11/2010EP2214633A1 Personal care composition comprising a reaction product of epoxy compound and amino silane
08/11/2010EP1636209B1 Epoxy compound and cured epoxy resin product
08/11/2010CN101802692A Liquid crystal aligning agent, liquid crystal alignment film, and liquid crystal display device
08/11/2010CN101802050A Microcapsule-type latent curing agent for epoxy resin and process for production thereof, and one-pack-type epoxy resin composition and cured product thereof
08/11/2010CN101802049A Inclusion complex containing epoxy resin composition for semiconductor encapsulation
08/11/2010CN101802048A Primer compositions for adhesive bonding systems and coatings
08/11/2010CN101802037A Isocyanate modified epoxy resin for fusion bonded epoxy foam applications
08/11/2010CN101798442A Polyetheralkanolamine dispersants
08/11/2010CN101798441A Vacuum pressure high-temperature impregnating resin suitable for high voltage equipment insulators
08/11/2010CN101798380A Method for preparing high-strength high-toughness epoxy resin system
08/11/2010CN101798379A Modified fatty amine curing agent
08/11/2010CN101798378A Transparent epoxy resin curing agent
08/11/2010CN101215367B Epoxy resin containing perfluoroalkyl side chain and its preparing method and application
08/11/2010CN101072808B Method for producing acid anhydride based epoxy resin curing agent, acid anhydride based epoxy resin curing agent, epoxy resin composition, cured article therefrom and optical semiconductor device
08/10/2010US7772333 a epoxy resins containing bisphenol a and bisphenol a, diglycidyl ether endcapped with a primary or secondary amine, including aminoorganotrialkyloxysilanes to incorporate -Si/OR/3 groups, graft reaction between capped hydroxy resin and an ethylenically unsaturated carboxylic anhydride, adding metal
08/10/2010US7772316 High temperature polyamide coating for fasteners
08/05/2010WO2010087526A1 Resin composition
08/05/2010WO2010087393A1 Epoxy resin composition, process for producing the epoxy resin composition, and cured object formed therefrom
08/05/2010WO2010086932A1 One-pack type cyanate-epoxy composite resin composition
08/05/2010WO2010086228A1 Impregnating resin system for insulating materials in switchgear assemblies
08/05/2010US20100197868 Biomimetic compounds and synthetic methods therefor
08/05/2010DE102009028019A1 Härtbare Zusammensetzungen auf Basis von Epoxidharzen und hetero-poly-cyclischen Polyaminen Curable compositions based on epoxy resins and poly-hetero-cyclic polyamines
08/05/2010CA2750970A1 Impregnating resin system for insulating materials in switchgear assemblies
08/04/2010EP2213708A1 Aqueous resin composition for coating, and aqueous coating
08/04/2010EP2212336A2 Copolymers of epoxy compounds and amino silanes
08/04/2010EP1440203B1 BLOCK, NON-(AB)n SILICONE POLYALKYLENEOXIDE COPOLYMERS WITH TERTIARY AMINO LINKS
08/04/2010CN101796132A Epoxy resin composition, prepreg using the epoxy resin composition, metal-clad laminate, and printed wiring board
08/04/2010CN101796106A Insulating sheet and multilayer structure
08/04/2010CN101792606A High-performance thermosetting epoxy asphalt material with wide temperature field and preparation method thereof
08/04/2010CN101792576A Epoxy acrylate prepolymer resin, preparation method thereof and application thereof in bicomponent structural adhesive
08/04/2010CN101792574A Modified epoxy resin composite material of prereacted material of epoxy-terminated silicone oil and preparation method and application thereof
08/04/2010CN101792572A 热固性环氧树脂组合物和半导体器件 The thermosetting epoxy resin composition and a semiconductor device
08/04/2010CN101792521A Latent curing agent
08/04/2010CN101792520A Low-corrosive epoxy resins and production method thereof
07/2010
07/29/2010WO2010084939A1 Resin composition
07/29/2010WO2010084938A1 Resin composition
07/29/2010WO2010084858A1 Surface mounting method for component to be mounted, structure with mounted component obtained by the method, and liquid epoxy resin composition for underfill used in the method
07/29/2010WO2010084804A1 Aluminum chelate type latent hardener and process for producing same
07/29/2010WO2010084802A1 Adamantane compound
07/29/2010WO2010084787A1 Sealing agent for liquid crystal dropping method, which contains photocurable resin and thermosetting resin
07/29/2010WO2010084223A1 Composition and procedure for applying phase change materials (pcms) to natural stone
07/29/2010US20100190955 Poly(oxirane)s and processes and catalysts for making them
07/29/2010US20100187715 Catalyst for curing epoxides
07/28/2010EP2210909A1 Latent curing agent
07/28/2010CN101790552A Epoxy resin composition
07/28/2010CN101787179A Air-drying epoxy vinylit resin and processing technic thereof
07/28/2010CN101787127A Method for preparing epoxy carbon nanotube reinforced bismaleimide resin composite material
07/28/2010CN101787110A Photoelastic plastic material and preparation method
07/28/2010CN101787099A Encapsulant compositions and method for fabricating encapsulant materials
07/28/2010CN101293951B Method for preparing polymer type michler's ketone photoinitiator
07/27/2010US7763700 Epoxy resin curing composition
07/27/2010US7763693 Curable composition
07/22/2010WO2010083192A2 Epoxy resin composition
07/22/2010US20100184923 Epoxy resin composition
07/22/2010DE19800178B4 Gehärtetes Produkt einer Epoxyharzmasse zur Halbleitereinkapselung und dessen Verwendung The cured product of an epoxy resin composition for Halbleitereinkapselung and its use
07/21/2010EP2207827A1 Epoxy resin composition containing isocyanurates for use in electrical laminates
07/21/2010CN101785070A Insulated wire, coil using the same, and motor
07/21/2010CN101784581A Novel resin composition, composite material containing the same and use of the composite material
07/21/2010CN101784580A Thermosetting resin composition and cured product thereof
07/21/2010CN101784579A One-pack type epoxy resin composition and use thereof
07/21/2010CN101784578A Reactive carboxylate compound, active-energy-ray-curable resin composition utilizing the same, and use of the same
07/21/2010CN101784577A Reactive carboxylate compound, curable resin composition using the same, and use of the same
07/21/2010CN101781397A Curing agent for low temperature cure applications
07/20/2010US7758951 fibers are impregnated with a blends containing polyamideimide resin and thermosetting epoxy resin; excellent dimensional stability and heat resistance and the ability to be bent and housed at high density in electronic device packages; excellent adhesion
07/15/2010WO2010080400A1 Metal stabilizers for epoxy resins and advancement process
07/15/2010WO2010079832A1 Process for production of thermoplastic cured epoxy resin with transparency to visible light, and thermoplastic epoxy resin composition
07/15/2010WO2010079831A1 Method for manufacturing semiconductor package, method for encapsulating semiconductor, and solvent-borne semiconductor encapsulating epoxy resin composition
07/15/2010WO2010079672A1 Novolac resin and thermosetting resin composition
07/15/2010US20100179300 Product containing epichlorohydrin, its preparation and its use in various applications
07/15/2010US20100179299 Catalyst for curing epoxides
07/15/2010US20100178505 Fibers and fiber-based superstructures, their preparation and uses thereof
07/14/2010EP2206745A1 Active energy ray-curable composition and method for producing the same
07/14/2010EP2205653A2 Non-sintering isocyanate modified epoxy resin for fusion bonded epoxy applications
07/14/2010EP1689816B1 Curable silicone composition and cured product thereof
07/14/2010CN1768112B Epoxy resin molding material for sealing use and semiconductor device
07/14/2010CN101778882A 环氧树脂组合物 The epoxy resin composition
07/14/2010CN101778881A Electrodeposition coatings for use over aluminum substrates
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