| Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
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| 12/24/2009 | US20090318632 Insulating polymer material composition |
| 12/24/2009 | US20090314532 Thermosetting resin composition, dry film including thermosetting resin composition, and multilayer printed wiring board including thermosetting resin composition |
| 12/23/2009 | EP2135910A1 Photosensitive adhesive composition, film-like adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, semiconductor device and semiconductor device manufacturing method |
| 12/23/2009 | EP2135885A1 Resin composition for forming insulating layer of printed wiring board |
| 12/23/2009 | EP1546227B1 Polyether polyamine agents and mixtures therefor |
| 12/23/2009 | CN101611069A Crystalline resin cured product, crystalline resin composite body and method for producing the same |
| 12/23/2009 | CN101611068A Process for producing photosensitive resin, photosensitive resin obtained by the process, and photosensitive resin composition |
| 12/23/2009 | CN101611067A Novel epoxy resin, epoxy resin composition essentially containing the epoxy resin, and cured product essentially containing the epoxy resin |
| 12/23/2009 | CN101611066A Improved epoxy compositions |
| 12/23/2009 | CN101608053A Thermosetting resin composition |
| 12/23/2009 | CN101608014A Epoxy resin composition containing double-end vinyl benzene radical ether radical crylic (methyl) olefin acid ester activated diluting agent |
| 12/23/2009 | CN100572416C Thermosetting resin composition and use thereof |
| 12/23/2009 | CN100572415C Linetype bisphenol F phenolic epoxy resin and preparation method thereof |
| 12/22/2009 | CA2477296C Polymerization of a reactive diluent in the presence of an epoxy-amine material, and coating compositions prepared thereby |
| 12/22/2009 | CA2312508C Ultraviolet curable resin compositions having enhanced shadow cure properties |
| 12/17/2009 | WO2009152211A2 Initiator system with biphenylene derivates, method of production and use thereof |
| 12/17/2009 | WO2009151957A1 Initiator system containing a diarylakylamine derivative, hardenable composition and use thereof |
| 12/17/2009 | WO2009151095A1 Optically isomeric thin film material and optically isomeric thin film |
| 12/17/2009 | WO2009151050A1 Photosensitive resin composition for hollow package, cured product thereof, multilayer body using the resin composition and microdevice |
| 12/17/2009 | WO2009150769A1 Carboxyl group-containing resin, curable composition containing carboxyl group-containing resin, and cured product of the composition |
| 12/17/2009 | WO2009150219A1 Polyamine having a reduced blushing effect, and use thereof as a curing agent for epoxy resins |
| 12/17/2009 | WO2009150212A1 Water-soluble amine and uses thereof |
| 12/17/2009 | WO2009150059A1 Heat-curing epoxy resin composition comprising an accelerator having heteroatoms |
| 12/17/2009 | US20090312518 Insulating polymer material composition |
| 12/17/2009 | DE102008027558A1 Composition, useful for contacting contact surfaces of chip with contacts of substrate in the flip-chip assembly, comprises monomer formed by polymerization of reactive resin-matrix, lead-line body and flux compatible with matrix |
| 12/17/2009 | CA2727623A1 Polyamine with reduced blushing and use thereof as a curing agent for epoxy resins |
| 12/16/2009 | EP2133381A1 Water soluble amine and its application |
| 12/16/2009 | EP2133380A1 Resin composition |
| 12/16/2009 | EP2133379A1 Epoxy resin composition |
| 12/16/2009 | EP2133378A1 Polyamine with reduced blushing and its application as hardener for epoxy resin |
| 12/16/2009 | EP2133377A1 Insulating polymer material composition |
| 12/16/2009 | EP2133064A1 Initiator system containing a diarylalkylamine derivate, hardenable composition and use thereof |
| 12/16/2009 | EP2133063A1 Initiator system with biphenylene derivates, method of production and use thereof |
| 12/16/2009 | EP1745083B1 Highly-charged stable dental composition which may be cross-linked/polymerised by cationic reaction |
| 12/16/2009 | CN101605832A Film-forming material containing phosphorous |
| 12/16/2009 | CN101602881A Thermosetting resin composition and application |
| 12/16/2009 | CN101602864A Curing agent composition and preparation method thereof |
| 12/16/2009 | CN101602854A Polyamide epoxy hardener and preparation method thereof |
| 12/16/2009 | CN101602824A Photocuring composition and cured product thereof |
| 12/16/2009 | CN100569826C Self-emulsifying type aqueous latex of epoxy hardener, and preparation method |
| 12/16/2009 | CN100569825C Photocurable/thermosetting resin composition and cured product thereof |
| 12/15/2009 | US7632912 Carboxylic acid-modified bisphenol epoxy di(meth)acrylate |
| 12/15/2009 | US7632896 Derivatized novolak polyhydroxystyrene |
| 12/15/2009 | US7632895 Curable resin composition |
| 12/15/2009 | US7632877 Dental resins, dental composite materials, and method of manufacture thereof |
| 12/15/2009 | US7632626 Anti-reflective coating forming composition for lithography containing polymer having ethylenedicarbonyl structure |
| 12/15/2009 | US7632423 Cost effective, functional compounds on the outer surface or inner portion of (sub-)micron inert particles; latent curing agent for thermoset resins; curing; use in microelectronic devices manufacturing, adhesives, protective coatings, encapsulants, or ink jet inks |
| 12/10/2009 | WO2009147938A1 Novel resin composition and use thereof |
| 12/10/2009 | US20090306336 Preparation and Use of Ultrahigh-Molecular-Weight Polycarbonates |
| 12/10/2009 | US20090306335 Multifunctional degradable nanoparticles with control over size and functionalities |
| 12/10/2009 | US20090306295 Materials comprising polydienes and hydrophilic polymers and related methods |
| 12/10/2009 | US20090304956 Use of Polysulphide- Containing Two- Component Adhesives for the Production of Windows |
| 12/09/2009 | CN101600751A Amide or thioester pre-extended epoxy-terminated visosifiers and method for producing the same |
| 12/09/2009 | CN101600738A Silica sol having reactive monomer dispersed therein, method for producing the silica sol, curing composition, and cured article produced from the curing composition |
| 12/09/2009 | CN101597475A Encapsulation material composition and encapsulation material manufacture method |
| 12/09/2009 | CN101597371A High-ductility co-cured resin of cyanate, preparation method and use thereof |
| 12/09/2009 | CN100567436C Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same |
| 12/09/2009 | CN100567353C Coloring resin composition, color filter, and liquid-crystal display |
| 12/08/2009 | CA2538219C Catalysts for low-cure powder coatings and methods for using the same |
| 12/03/2009 | WO2009145779A1 Oligomeric adducts of bismaleimide, diamine, and dithiol |
| 12/03/2009 | WO2009145224A1 Epoxy resin composition for printed wiring board, solder resist composition, resin film, resin sheet, prepreg, metal foil with resin, cover lay, and flexible printed wiring board |
| 12/03/2009 | WO2009145179A1 Resin composition for forming the adhesive layers of a multi-layer flexible printed circuit board |
| 12/03/2009 | WO2009145167A1 Resin composition for optical three-dimensional molding |
| 12/03/2009 | WO2009144955A1 Cured epoxy resin material and epoxy resin adhesive |
| 12/03/2009 | WO2009144954A1 Heat-hardened resin composition and printed wiring board |
| 12/03/2009 | US20090298965 Highly heat-conductive epoxy resin composition |
| 12/03/2009 | US20090298960 Ductile structural foams |
| 12/03/2009 | DE112007002864T5 Isolierende Polymermaterialzusammensetzung Insulating polymer material composition |
| 12/02/2009 | EP2128183A1 Resin composition for optical components, optical component using the same and production method of optical lens |
| 12/02/2009 | EP2128182A1 Heat hardened epoxy resin compound containing a catalyst with heteroatoms |
| 12/02/2009 | EP2125926A1 Amide or thioester pre-extended epoxy-terminated visosifiers and method for producing the same |
| 12/02/2009 | EP2125925A2 Hydroxy ester pre-extended epoxy-terminated viscosifiers and method for producing the same |
| 12/02/2009 | EP2125901A1 Ester pre-extended epoxy-terminated viscosifiers and method for producing the same |
| 12/02/2009 | CN101595152A Latent curing agent |
| 12/02/2009 | CN101595151A Composition for forming gas barrier material, gas barrier material and method for producing the same, and gas barrier packaging material |
| 12/02/2009 | CN101595150A Inkjet printing |
| 12/02/2009 | CN101595134A Ester pre-extended epoxy-terminated viscosifiers and method for producing the same |
| 12/02/2009 | CN101591440A Epoxy resin modified by isocyanate terminated silicon rubber and preparation method thereof |
| 12/02/2009 | CN101591424A Fast epoxy resin curing agent and preparation method thereof |
| 12/02/2009 | CN101591423A Alkaline water-soluble resin as well as photosensitive resin composition using same, cured resin and color filter |
| 12/02/2009 | CN101591422A Method for preparing reactive fluid rubber-epoxide resin polymer |
| 12/02/2009 | CN101591421A Silicon framework hyperbranched epoxy resin, preparation method and high temperature-resisting solvent-free insulated paint consisting of same |
| 12/02/2009 | CN101591313A Modified furfural and furfuralacetone expoxy resin grouting material |
| 12/02/2009 | CN100564423C Epoxy resin composition |
| 12/02/2009 | CN100564422C Epoxy resin catalytic refining process |
| 12/02/2009 | CN100564421C Polymeric epoxy resin composition |
| 12/02/2009 | CN100564417C Preparation method of phenolic resin for producing epoxy resin |
| 12/01/2009 | US7625988 Maintain flexibility |
| 11/26/2009 | WO2009143038A1 Adducts of epoxy resins derived from alkanolamides and a process for preparing the same |
| 11/26/2009 | WO2009143037A1 Epoxy resins derived from non-seed oil based alkanolamides and a process for preparing the same |
| 11/26/2009 | WO2009143036A1 Epoxy resins derived from seed oil based alkanolamides and a process for preparing the same |
| 11/26/2009 | WO2009142901A1 Epoxy resins and processes for preparing the same |
| 11/26/2009 | WO2009142899A1 Thermoset polyurethanes comprising cis, trans-1, 3- and 1, 4-cyclohexanedimethylether groups |
| 11/26/2009 | WO2009142898A1 Adducts of epoxy resins and process for preparing the same |
| 11/26/2009 | WO2009142317A1 Novel epoxy resin, method for producing the same, epoxy resin composition containing the epoxy resin as essential component, and cured product containing the epoxy resin as essential component |
| 11/26/2009 | WO2009142065A1 Epoxy resin composition for encapsulating electronic part |
| 11/26/2009 | WO2009123969A3 Deoxybenzoin-derived anti-flammable polymers |
| 11/25/2009 | EP2123711A1 Thermosetting resin composition having rubbery polymer particle dispersed therein, and process for production thereof |
| 11/25/2009 | EP2123689A1 Curing agents for epoxy resins |
| 11/25/2009 | EP2123688A1 Novel phosphorus-containing epoxy resin, epoxy resin composition essentially containing the epoxy resin, and cured product of the epoxy resin composition |