Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
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06/09/2010 | EP1553992B1 Process for lubricating hypodermic needles with radiation curable silicon material |
06/09/2010 | CN201501147U Novel-material intaglio roller |
06/09/2010 | CN1934158B One-component epoxy resin composition |
06/09/2010 | CN1826361B Curable resin composition |
06/09/2010 | CN101730862A Liquid crystal aligning agent, liquid crystal alignment film, method for producing the same, and liquid crystal display device |
06/09/2010 | CN101724225A Hot-curing epoxy resin compositions that can be used as bodyshell adhesive or structural foam |
06/09/2010 | CN101724224A Composite material of NiMnGa magnetic memorial alloy and epoxide resin and preparation method thereof |
06/09/2010 | CN101724218A Unsaturated resin composition as well as preparation method and a purpose thereof |
06/09/2010 | CN101724137A Method for preparing epoxy resin with biphenyl structure |
06/09/2010 | CN101724136A Novel method for preparing lignosulphonate epoxy resin |
06/09/2010 | CN101723866A Methylene-bis-methylmercapto-N-methylaniline, preparation method and application thereof |
06/09/2010 | CN101225155B Liquid epoxide resin vacuum on-line degaser |
06/09/2010 | CN101198632B Epoxy resin composition and curing product thereof |
06/08/2010 | US7732534 Polymerizing conjugated diene monomer using a lanthanide-based catalyst to form a reactive polymer; and reacting the reactive polymer with a nitro compound; reduced cold flow, improved processability, and reduced hysteresis |
06/03/2010 | WO2010062709A2 Phosphorus-containing silsesquioxane derivatives as flame retardants |
06/03/2010 | WO2010061980A1 Resin composition |
06/03/2010 | WO2010061883A1 Forming agent for gate dielectric of thin film transistor |
06/03/2010 | WO2009058715A3 Non-sintering isocyanate modified epoxy resin for fusion bonded epoxy applications |
06/03/2010 | US20100137468 Dental composition based on silicone crosslinkable by cation process |
06/03/2010 | CA2742392A1 Phosphorus-containing silsesquioxane derivatives as flame retardants |
06/02/2010 | EP2192139A1 Inclusion complex containing epoxy resin composition for semiconductor encapsulation |
06/02/2010 | EP2190900A2 Primer compositions for adhesive bonding systems and coatings |
06/02/2010 | EP2190899A1 Hydroxyl polyester resins for dye ink sublimation |
06/02/2010 | EP1287055B9 Powder compositions for heat sensitive substrates |
06/02/2010 | CN101720336A Resin composition |
06/02/2010 | CN101717557A Hot curing conductive silver slurry for manufacturing radio frequency identification (RFID) tag antenna |
06/02/2010 | CN101717490A Rosin-modified epoxy ester resin and preparation method thereof |
06/02/2010 | CN101717481A Phosphorus-containing phenolic aldehyde and preparation method thereof |
06/02/2010 | CN101717464A Preparation method of carboxyl-terminated liquid fluorine polymer |
06/02/2010 | CN101186743B Ultraviolet light cured copolymer emulsion and preparation method thereof |
06/01/2010 | US7728072 Epichlorohydrin amine polymers used for treating the surface of leather |
05/27/2010 | WO2010058734A1 Aromatic polyamide resin containing phenolic hydroxy group, and use thereof |
05/27/2010 | WO2010058715A1 Resin composition for filling discharge gap, and electrostatic discharge protector |
05/27/2010 | WO2010057922A1 Curable composition comprising a thermolatent base |
05/27/2010 | US20100130717 Biodegradable macromers |
05/27/2010 | US20100130698 Development of a novel cross-linked epoxy resin with flame-retardant properties |
05/27/2010 | DE102009049235A1 Durch Polymerisation härtbare Zusammensetzung, Verfahren zu ihrer Härtung durch Polymerisation und durch Polymerisation gehärtete Harz-Zusammensetzung By polymerizing curable composition, process for their hardening by polymerization and by polymerization cured resin composition |
05/26/2010 | CN1997683B Thermally conductive material for electronic and/or electrical components, and use thereof |
05/26/2010 | CN1980973B Curing agents for epoxy resins |
05/26/2010 | CN1980970B Modified polyimide resin and curable resin composition |
05/26/2010 | CN1891772B Epoxy resin emulsion for water-based coating, and its preparing method |
05/26/2010 | CN1891771B Epoxy curing agent emulsion for water-based epoxy coating, and its preparing method |
05/26/2010 | CN1890286B Thermosetting resin composition, resin sheet and resin sheet for insulated substrate |
05/26/2010 | CN1856521B Latent hardener |
05/26/2010 | CN1621481B Epoxy resin composition for encapsulating optical semiconductor element and optical semiconductor device using the same |
05/26/2010 | CN101712749A Silicon nitride hybridization type epoxy resin curing agent and preparation method and application thereof |
05/26/2010 | CN101712748A Special material of epoxy resin for wind power generation |
05/26/2010 | CN101068845B Composition, cured product and article |
05/26/2010 | CN101014639B Polyaminoamide-monoepoxy adducts |
05/25/2010 | US7723856 Epoxy resin composition for the encapsulation of semiconductors and semiconductor devices |
05/25/2010 | US7723465 Continuously condensation polymerization of polyether alcohols using dimetal cyanide (DMC) catalysts; reacting alkylene oxides; transferring output to a second step in a reactor which is divided by sealed plates into compartments connected by external pipelines; etherification, catalysis |
05/25/2010 | US7723464 polyamines derived from 9,9-dialkyl fluorene diamine; radiation shields; photovoltaic devices; light emitting diodes |
05/25/2010 | US7722949 Adhesive composition and adhesive film therefrom |
05/25/2010 | CA2376457C Epoxy resin hardener compositions |
05/25/2010 | CA2248303C Perfluorinated amide salts and their uses as ionic conducting materials |
05/20/2010 | WO2010057145A1 X-ray opaque coating |
05/20/2010 | WO2010055811A1 Thermosetting resin composition and prepreg utilizing same |
05/20/2010 | WO2010054989A2 Anti-slip coating |
05/20/2010 | WO2009126393A3 Epoxy resin compositions having improved low temperature cure properties and processes and intermediates for making the same |
05/20/2010 | US20100125123 Metallized nanostructured chemicals as cure promoters |
05/20/2010 | US20100125109 Use of Nanoporous Polymer Foams as Filter Materials |
05/20/2010 | US20100124863 Gelator Stabilized Crystalline Resins |
05/19/2010 | EP2186844A1 Heat-curable resin composition |
05/19/2010 | EP2186843A1 Use of nano-porous polymer foams as filter materials |
05/19/2010 | EP2186842A1 Use of nano-porous polymer foams as heat insulating materials |
05/19/2010 | EP2186799A1 Aromatic sulfonium salt compound |
05/19/2010 | EP2185621A1 Curable resin composition for molded bodies, molded body, and production method thereof |
05/19/2010 | CN1970599B SU-8 epoxy resin separation method |
05/19/2010 | CN101711262A Isocyanate-epoxy formulations for improved cure control |
05/19/2010 | CN101225156B Epoxide resin curing agent, epoxide resin embedding glue and confecting method thereof |
05/19/2010 | CN101157751B Aqueous epoxy resin and preparation method and method for preparing varnish by using aqueous epoxy resin |
05/19/2010 | CN101012301B Epoxy acrylic resin and preparing method thereof |
05/18/2010 | US7718749 Curable composition |
05/18/2010 | US7718741 Epoxy resin composition and cured article thereof, novel epoxy resin and production method thereof, and novel phenol resin |
05/15/2010 | CA2685637A1 Use of nanoporous polymer foams as thermal insulation materials |
05/14/2010 | WO2010053207A1 Photosensitive resin composition, photosensitive adhesive film, and light-receiving device |
05/14/2010 | WO2010053078A1 Uv-curable resin compositions for optical discs and cured products thereof |
05/14/2010 | WO2010052877A1 Phenolic resin mixture, epoxy resin mixture, epoxy resin composition, and cured article |
05/14/2010 | WO2010052823A1 Curing accelerator for epoxy resin composition and one-pack type thermosetting epoxy resin composition |
05/14/2010 | WO2010020401A3 Curable polymer mixtures |
05/13/2010 | US20100120996 Method for producing crystalline polyoxyalkylene polyol, and resin obtained by using the same as raw material |
05/13/2010 | US20100120936 Thermally curable precursor of a toughened thermo-expanded film and a film made thereof |
05/13/2010 | US20100117027 Polymerizable liquid crystal composition |
05/12/2010 | CN1977018B Viscous chemical anchoring adhesive |
05/12/2010 | CN1938355B Coating composition based on modified epoxy resins |
05/12/2010 | CN1929850B Purified polyoxypropylene/polyoxyethylene copolymers and method of preparing the same |
05/12/2010 | CN1550895B Negative type photosensitive resin composition containing a phenol-biphenylene resin |
05/12/2010 | CN101706639A Radiation curable resin composition and rapid prototyping process using the same |
05/12/2010 | CN101704990A Method for preparing clay for wind turbine blade mould |
05/12/2010 | CN101704989A Fluorine-containing imine matrix resin used for advanced composite material and preparation method thereof |
05/12/2010 | CN101704836A Silicon-containing epoxy monomer and application thereof |
05/12/2010 | CN101704711A Method for preparing 1,2-diol compound by using catalytic hydration of epoxide |
05/12/2010 | CN101098930B Curable composition |
05/11/2010 | US7714033 Photosensitive insulating resin composition, cured product thereof and electronic component comprising the same |
05/11/2010 | US7714032 Thiol compound and photosensitive composition using the same |
05/11/2010 | US7713621 Prepreg and laminate of epoxy resin, styrene-maleic anhydride copolymer and bis-maleimidetriazine |
05/11/2010 | CA2532282C Method for preparing and processing a sample for intensive analysis |
05/11/2010 | CA2439340C Reactive non-isocyanate coating compositions |
05/11/2010 | CA2331162C Curable two-component mortar composition and its use |
05/11/2010 | CA2248244C Heterocyclic aromatic anion salts, and their uses as ionic conducting materials |