| Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
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| 02/10/2010 | CN101643540A Alkylated polyalkylene polyamines and uses thereof |
| 02/10/2010 | CN101643539A Alkylated aminopropylated methylene-di-(cyclohexylamine) and uses thereof |
| 02/10/2010 | CN101643538A Benzylated aminopropylated ethylenediamines and uses thereof |
| 02/10/2010 | CN101643537A Alkylated aminopropylated ethylenediamines and uses thereof |
| 02/04/2010 | WO2010013741A1 Epoxy resin composition, prepreg, cured body, sheet-like molded body, laminate and multilayer laminate |
| 02/04/2010 | WO2010013740A1 Resin composition for fuel cell separator, process for producing same, and fuel cell separator |
| 02/04/2010 | WO2010013638A1 Epoxy resin curing agent, epoxy resin composition, hardened material thereof, and optical semiconductor device |
| 02/04/2010 | WO2010013407A1 Optical semiconductor sealing resin composition and optical semiconductor device using same |
| 02/04/2010 | WO2010013406A1 Resin composition for semiconductor encapsulation and semiconductor device using the same |
| 02/04/2010 | CA2719911A1 Resin composition for fuel cell separator, process for producing same, and fuel cell separator |
| 02/03/2010 | EP2149586A1 Amine epoxy resin curing agent, gas barrier epoxy resin composition comprising the curing agent, coating agent, and adhesive agent for laminate |
| 02/03/2010 | EP2148894A1 Flame retardant composition |
| 02/03/2010 | CN101641388A Semiconductor sealing resin composition and semiconductor device using the resin composition |
| 02/03/2010 | CN101638474A Maleated rosin acyl imino amines epoxy hardener for powder coating and preparation method thereof |
| 02/03/2010 | CN101638473A Crylic acid rosin epoxy resin, curing method and application thereof |
| 02/03/2010 | CN100587002C Curing resin composition, adhesive epoxy resin paste, adhesive epoxy resin sheet, conductive connection paste, conductive connection sheet, and electronic component joined body |
| 02/03/2010 | CN100586980C Non-flow joint-filling composition |
| 02/03/2010 | CN100586935C 1-imidazolylmethyl-substituted-2-naphtols and their use as accelerators for low-temperature curing |
| 02/02/2010 | US7655871 High heat resistance; low thermal expansion; noncracking ; fireproofing; blend of cyanate resin, epoxy resin, phenoxy resin with imidazole compound and filler; halogen-free |
| 02/02/2010 | US7655819 Microbiocidal compounds and polymers based on 2-bromo-2-nitropropane-1,3-diol; end groups and couplers for polyether homo- and copolymers; paintsadditive being nonleaching and solar radiation resistance; approved <0.1% for use in cosmetics, baby wipes; polyurethanes, -esters,-siloxanes etc. |
| 02/02/2010 | US7655709 Aqueous self-adhesive coating for electrical steel and its uses |
| 02/02/2010 | US7655174 Combination of high viscosity and slower acting low viscosity resins, curable toughener, initiator and stabilizer; rapid homogeneous droplet merging and curing; tensile strength, ductility; computer controlled piezoelectric printing of three dimensional multilayer articles |
| 01/28/2010 | WO2010011710A2 Two-part epoxy-based structural adhesives |
| 01/28/2010 | WO2010010713A1 Composition, polymerizable composition, resin, optical component, and production method of composition |
| 01/28/2010 | US20100022745 One component resin composition curable with combination of light and heat and use of the same |
| 01/28/2010 | US20100021648 Coating composition for optical member, manufacturing method thereof, and manufacturing of optical member |
| 01/28/2010 | CA2730744A1 Process for preparing moldings using mixtures of amines with guanidine derivatives |
| 01/27/2010 | EP2147942A1 Epoxy resin composition for optical semiconductor device encapsulation, cured body thereof, and optical semiconductor device using the epoxy resin composition |
| 01/27/2010 | EP2147937A1 Photo- and/or thermo-curable copolymer, curable resin compositions, and cured articles |
| 01/27/2010 | EP2147034A1 Epoxy thermoset compositions comprising excess epoxy resin and process for the preparation thereof |
| 01/27/2010 | EP1668054B1 Catalysts for low-cure powder coatings and methods for using the same |
| 01/27/2010 | EP1572814B1 Uv-curable epoxy acrylates |
| 01/27/2010 | CN101633771A Corrosion resistant films based on ethylenically unsaturated monomer modified epoxy emulsions |
| 01/27/2010 | CN101633724A Epoxy resin composition |
| 01/27/2010 | CN101633723A Production method for brominated epoxy resin and produced brominated epoxy resin |
| 01/27/2010 | CN100584872C Latent curing agent and composition |
| 01/27/2010 | CN100584301C Teeth repairing material of visible-light curing composite nano-resin and its production |
| 01/26/2010 | US7652104 Semiconductor encapsulating materials and adhesives; heat resistance and reduced internal stress |
| 01/26/2010 | US7652079 Polybutylene terephthalate resin composition for vibration welding |
| 01/21/2010 | WO2010008035A1 Phosphorus-containing epoxy resin using phosphorus-containing phenol compound produced by specific production process, phosphorus-containing epoxy resin composition using the resin, and cured product |
| 01/21/2010 | WO2010007156A1 Adhesion promoter compounds for oiled steel |
| 01/21/2010 | US20100016473 Crystalline resin cured product, crystalline resin composite material, and method for producing the same |
| 01/21/2010 | US20100015551 Novel epoxy compound, alkali-developable resin composition, and alkali-developable photosensitive resin composition |
| 01/20/2010 | EP2145908A1 Adhesive compounds for oiled steel |
| 01/20/2010 | EP2145880A1 Novel epoxy compound, alkali-developable resin composition, and alkali-developable photosensitive resin composition |
| 01/20/2010 | EP2144953A1 Cross-linked silicone particles and method of manufacturing thereof |
| 01/20/2010 | EP1441008B1 Curable epoxy resin compositions and process for production thereof |
| 01/20/2010 | EP1095938B1 Oxetane compounds, oxetane copolymer, and process for producing oxetane compounds |
| 01/20/2010 | CN100583418C Adhesives and electric devices |
| 01/19/2010 | US7649060 Benzoxazines, adducts of hydroxy-containing compounds, isocyanate compounds, phenolic compounds, epoxy resin, and polyether sulfone toughener; towpregs, adhesive films |
| 01/19/2010 | US7648767 Material composition for nano- and micro-lithography |
| 01/19/2010 | CA2134596C Improved double metal cyanide complex catalysts |
| 01/14/2010 | WO2010004753A1 Film in which refractive index modulation is recorded |
| 01/14/2010 | WO2010004189A2 Coating composition for the storage of waste that is toxic to health and/or the environment, which is free from an aromatic amine curing agent |
| 01/14/2010 | WO2009000773A8 Manufacture of dichloropropanol |
| 01/14/2010 | US20100009290 Photosensitive Polybenzoxazines and Methods of Making the Same |
| 01/14/2010 | US20100009201 thermosetting resins; butadiene-methacrylate core shell particles; high performance; dielectrics; fireproofing |
| 01/14/2010 | US20100007708 Actinic ray curable composition, actinic ray curable ink, image formation method employing it, and ink-jet recording apparatus |
| 01/14/2010 | CA2726062A1 Coating composition for the storage of waste that is toxic to health and/or the environment, which is free from an aromatic amine curing agent |
| 01/13/2010 | EP2143718A1 Process for producing tetraglycidylamino compound |
| 01/13/2010 | EP1179571B1 Curable resin compositions |
| 01/13/2010 | CN101624440A Intermediate temperature latent thermal curing agents for epoxy resin |
| 01/13/2010 | CN101624439A Synthesizing method for flame retardant type glycolylurea epoxide resin |
| 01/12/2010 | US7646088 Adhesive sheet for light-emitting diode device and light-emitting diode device |
| 01/12/2010 | US7645514 Curing resin composition, adhesive epoxy resin paste, adhesive epoxy resin sheet, conductive connection paste, conductive connection sheet, and electronic component joined body |
| 01/07/2010 | WO2010002539A1 Process for continuous production of epoxy resins |
| 01/07/2010 | WO2010002538A1 Process for continuous production of epoxy resins |
| 01/07/2010 | WO2010002498A1 Process for continuous production of epoxy resins |
| 01/07/2010 | WO2010002008A1 Epoxy resin composition |
| 01/07/2010 | WO2010001992A1 Modified resin composition, method for producing the same, and curable resin composition containing the same |
| 01/07/2010 | WO2010001919A1 Photosensitive resin composition for mems and cured product thereof |
| 01/07/2010 | US20100004389 For example, 1,3-bis(glycidyl)imidazolium trifluoromethanesulfonimide; curing with 1,3-bis(3-aminophenoxy)benzene ; adhesives, coatings, composites; high tensile and adhesive strengths at extremely low temperatures and are stable at elevated temperatures; use in harsh environments such as aerospace |
| 01/07/2010 | US20100004373 Compositions and processes for producing durable hydrophobic and/or olephobic surfaces |
| 01/07/2010 | US20100003513 Adhesive bonding sheet, semiconductor device using the same, and method for manufacturing such semiconductor device |
| 01/07/2010 | US20100003512 Adhesive bonding sheet, semiconductor device using same, and method for manufacturing such semiconductor device |
| 01/06/2010 | EP2141186A1 Resin composition for optical waveguide, and optical waveguide produced by employing the resin composition |
| 01/06/2010 | EP1683816B1 Polyacrylic hydrazide and crosslinking or curing agent for resin |
| 01/06/2010 | EP1403287B1 Process for producing epoxidized diene polymer |
| 01/06/2010 | EP1287055B1 Powder compositions for heat sensitive substrates |
| 01/06/2010 | CN100577707C Method for manufacturing novel environment-protection epoxy resin |
| 01/05/2010 | CA2428255C Onium salts and the use therof as latent acids |
| 12/31/2009 | US20090326189 Process for continuous production of epoxy resins |
| 12/31/2009 | US20090325079 Data storage medium comprising colloidal metal and preparation process thereof |
| 12/30/2009 | WO2009157295A1 Epoxy resin composition and prepreg using same |
| 12/30/2009 | WO2009157147A1 One-liquid type cyanate epoxy composite resin composition |
| 12/30/2009 | EP2138522A1 Resin composition, and prepreg |
| 12/30/2009 | EP2138521A1 Epoxy composition |
| 12/30/2009 | EP2084200B1 Derivatized solid epoxy resin and uses thereof |
| 12/30/2009 | EP1887031B1 White prepreg, white laminated plate, and metal foil clad white laminated plate |
| 12/30/2009 | CN101616949A Epoxy resin composition, prepreg, laminates and printed wiring boards |
| 12/30/2009 | CN101616948A Hybrid cationic curable coatings |
| 12/30/2009 | CN101613461A Method for preparing fluorine-containing epoxy resin by phase transfer catalyst |
| 12/30/2009 | CN101613460A Waterborne epoxy curing agent, waterborne epoxy film-forming agent and preparation method thereof |
| 12/30/2009 | CN101613459A Cyanate resin composition and application for preparing high modulus carbon fiber prepreg by hot-melt method thereof |
| 12/30/2009 | CN101613458A Method for preparing bisphenol-A liquid epoxy resin |
| 12/30/2009 | CN100576069C Radiation curable resin composition and rapid prototyping process using the same |
| 12/30/2009 | CN100575413C Modified epoxy resin composition |
| 12/30/2009 | CN100575384C Accelerator systems for low-temperature curing |
| 12/30/2009 | CN100575383C Epoxy resin composition and semiconductor device |
| 12/29/2009 | CA2540523C Low-cure powder coatings and methods for using the same |