Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
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03/24/2010 | CN101681648A Ultraviolet-curable composition for optical disk and optical disk |
03/24/2010 | CN101679828A heat-resistant structural epoxy resins |
03/24/2010 | CN101679613A Sealing agent for optical semiconductor element, and optical semiconductor element |
03/24/2010 | CN101679612A Resin composition for interlayer insulation of multilayer printed wiring board |
03/24/2010 | CN101679611A Amine epoxy resin curing agent, gas barrier epoxy resin composition comprising the curing agent, coating agent, and adhesive agent for laminate |
03/24/2010 | CN101679610A Process for preparing composites using epoxy resin compositions |
03/24/2010 | CN101679609A Epoxy resin composition, prepreg, and fiber-reinforced composite material |
03/24/2010 | CN101679608A One-pack type cyanate/epoxy composite resin composition |
03/24/2010 | CN101679607A Catalyst for curing epoxides |
03/24/2010 | CN101679606A Composite material with blend of thermoplastic particles |
03/24/2010 | CN101679605A Pre-impregnated composite materials with improved performance |
03/24/2010 | CN101679604A Transparent composite sheet |
03/24/2010 | CN101679603A Epoxy thermoset compositions comprising excess epoxy resin and process for the preparation thereof |
03/24/2010 | CN101679602A Novel flame-retardant epoxy resin, epoxy resin composition essentially containing the epoxy resin, and cured product thereof |
03/24/2010 | CN101679601A Novel phosphorus-containing epoxy resin, epoxy resin composition essentially containing the epoxy resin, and cured product of the epoxy resin composition |
03/24/2010 | CN101679600A Liquid epoxy resin, epoxy resin composition, and cured product |
03/24/2010 | CN101679599A catalyst for curing epoxides |
03/24/2010 | CN101679162A Manufacture of dichloropropanol |
03/24/2010 | CN101676317A Application of cardanol in epoxy resin curing |
03/24/2010 | CN101676316A Method for preparing cashew shell oil water-based epoxy resin curing agent |
03/24/2010 | CN101676315A Sealant for liquid crystal instillation technique and method for manufacturing liquid crystal dispaly |
03/23/2010 | US7683154 Epoxy/novolak curing agent comprising an adduct obtainable by reaction of an ethylene diamine and a phenyl monoglycidyl ether mixed with an amine havingan active hydrogen; lower viscosity; rheology; coatings; adhesives; moldingmaterials; castings; industrial scale |
03/23/2010 | US7683153 Epoxy resin with dibasic acid (methyl ester)/ethyleneurea modifier |
03/23/2010 | US7683152 Reducing the modulus of elasticity is by incorporating siloxane linkages into the polyimide resin structure to absorb stressendured by semiconductor packaging; high-temperature heat resistance; moisture-proofing; adhesion protective film; polysiloxanes having aminoalkylsilanol end groups |
03/18/2010 | WO2010029855A1 Soluble imide-skeleton resin, soluble imide-skeleton resin solution composition, curable resin composition, and cured product of same |
03/18/2010 | WO2010029153A1 Process for purifying hydrogen chloride |
03/18/2010 | WO2008152011A9 Catalyst for curing epoxides |
03/18/2010 | US20100065878 Adhesive sheet for light-emitting diode device and light-emitting diode device |
03/17/2010 | EP2163950A1 Toner comprising epoxidized polyester and method of manufacture |
03/17/2010 | EP2162481A1 Process for preparing composites using epoxy resin compositions |
03/17/2010 | CN101675090A Adamantane derivative, method for producing the same, resin composition containing the adamantane derivative and use thereof |
03/17/2010 | CN101671426A Epoxy resin composition used for shielding deep well submersible pump and casting method thereof |
03/17/2010 | CN101671318A Cycloaliphatic epoxy resin and preparation method thereof |
03/16/2010 | US7678860 e.g.block copolymer of methoxypolyethylene glycol mono (meth)acrylate with monomers selected from unsaturated ether, alcohol, ester, nitrile, carboxy, anhydride etc.; excellent in thermal properties, physical properties and ion conductivity |
03/11/2010 | WO2010027906A1 Adhesive composition |
03/11/2010 | WO2010026960A1 Insulating polymer material composition |
03/11/2010 | WO2010026777A1 Heat-cured epoxy resin composition |
03/11/2010 | WO2010026714A1 Siloxane compound, curable resin composition, cured object obtained therefrom, and photosemiconductor element |
03/11/2010 | US20100063209 Degradable thiol-ene polymers |
03/10/2010 | EP2161292A1 Epoxy resin composition |
03/10/2010 | EP1754734B1 Curing agent for epoxy resins and epoxy resin compositions |
03/10/2010 | EP1527147B1 Two part epoxide adhesive with improved strength |
03/10/2010 | CN101665562A Preparation method of POSS-epoxy hybrid material with controllable phase structure |
03/09/2010 | US7675185 contains mesophase pitch; cyclic phosphazenes; for semiconductors with narrow distances between pads or wires |
03/09/2010 | US7674874 Film forming; coating on metal substrate by electrodeposition of a resin; curing |
03/09/2010 | CA2365922C Composition for coating having a gas barrier property, coating and coated film having a gas barrier property using the same |
03/04/2010 | WO2010024166A1 Magnetic sheet composition, magnetic sheet, and process for producing magnetic sheet |
03/04/2010 | WO2010023918A1 Epoxy resin composition and prepreg using same, fiber-reinforced composite resin tubular body manufactured from the prepreg and manufacturing method therefor, and fiber-reinforced composite resin molded body |
03/04/2010 | US20100056747 Epoxy resin composition and cured article thereof, novel epoxy resin and production method thereof, and novel phenol resin |
03/04/2010 | US20100056303 Golf ball material, golf ball and method for preparing golf ball material |
03/03/2010 | EP2159242A1 Sealing agent for optical semiconductor element, and optical semiconductor element |
03/03/2010 | EP2158251A1 Catalyst for curing epoxides |
03/03/2010 | EP2158250A1 Catalyst for curing epoxides |
03/03/2010 | EP2158249A1 Catalyst for curing epoxides |
03/03/2010 | EP2158248A1 Catalyst for curing epoxides |
03/03/2010 | EP1731554B1 Prepreg, metal-clad laminate and printed circuit board using same |
03/03/2010 | CN101663344A Curable epoxy resin composition |
03/03/2010 | CN101659741A Epoxy resin toughening curing agent and preparation method thereof |
03/03/2010 | CN101659740A Self-crosslinking sulfonate-base epoxy ester aqueous dispersion and anti-corrosive primer thereof |
03/02/2010 | US7671170 Film-forming material containing phosphorous |
03/02/2010 | US7671146 polymerization catalysts; improved flame resistance, flowability and solder-reflow resistance; lead-free solder; integrated circuits |
03/02/2010 | US7671145 polymerization catalysts; sealants, coatings, and adhesives used in aviation and aerospace with improved flexibility, fuel resistance, and high-temperature resistance |
03/02/2010 | US7670500 Reaction product of polyamine, acyclic carbonate and cyclic carbonate |
03/02/2010 | US7670499 curing agent for epoxy resins; for bridging cracks in a substrate; low temperature crosslinking; good adhesion to the substrate, good resistance to chemicals and resilience |
02/25/2010 | US20100048828 Ester pre-extended epoxy-terminated viscosifiers and method for producing the same |
02/25/2010 | US20100048826 Polyphenylene ether oligomer compound, derivatives thereof and use thereof |
02/25/2010 | US20100047559 Core-shell particles and their use in toughening polymer composites |
02/24/2010 | EP2157614A1 Gate insulating film forming agent for thin-film transistor |
02/24/2010 | EP2157113A2 Alkylated aminopropylated ethylenediamines and uses thereof |
02/24/2010 | EP2157112A2 Alkylated polyalkylene polyamines and uses thereof |
02/24/2010 | EP2157079A1 Alkylated 4-aminobenzyl-4-aminocyclohexane |
02/24/2010 | EP2155829A1 Electrodeposition baths containing a mixture of boron-containing compounds and chlorhexidine |
02/24/2010 | EP2155828A1 Electrodeposition baths containing a mixture of boron-containing compounds and chlorhexidine |
02/24/2010 | CN101654509A Preparation method of epoxy silsesquioxane/epoxy resin hybrid material for packaging large-power LED |
02/23/2010 | US7666955 Methods for producing branched-polyether resin composition and acid pendant branched-polyether resin composition |
02/23/2010 | US7666954 Epoxy resin amine curing agent of N,N′-dimethyl secondary diamine polymer |
02/23/2010 | US7666953 Phosphine-protonated haloaromatic compound accelerator with curing resin and curing agent |
02/23/2010 | US7666952 Powder coating of polyepoxide and polyisocyanate-amine reaction product |
02/23/2010 | US7666945 Electrodepositable; reaction product of a secondary monoamine and maleimide such as Polyphenylmethane maleimide and dibutylamine, and a crosslinking film forming polymer; dielectric and thermal stability properties for electronic circuits |
02/23/2010 | CA2469820C Adhesive of epoxy compound, aliphatic amine and tertiary amine |
02/18/2010 | WO2010018829A1 Unsaturated ester resin composition, unsaturated ester-cured product, and manufacturing method therefor |
02/18/2010 | WO2010018392A2 Novel curing agents and process for their manufacture |
02/18/2010 | WO2010018008A1 Thermosetting composition |
02/18/2010 | WO2008114858A8 Resin composition for forming insulating layer of printed wiring board |
02/17/2010 | EP2154171A1 Epoxy resin composition, prepreg, and fiber-reinforced composite material |
02/17/2010 | EP2154170A1 Thermosetting epoxy resin compositions and use thereof |
02/17/2010 | EP2154169A1 Transparent composite sheet |
02/17/2010 | EP2152773A1 Isocyanate-epoxy formulations for improved cure control |
02/17/2010 | EP1957554B1 Low-temperature impact resistant thermosetting epoxide resin compositions with solid epoxide resins |
02/17/2010 | CN101652401A Epoxy resin composition, prepreg, laminate, multilayer printed wiring board, semiconductor device, insulating resin sheet, and method for manufacturing multilayer printed wiring board |
02/17/2010 | CN101649041A Method for preparing self-emulsifying aqueous epoxy resin curing agent |
02/17/2010 | CN100590142C Nanoporous laminates |
02/16/2010 | USRE41128 Comprise polymer (e.g., epoxy cresol novolac resins) bonded with chromophore (4-hydroxybenzoic acid, trimellitic anhydride); compositions can be applied to substrates (e.g., silicon wafers) to form anti-reflective coating layers having high etch rates which prevent reflection during photoresist exposure |
02/11/2010 | WO2010016987A1 Production of solid epoxy resin |
02/11/2010 | US20100036060 Electrolyte compositions |
02/10/2010 | EP2151463A2 Alkylated aminopropylated methylene-di-(cyclohexylamine) and uses thereof |
02/10/2010 | EP2151462A2 Benzylated aminopropylated ethylenediamines and uses thereof |
02/10/2010 | EP2151461A2 Benzylated polyalkylene polyamines and uses thereof |
02/10/2010 | EP2151460A1 Resin composition for encapsulating optical semiconductor element |
02/10/2010 | EP2150542A2 Sensitizer for cationic photoinitiators |