Patents
Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286)
05/2010
05/06/2010WO2010051522A1 Solar cells modules comprising low haze encapsulants
05/06/2010WO2010050272A1 Photosensitive resin composition and method for producing photosensitive resin used therein
05/06/2010WO2010011710A3 Two-part epoxy-based structural adhesives
05/06/2010WO2010004189A3 Coating composition for the storage of waste that is toxic to health and/or the environment, which is free from an aromatic amine curing agent
05/06/2010US20100113690 Process for preparing water-soluble polyhydroxyaminoether
05/06/2010US20100113678 Fluorine-containing novolac resin, fluorine-containing surfactant, fluorine-containing surfactant composition, and resin composition
05/06/2010US20100113643 Curatives for epoxy adhesive compositions
05/06/2010US20100113639 Metal compounds for use as initiators
05/06/2010US20100108364 Flame retardant compositions
05/05/2010EP2182019A1 Heat curable resin compositon
05/05/2010CN1962713B Fluorine-containing phenol resin derivative and its composition and preparation method
05/05/2010CN101701099A Epoxy resin film for resin film melt impregnating process and preparation method thereof
05/05/2010CN101701059A Preparation method of cationic terpenyl epoxy resin polyalcohol water dispersoid and application thereof
05/05/2010CN101701058A Epoxy resin containing melamine-organic silicon hybrid structure and preparation method and application thereof
05/05/2010CN101700401A Polyalkylene glycol with moiety for conjugating biologicallyactive compound
05/04/2010US7709598 Fluorinated alkyl fluorophoshoric acid salts of onium and transition metal complex
05/04/2010US7709582 Epoxy resin composition for fiber reinforced composite material, a production method for fiber reinforced composite material, and a fiber reinforced composite material
05/04/2010US7709579 Benzoxazine-based; for application to aerospace industry; resin transfer molding, vacuum assisted transfer molding and resin film infusion
05/04/2010US7709553 Photo cation polymerizable resin composition and surface protective material for optical disk
05/04/2010US7709548 Method for manufacturing monosulfonium salt, cationic polymerization initiator, curable composition, and cured product
05/04/2010US7709085 Thermosetting resin composition, resin sheet and resin sheet for insulated substrate
05/04/2010US7709083 Gelator-stabilized crystalline resins
04/2010
04/29/2010WO2010047271A1 Polyamide resin and composition thereof
04/29/2010WO2010047244A1 Epoxy compound and manufacturing method thereof
04/29/2010WO2010047169A1 Curable resin composition and cured product thereof, printed circuit board, and epoxy resin and method for producing same
04/29/2010US20100105856 Epoxy resin compositions and process for preparing them
04/29/2010US20100105792 Radiation-curing binders and a process for their preparation
04/29/2010US20100104794 Thermosetting epoxy resin composition and semiconductor device
04/29/2010CA2707897A1 Epoxy compound and method for producing the same
04/28/2010EP2180012A1 Curable epoxy resin and dicyandiamide solution
04/28/2010EP2178942A1 Electrodeposition coatings for use over aluminum substrates
04/28/2010CN1989166B Epoxy resin composition for prepreg, prepreg, and multilayered printed wiring board
04/28/2010CN1867631B Electric conductor provided with an adherent layer and method for the production of said electric conductor
04/28/2010CN1816580B Epoxy resin, process for producing the same, epoxy resin composition containing the same, and cured object
04/28/2010CN1735654B Flame-retardant for engineering thermoplastic applications
04/28/2010CN101698741A Synthetic resin composite for pouring low-voltage bus bar
04/28/2010CN101698740A Synthetic resin composite for pouring middle-voltage bus bar
04/28/2010CN101698739A Carbon fiber composite core composition and method for preparing carbon fiber composite core
04/28/2010CN101698701A Fluorine-containing phosphine-nitrile epoxy resins and preparation method thereof
04/28/2010CN101698700A Silicon, nitrogen and phosphor coordinate antiflaming epoxide resin
04/27/2010US7705105 Compound having silsequioxane skeleton and its polymer
04/27/2010US7704559 Epoxy resins with improved elasticity
04/27/2010US7704424 Method of making models
04/22/2010US20100099821 Blend of polyamide such as nylon-6 and a maleic anhydride modified ethylene-alpha-olefin copolymer, said anhydride group reacts with the polyamide to improve tensile elongation at break
04/21/2010EP2177956A1 Composition for holographic recording medium
04/21/2010EP2176313A1 High solids epoxy coating composition
04/21/2010EP1256032B1 Liquid, radiation-curable composition, especially for stereolithography
04/21/2010CN1732199B Curable resin composition and products of curing thereof
04/21/2010CN101696316A Method for preparing radiation protection materials
04/21/2010CN101696303A Novel compatibilized polypropylene/glass fiber composite material and preparation method thereof
04/21/2010CN101696273A Polymerizable composition
04/21/2010CN101696264A Epoxy resin sealing material and method for preparing same
04/21/2010CN101696263A Epoxy resin curing agent, method for preparing same and application thereof
04/21/2010CN101205290B Isocyanate modified epoxy acrylic ester and preparation thereof
04/21/2010CN101173036B Method for producing aquosity cashew shell liquid solidifying agent
04/21/2010CN101173033B Method for producing expediting setting type aquosity ultraviolet light solidifying composition
04/15/2010WO2010042369A1 Epoxy resins and composite materials with improved burn properties
04/15/2010WO2010041670A1 Diolefin compound, epoxy resin, curable resin composition and cured product
04/15/2010US20100093947 Adamantane derivative, method for producing the same, resin composition containing the adamantane derivative and use thereof
04/15/2010US20100092691 combination of high viscosity and slower acting low viscosity resins, curable toughener, initiator and stabilizer; rapid homogeneous droplet merging and curing; tensile strength, ductility; computer controlled piezoelectric printing of three dimensional multilayer articles
04/14/2010EP2175320A1 Alkali-developable photosensitive resin composition and -diketone compound
04/14/2010EP2174969A1 Resin composition
04/14/2010EP1647052B1 Underfill and mold compounds including siloxane-based aromatic diamines
04/14/2010CN101693760A Polyacrylic acid lead base epoxy resin radiation protection composite material and preparation method thereof
04/13/2010US7695806 solvent-free mixture of epoxy resin, hardener for epoxy resin( phenol novolaks and cresol novolaks), microgel which is reaction product of unsaturated carboxylic acid ( acrylic acid ) and base ( 2-ethyl-imidazole), and electroconductive filler like graphite; biopolar plates
04/08/2010WO2010038767A1 Photocurable composition and cured product
04/08/2010WO2010038733A1 Resin composition for adhesive agent, adhesive agent and adhesive sheet each comprising same, and laminate for print circuit board adhered by using same
04/08/2010WO2010038673A1 Coating agent, substrate for mounting optical semiconductor element using same, and optical semiconductor device
04/08/2010WO2010038431A1 Liquid crystal sealing agent, liquid crystal display panel using same, method for producing the liquid crystal display panel, and liquid crystal display device
04/08/2010US20100087618 Linear (meth)acryloyl-containing compound, star (meth) acryloyl- containing compound, and method of manufacture
04/08/2010US20100087588 Hydroxy Ester Pre-Extended Epoxy-Terminated Viscosifiers and Method for Producing the Same
04/07/2010EP2170793A1 Manufacture of dichloropropanol
04/07/2010CN101691419A Hyperbranched polymer surface grafted and modified inorganic nanoparticle/epoxy resin anti-friction wear-resistant composite material and preparation method thereof
04/07/2010CN101215369B Optical cured resin, photosensitive resin composition and preparation method thereof
04/06/2010US7691946 Soy-based thermosensitive hydrogels for controlled release systems
04/06/2010US7691920 Ink jet of functionalized waxes
04/01/2010WO2010035459A1 Episulfide compound, episulfide compound-containing mixture, method for producing episulfide compound-containing mixture, curable composition and connection structure
04/01/2010WO2010035452A1 Resin composition, cured body and multilayer body
04/01/2010WO2010035451A1 Semi-cured body, cured body, multilayer body, method for producing semi-cured body, and method for producing cured body
04/01/2010WO2010034531A1 Photocurable composition
04/01/2010WO2009152211A3 Initiator system with biphenylene derivates, method of production and use thereof
04/01/2010US20100080998 Epoxy resin composition, and cured material, semi-cured material, prepreg and composite substrate using the epoxy resin composition
04/01/2010US20100080997 Epoxy prepolymer, and epoxy resin composition, cured material, semi-cured material, prepreg and composite substrate using the epoxy prepolymer
04/01/2010CA2734404A1 Photocurable composition
03/2010
03/31/2010EP2168994A1 Photocurable composition
03/31/2010CN101688051A Epoxy resin-forming liquid preparation containing inorganic particle
03/31/2010CN101687981A Resin composition and copper foil with resin obtained by using the resin composition
03/31/2010CN101687980A Heat curable resin compositon
03/31/2010CN101687979A Resin composition
03/31/2010CN101687978A Epoxy composition
03/31/2010CN101687977A catalyst for curing epoxides
03/30/2010US7687599 Poly(ether-ester) polyols and processes for their production
03/30/2010US7687556 Flame retardant compositions
03/25/2010WO2010032650A1 Phosphorus-containing phenol compounds, manufacturing method therefor, curable resin compositions and cured products using same
03/25/2010WO2010031445A1 Epoxy resin composition
03/24/2010EP2166037A1 Epoxy resin-forming liquid preparation containing inorganic particle
03/24/2010EP2166029A1 Optical semiconductor-sealing composition
03/24/2010EP2166013A1 Oligomeric, hydroxy-terminated phosphonates
03/24/2010EP1532188B1 Low-cure powder coatings and methods for using the same
03/24/2010CN101681929A Gate insulating film forming agent for thin-film transistor
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