| Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
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| 11/24/2010 | EP2253666A1 Curable resin composition and cured resin |
| 11/24/2010 | EP2252641A1 Curable reaction resin system |
| 11/24/2010 | EP2252640A1 Modified reaction resin |
| 11/24/2010 | EP2102178B1 Epoxy resin compositions and method for the production thereof |
| 11/24/2010 | CN1989164B Curable composition |
| 11/24/2010 | CN1934190B Epoxy resin composition for the encapsulation of semiconductors and semiconductor devices |
| 11/24/2010 | CN101896570A Method for producing hydroxy-functional polymers, the isocyanate-group-terminated polyaddition products which can be obtained therefrom, and the use thereof |
| 11/24/2010 | CN101896549A Photosemiconductor package sealing resin material |
| 11/24/2010 | CN101896537A Alkali-developable curable composition, insulating thin film using the same, and thin film transistor |
| 11/24/2010 | CN101896531A Curing system and coatings obtained thereof |
| 11/24/2010 | CN101896530A Epoxy resin curing agent, method for producing the same, and epoxy resin composition |
| 11/24/2010 | CN101896529A Solid power formulations for the preparation of resin-coated foils and their use in the manufacture of printed circuit boards |
| 11/24/2010 | CN101896271A Anion exchange polymers, methods for making and materials prepared therefrom |
| 11/24/2010 | CN101892025A Brush-making structural adhesive and preparation method thereof |
| 11/24/2010 | CN101892005A Halogen-free flame retardant high-temperature resistant insulating paint for motor |
| 11/24/2010 | CN101891936A Preparation method of composite material based on epoxy resin and phosphazene nanotubes |
| 11/24/2010 | CN101891902A Method for recycling waste epoxy resin |
| 11/24/2010 | CN101128512B Process for production of branched polyether resin composition and process for production of acid pendant type branched polyether resin composition |
| 11/23/2010 | US7838582 reaction product of a polyglycidyl oligomer and amino compound, which has amine functionality from amino compound to aid in dispersion of fluoropolymers and hydroxyl functionality from opening at least one of said epoxy groups to enhance Kynar cross-linking; cost effective protective coatings |
| 11/23/2010 | US7838577 prevents staining that occurs from liquid bleeding from the adhesive which deteriorates the reliability of the semiconductor chip laminate; a curable epoxy; a curing agent; and two inorganic fine particle types of different sizes |
| 11/23/2010 | US7838114 Thermosetting resin composition and use thereof |
| 11/23/2010 | CA2493813C Medical device lubricant comprising radiation curable silicon material |
| 11/18/2010 | WO2010131648A1 Sealant for liquid crystal dropping process, vertically conducting material, and liquid crystal display element |
| 11/18/2010 | WO2010098431A9 Microencapsulated hardener for epoxy resin, masterbatch type hardener composition for epoxy resin, one-pack epoxy resin composition, and processed article |
| 11/18/2010 | US20100292415 High tg epoxy systems for composite applications |
| 11/17/2010 | EP2251742A1 Composition for forming resist underlayer film and method for forming resist pattern using the same |
| 11/17/2010 | EP2251369A1 One-pack type epoxy resin composition and use thereof |
| 11/17/2010 | EP2029656B1 Coating system |
| 11/17/2010 | CN1938356B Hardenable composition |
| 11/17/2010 | CN101889244A Sealing agent for liquid crystal dropping method, which contains photocurable resin and thermosetting resin |
| 11/17/2010 | CN101889243A A liquid crystal orientating agent, a liquid crystal orientating film and a liquid crystal display element |
| 11/17/2010 | CN101886336A Polyalcohol modified epoxy resin carbon fiber emulsion sizing agent component and preparation method thereof |
| 11/17/2010 | CN101885901A Biphenyl-structure-contained epoxy resin/montmorillonite nano composite material |
| 11/17/2010 | CN101885899A Resin composition for optical components and optical component using the same |
| 11/17/2010 | CN101885832A Preparation and application of latent nonionic self-emulsifying epoxy curing agent |
| 11/17/2010 | CN101402720B Process for producing room temperature curing watersoluble solidifying agent of epoxy resin |
| 11/17/2010 | CN101283009B Phenol polymer, production method thereof and use thereof |
| 11/17/2010 | CN101268559B Light-emitting device, method for manufacturing same, molded body and sealing member |
| 11/16/2010 | US7834136 Polymeric (organic) light emitting diodes, (PLED, OLED); polyarylenevinylene polymer containing N-substituted carbazole units, and another aromatic ring unit; blends with organometallic fluorescent or phosphorescent molecule such as phenylpyridine iridium complex |
| 11/16/2010 | US7834101 epoxidized linseed oil and an epoxy tallate, octyl epoxytallate; improvement of the surface smoothness of molded composites such as SMC (sheet molding compound) |
| 11/16/2010 | US7833691 Diphenylsulfonium compounds in which the S atom is additionally attached to a xanthene-9-onyl-2-yl- or coumarin-7-yl- ring; acid generator for a chemically amplified resist; photopolymerization initiator for polymerizing an epoxide or a vinyl ether |
| 11/16/2010 | CA2575709C Radiation curable, sprayable coating compositions |
| 11/11/2010 | WO2010128568A1 Curable resin and composite material |
| 11/11/2010 | WO2010104603A3 Radiation curable resin composition and rapid three-dimensional imaging process using the same |
| 11/11/2010 | DE10063066B4 Iodoniumsalze als latente Säurespender Iodonium salts as latent acid donors |
| 11/10/2010 | EP2248838A1 Epoxy resin composition, prepreg, abd fiber-reinforced composite material |
| 11/10/2010 | EP2247635A1 Novel chain elongators for polyurethane elastomer compositions |
| 11/10/2010 | EP2118165B1 Aqueous epoxy resin compositions |
| 11/10/2010 | CN1854133B Heterocycle-bearing onium salts |
| 11/10/2010 | CN1423678B Flame retardant phosphorus element-containing epoxy resin compositions |
| 11/10/2010 | CN101884015A Resist underlayer film forming composition and method for forming resist pattern |
| 11/10/2010 | CN101883806A Phosphorus-containing epoxy resin and phosphorus-containing epoxy resin composition, process for producing the same, and curable resin composition and cured object each containing or obtained from the resin and the resin composition |
| 11/10/2010 | CN101883797A Curable composition for transfer materials and method for forming micropattern using the curable composition |
| 11/10/2010 | CN101880507A Expanded water-based fireproof varnish and preparation method |
| 11/10/2010 | CN101880444A Heterocycle structure contained chain elongation type bismaleimide toughened and strengthened epoxy resin and preparation method thereof |
| 11/10/2010 | CN101880443A Low-viscosity epoxy resin system for resin transfer molding and preparation and using method thereof |
| 11/10/2010 | CN101880441A Epoxy resin composition as well as bonding sheet and copper-clad plate made from same |
| 11/10/2010 | CN101880376A Ageing-resistant epoxy resin curing agent |
| 11/10/2010 | CN101880375A Special curing agent for high-thermal-conductivity epoxy resin potting material, and potting material prepared from the same |
| 11/10/2010 | CN101880374A Silicon framework hyperbranched epoxy resin and preparation method thereof |
| 11/10/2010 | CN101879460A Nerchinskite solid-borne platinum catalyst and preparation method and application thereof |
| 11/10/2010 | CN101367908B Preparation method for hydrogenated bisphenol A epoxy resin |
| 11/10/2010 | CN101348563B Tough mannich base curing agent and preparation thereof |
| 11/10/2010 | CN101348560B Epoxide resin containing furan group and preparation thereof |
| 11/10/2010 | CN101243117B Thermosetting composition for sealing organic el element |
| 11/04/2010 | WO2010127118A1 Thermosettable resin compositions |
| 11/04/2010 | WO2010125949A1 Photosensitive composition utilizing photopolymerizable polymer having fluorene skeleton |
| 11/04/2010 | WO2010124901A1 Catalysis of epoxy resin formulations |
| 11/04/2010 | US20100280260 Holographic storage medium comprising polyfunctional epoxy monomers capable of undergoing cationic polymerization |
| 11/04/2010 | US20100280211 Fast curable epoxy compositions containing imidazole-and 1 -(aminoalkyl) imidazole-isocyanate adducts |
| 11/04/2010 | US20100280191 Epoxy resin composition |
| 11/04/2010 | US20100279227 Composition for forming underlayer coating for litography containing epoxy compound and carboxylic acid compound |
| 11/04/2010 | US20100276059 UVV curable coating compositions and method for coating flooring and other substrates with same |
| 11/04/2010 | DE102009027826A1 Katalyse von Epoxidharzformulierungen Catalysis of epoxy resin formulations |
| 11/04/2010 | CA2759046A1 Catalysis of epoxy resin formulations |
| 11/03/2010 | EP2246380A2 Fast curable epoxy compositions containing imidazole- and 1-(aminoalkyl) imidazole-isocyanate adducts |
| 11/03/2010 | CN101878240A Silica-containing epoxy curing agent and epoxy resin cured body |
| 11/03/2010 | CN101878239A Epoxy resin formulations |
| 11/03/2010 | CN101348558B Enzymatic hydrolysis lignin epoxide resin and preparation thereof |
| 11/03/2010 | CN101280056B Method for preparing C21dicarboxylic acid polyamide epoxy hardener from methyl eleostearate |
| 11/02/2010 | US7825198 Thermosetting resin composition and multilayer printed wiring board using the same |
| 11/02/2010 | CA2553419C Infiltrant system for rapid prototyping process |
| 10/28/2010 | WO2010123314A2 Novel epoxy resin and epoxy resin composition comprising the same |
| 10/28/2010 | WO2010122995A1 Imidazole compound-containing microcapsulated composition, curable composition using same, and masterbatch type curing agent |
| 10/28/2010 | WO2010121898A1 Polyisocyanate composition |
| 10/28/2010 | WO2010121853A1 Method of making chemically resistant moulds and tools |
| 10/28/2010 | WO2010121397A1 Water-soluble epoxy curing agent and method for preparing the same |
| 10/28/2010 | WO2010121393A1 Anisotropic composite |
| 10/28/2010 | WO2010121392A1 Thermosettable composition containing a half ester of a cycloaliphatic diol and a thermoset product therefrom |
| 10/28/2010 | US20100271428 Polyfunctional epoxy compound, epoxy resin, cationic photopolymerizable epoxy resin composition, micro structured member, producing method therefor and liquid discharge head |
| 10/28/2010 | US20100270581 Optical semiconductor package sealing resin material |
| 10/28/2010 | US20100270162 Cationic electrodeposition coating composition |
| 10/28/2010 | CA2755856A1 Polyisocyanate composition |
| 10/27/2010 | EP2242810A1 Water-borne paints based on epoxy resins |
| 10/27/2010 | EP2242785A1 Water-borne epoxy resin systems |
| 10/27/2010 | EP1451011B1 Autodeposition compositions |
| 10/27/2010 | CN101870801A High-elasticity epoxy resin |
| 10/27/2010 | CN101870764A Resin composition for printed circuit board and printed circuit board using the same |
| 10/27/2010 | CN101870763A Resin composition for printed circuit board and printed circuit board using the same |
| 10/27/2010 | CN101870762A High temperature resistant modified epoxy resin, preparation method thereof and use thereof |