Patents
Sitemap › C08 - Organic macromolecular compounds; Their preparation or chemical working-up; Compositions based thereon › C08G - Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds › C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286)
10/2010
10/27/2010CN101870191A Novel material intaglio roller
10/27/2010CN101003614B Process for producing epoxy resin
10/26/2010US7820772 comprises an amine adduct and a low-molecular amine compound 2-methylimidazole; bisphenol A type epoxy resin reacted with 2-methylimidazole as the amine adduct; excellent hardening property at low temperature, and storage stability at low and high temperature; adhesives; sealant
10/26/2010US7820766 Branched acetylene-containing poly(alkylene oxides, oxyethylated polyols or olefinic alcohols)
10/26/2010US7820735 Ink composition for a color filter, a color filter substrate manufactured using the ink composition and method of manufacturing a color filter substrate using the ink composition
10/21/2010WO2010119960A1 Olefin resin, epoxy resin, curable resin composition, and material resulting from curing same
10/21/2010WO2010119903A1 Glass fiber-silsesquioxane composite molded article and method for producing same
10/21/2010WO2010119868A1 Photosensitive polyester composition for use in forming thermally cured film
10/21/2010WO2010119706A1 Sealing composite and sealing sheet
10/21/2010WO2010083192A3 Epoxy resin composition
10/21/2010US20100267857 Salt compound, cationic polymerization initiator and cationically polymerizable composition
10/20/2010EP2241586A1 Silicon-containing particle, process for producing the same, organic-polymer composition, ceramic, and process for producing the same
10/20/2010CN101868489A Impact strength improving agent for epoxy resin compositions
10/20/2010CN101864150A Preparation process of putty for dry-type air-core reactor
10/20/2010CN101864149A Flame-retardant transparent high-toughness epoxy sealing resin and preparation method thereof
10/20/2010CN101864146A Epoxy resin composition for printed circuit copper-clad plate
10/20/2010CN101864060A Preparation method of epoxy nanometer hybrid material with low surface energy
10/20/2010CN101864059A Heat-resistant epoxy anhydride resin suitable for vacuum pressure impregnation (VPI) and preparing method and application thereof
10/20/2010CN101864058A Normal temperature dipping-type epoxy anhydride heat-resistant resin as well as preparation method and application thereof
10/20/2010CN101864057A Epoxy resin used for powder coating and preparation method thereof
10/20/2010CN101864044A Aqueous acrylic modified epoxy ester resin and synthesizing method thereof
10/20/2010CN101863745A Bisphenol compound containing numerous benzene rings and synthesis method thereof
10/19/2010US7816482 Epoxy-crosslinked sulfonated poly (phenylene) copolymer proton exchange membranes
10/19/2010US7816481 Polyether polyamine agents and mixtures thereof
10/19/2010US7816430 a polycyanurate comprising a cyanatophenyl group and a phenol group, and an epoxy resin having a biphenyl structure in the molecule; printed-wiring boards for wireless communications, electronics
10/19/2010US7816067 novolaks type substituted naphthalene-formaldehyde resin derivatives; masking, exposure, development and etching of above underlayer
10/19/2010CA2487005C Jettable compositions
10/14/2010WO2010117669A1 Epoxy resin based core filler material developing low exothermic heat
10/14/2010WO2010117056A1 Photocurable resin and photocurable resin composition
10/14/2010WO2010116757A1 Solder resist composition, dry film using same, and printed wiring board
10/14/2010WO2010116582A1 Liquid sealing resin composition, semiconductor device using liquid sealing resin composition, and method for producing same
10/14/2010WO2010115550A1 Carbon nanotubes comprising hydroxy groups, method for the production thereof and polyurethane polymers comprising said carbon nanotubes
10/14/2010US20100261395 Curable compositions for advanced processes, and products made therefrom
10/14/2010CA2758090A1 Carbon nanotubes comprising hydroxy groups, method for the production thereof and polyurethane polymers comprising said carbon nanotubes
10/14/2010CA2757760A1 Liquid encapsulating resin composition, semiconductor device using liquid encapsulating resin composition, and method of manufacturing the same
10/14/2010CA2756886A1 Epoxy resin based core filler material developing low exothermic heat
10/13/2010EP2239293A1 Hardeners for epoxy coatings
10/13/2010EP2239290A1 Carbon nanotubes containing hydroxyl groups, method for creating same and polyurethane polymers containing these carbon nanotubes
10/13/2010CN101861545A Liquid crystal sealing agent and liquid crystal display cell using the same
10/13/2010CN101861518A Monolith separation medium for chromatographic use and method of producing the same
10/13/2010CN101861345A Heat-curing epoxy resin composition containing non-aromatic ureas as accelerator
10/13/2010CN101244645B Production method for oxazolidinone epoxy glass cloth laminated board
10/07/2010WO2010114166A1 Flame-retardant phosphorus-containing epoxy resin composition and cured product thereof
10/07/2010WO2010113945A1 Polyester composite for forming thermoset films
10/07/2010WO2010113944A1 Polyester composite for forming thermoset films
10/07/2010WO2010113784A1 Epoxy resin, epoxy resin composition, and cured object
10/07/2010WO2010113478A1 Curable resin composition and printed wiring board
10/07/2010WO2010112179A1 Thermosetting compositions containing isocyanurate rings
10/07/2010WO2010111921A1 Epoxy resin composition
10/07/2010US20100255315 Epoxy resin composition
10/07/2010CA2755924A1 Thermosetting compositions containing isocyanurate rings
10/06/2010EP2237110A1 Sulfur atom-containing composition for resist underlayer film formation and method for resist pattern formation
10/06/2010EP2236543A1 Alkali-developable curable composition, insulating thin film using the same, and thin film transistor
10/06/2010EP2236539A1 Polymerizable epoxy composition, and sealing material composition comprising the same
10/06/2010EP2235087A1 Epoxy resin hardener compositions and epoxy resin compositions containing such hardener compositions
10/06/2010CN1821876B Solder resist ink composition
10/06/2010CN101851397A Synthetic resin and ultraviolet photo-curing adhesive prepared by using the same
10/06/2010CN101851396A Waterborne epoxy ester resin composition and preparation method thereof and water-based paint prepared from same
10/06/2010CN101851388A Liquid resin composition for electronic component and electronic component device
10/06/2010CN101851330A Alpha, omega-amino terminated polyether compound with phenolic hydroxyl group, preparation method thereof and epoxy resin adhesive containing the same
10/06/2010CN101851327A Cashew nut oil modified solid aromatic amine epoxy curing agent
10/06/2010CN101113229B Curing agent intermediate composition and curing agent employing the same
10/05/2010US7807734 polyurea made of polyoxypropylenediamine resin, polydiphenylriamine, and methylene diisocyanate prepolymer; protective coating form ship hull; excellent elongation, elasticity, abrasion resistance, anti fouling property, durability, adhesion
10/05/2010US7807090 helicopter blades; solvent-free release agents coated and polymerized on mold surface; no volatile organic compounds enter the environment; cured and uncured epoxy endcapped-polydimethylsiloxane; diaryliodonium salt; dodecyl vinyl ether; cyclohexane dimethanol divinyl ether; impregnated wipe or cloth
09/2010
09/30/2010WO2010110433A1 Thermosetting resin composition, and prepreg, insulating film with support, laminate plate, and printed wiring board, each obtained using same
09/30/2010WO2010110069A1 Resin paste for die bonding, process for producing semiconductor device using the resin paste, and semiconductor device
09/30/2010WO2010110049A1 Photocurable composition for liquid crystal display panel seal, and liquid crystal display panel
09/30/2010WO2010109957A1 Epoxy resin composition, prepreg, carbon fiber reinforced composite material, and housing for electronic or electrical component
09/30/2010WO2010109948A1 Epoxy resin composition, prepreg, metal foil with resin, resin sheet, laminate and multi-layer board
09/30/2010WO2010109929A1 Epoxy resin composition for fiber-reinforced composite material, prepreg, and fiber-reinforced composite material
09/30/2010WO2010109861A1 Method of storing resin solution and processes for producing prepreg and laminate
09/30/2010US20100249341 Alicyclic diepoxy compound, epoxy resin composition comprising the same, and cured article therefrom
09/30/2010US20100243304 Solder resist, dry film thereof, cured product, and printed wiring board
09/30/2010CA2750631A1 Epoxy resin composition for fiber-reinforced composite material, prepreg, and fiber-reinforced composite material
09/29/2010EP2233507A1 Thermosetting resin composition, epoxy resin molding material, and polyvalent carboxylic acid condensate
09/29/2010EP2231781A2 Curing composition and cured product prepared by using the same
09/29/2010CN101848915A Epoxy group-containing organosiloxane compound, curable composition for transfer material, and fine pattern forming method using the composition
09/29/2010CN101846624A Method for estimating state of ultraviolet curing resin
09/29/2010CN101845134A Thermally cured resin composition
09/29/2010CN101343349B Cationic aqueous epoxy resin grouting material and preparation thereof
09/23/2010WO2010107539A1 Curable compositions containing cyclic diamine and cured products therefrom
09/23/2010WO2010107085A1 Diolefin compound, epoxy resin and composition thereof
09/23/2010WO2010107045A1 Polyimide resin, curable resin composition, and cured object obtained therefrom
09/23/2010WO2010107038A1 Method for producing diepoxy compound
09/23/2010WO2010106780A1 Inclusion complex, curing agent, cure accelerator, epoxy resin composition, and epoxy resin composition for encapsulation of semiconductor
09/23/2010WO2010105913A1 Impregnating resin for insulating tubes
09/23/2010US20100240855 Compound having silsesquioxane skeleton and its polymer
09/23/2010CA2755854A1 Curable compositions containing cyclic diamine and cured products therefrom
09/22/2010EP2230271A1 Additive for polymerizable composition, polymerizable composition containing the same, and use of the polymerizable composition
09/22/2010EP2229416A1 High tg epoxy systems for composite application
09/22/2010CN1678452B Resin layer-coated copper foil and multilayered printed wiring board obtained with the resin layer-coated copper foil
09/22/2010CN101842409A Salt compound, cationic polymerization initiator and cationically polymerizable composition
09/22/2010CN101842407A Method for producing latent curing agent for powder epoxy resin, latent curing agent for powder epoxy resin obtained by the method, and curable epoxy resin composition using the same
09/22/2010CN101842401A Non-sintering isocyanate modified epoxy resin for fusion bonded epoxy applications
09/22/2010CN101838396A Method for preparing self-emulsifying water borne epoxy emulsion
09/22/2010CN101838386A Method for preparing waterborne polyurethane taken as waterborne epoxy hardener
09/21/2010US7799869 Thermoplastic elastomer composition and molded article
09/21/2010US7799852 semiconductor encapsulating resin; polyepoxide of biphenyl-4,4'-diglycidyl ether and 3,3',5,5'-tetramethylbiphenyl-4,4'-diglycidyl ether, phenolic resin, low amount of filler, curing accelerator; inherently fire resistant without added flame retardant; forms foamed layer at ignition for fire retardancy
09/21/2010CA2473818C Low voc vinylester resin and applications
09/21/2010CA2464339C Curable cyanate compositions
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