| Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
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| 12/22/2010 | CN201678617U Vacuum extractor for use in production of brominated epoxy resin |
| 12/22/2010 | CN101925629A Dimethylformamide-free formulations using dicyanadiamide as curing agent for thermosetting epoxy resins |
| 12/22/2010 | CN101925628A Thermosetting epoxy resin composition |
| 12/22/2010 | CN101925627A Epoxy resin hardener compositions and epoxy resin compositions containing such hardener compositions |
| 12/22/2010 | CN101921571A High-temperature resistant packaging adhesive for high-power LED lamp and preparation method thereof |
| 12/22/2010 | CN101921460A Epoxy asphalt deck crack repairing agent capable of being cured at normal temperature |
| 12/22/2010 | CN101921459A Carbon fiber winding reinforcing slice and manufacturing method thereof |
| 12/22/2010 | CN101921456A Resin composition for sealing an optical semiconductor device |
| 12/22/2010 | CN101921373A Acrylic modified epoxy resin emulsion and preparation method thereof |
| 12/22/2010 | CN101921175A Process for producing an organic compound |
| 12/22/2010 | CN101920597A Liquid discharge head and method for manufacturing the same |
| 12/22/2010 | CN101570592B Polyether type hyperbranched epoxy resin and preparation method thereof |
| 12/22/2010 | CN101367909B Synthesis process for bisphenol acid type epoxy resin with medium molecular mass |
| 12/21/2010 | US7855245 Adhesive composition and a method of using the same |
| 12/16/2010 | WO2010144787A1 Epoxy-containing composition curable by multiple polymerization mechanisms |
| 12/16/2010 | WO2010144236A1 Latent hardener for epoxy compositions |
| 12/16/2010 | WO2010143560A1 Photosensitive composition |
| 12/16/2010 | WO2010143540A1 Hydrazide compound, process for production of same, and curing agent, resin composition and cured article each comprising same |
| 12/15/2010 | EP2260067A2 Process for manufacturing liquid epoxy resins |
| 12/15/2010 | CN201670816U Desalting, purification and filter unit for epoxy resin production |
| 12/15/2010 | CN1961261B Radiation-sensitive composition, laminate, process for producing the sane and electronic part |
| 12/15/2010 | CN101914348A Sealing adhesive and preparation method thereof |
| 12/15/2010 | CN101914267A High-performance epoxy resin composition for pulling and extrusion and preparation method thereof |
| 12/15/2010 | CN101914196A Curing composition and preparation method and application thereof |
| 12/15/2010 | CN101914195A Heat-resistant epoxy resin compound for forming RTM, epoxy base resin and preparation method thereof |
| 12/15/2010 | CN101914194A Self-emulsified nonionic terpenyl epoxy resin polyalcohol emulsion and preparation method and application |
| 12/15/2010 | CN101914193A Method for purifying bisphenol-A molecular epoxy resin by using molecular distillation technology and device thereof |
| 12/15/2010 | CN101397364B Method for preparing air drying epoxy vinyl ester resin |
| 12/15/2010 | CN101357996B Multi-microporous epoxy thermosetting resin, preparation method and application thereof |
| 12/15/2010 | CN101052679B Poly resin composition |
| 12/09/2010 | WO2010140674A1 Epoxy resin composition, prepreg and cured products thereof |
| 12/09/2010 | WO2010140481A1 Cationically polymerizable resin composition and cured object obtained therefrom |
| 12/09/2010 | WO2010140442A1 Photocurable adhesive composition, photocurable adhesive layer, and photocurable adhesive sheet |
| 12/09/2010 | WO2010140351A1 Epoxy resin composition, prepreg and fiber-reinforced composite material |
| 12/09/2010 | WO2010140331A1 Resin composition for semiconductor encapsulation, and semiconductor device |
| 12/09/2010 | US20100311936 High thermal conductivity materials with grafted surface functional groups |
| 12/09/2010 | US20100311916 Electric circuit board composition and a method of preparing circuit board |
| 12/08/2010 | EP2259289A1 Gate insulating material, gate insulating film, and organic field effect transistor |
| 12/08/2010 | EP2258741A1 Resin composition for optical components and optical component using the same |
| 12/08/2010 | EP2257586A1 Novel polycarbonate polyorganosiloxane and/or polyurethane polyorganosiloxane compounds |
| 12/08/2010 | CN1918208B Multi-component kit for fixing and its uses |
| 12/08/2010 | CN1911984B Novel sulfurized phenolic resin and process for producing the same |
| 12/08/2010 | CN1611495B Compound having an epoxy group and a chalcone group, method of preparing the same, and photoresist composition comprising the same |
| 12/08/2010 | CN101910948A Sulfur atom-containing composition for resist underlayer film formation and method for resist pattern formation |
| 12/08/2010 | CN101910275A Additive for polymerizable composition, polymerizable composition containing the same, and use of the polymerizable composition |
| 12/08/2010 | CN101910241A Thermosetting resin composition and prepreg and laminate both made with the same |
| 12/08/2010 | CN101910240A Latent curing agents, epoxy resin compositions conating the same, sealing materials, and organic EL displays |
| 12/08/2010 | CN101910239A Thermosetting resin composition, epoxy resin molding material, and polyvalent carboxylic acid condensate |
| 12/08/2010 | CN101910238A High Tg epoxy systems for composite application |
| 12/08/2010 | CN101910237A Epoxy resin composition, prepreg, metal clad laminate and multilayer printed wiring board |
| 12/08/2010 | CN101910236A Polymerizable epoxy composition, and sealing material composition comprising the same |
| 12/08/2010 | CN101910235A Epoxy compound and manufacturing method thereof |
| 12/08/2010 | CN101910230A Epoxy resin composition containing isocyanurates for use in electrical laminates |
| 12/08/2010 | CN101910186A Copolymers of epoxy compounds and amino silanes |
| 12/08/2010 | CN101909748A Epoxidation catalyst, process for production of epoxidation catalyst, process for production of epoxy compounds, curable resin compositions, and products of curing of the compositions |
| 12/08/2010 | CN101909598A Personal care composition comprising a reaction product of epoxy compound and amino silane |
| 12/08/2010 | CN101906239A Halogen-free flame-retardant resin composition and application thereof in manufacturing copper-clad plate |
| 12/08/2010 | CN101906238A Epoxy resin composition and semiconductor device |
| 12/08/2010 | CN101906236A Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same |
| 12/08/2010 | CN101906206A Fast curable epoxy compositions containing imidazole- and 1-(aminoalkyl) imidazole-isocyanate adducts |
| 12/08/2010 | CN101906205A Production method of non-halogen and non-phosphorus self-flame retarding epoxy resins |
| 12/08/2010 | CN101429273B Process for producing wind electricity grade of bisphenol F epoxy resin |
| 12/08/2010 | CN101305047B Photosensitive resin composition for optical waveguide formation, optical waveguide and method for producing optical waveguide |
| 12/08/2010 | CN101128501B Epoxy resin, solidifiable resin composition containing epoxy resin and use thereof |
| 12/08/2010 | CN101044184B Radiation curable resin, liquid crystal sealing material, and liquid crystal display cell using same |
| 12/08/2010 | CN101027336B Epoxy resin composition, cured product thereof, semiconductor sealing material, new phenolic resin, new epoxy resin, method for producing the new phenolic resin, and method for producing the new epoxy |
| 12/07/2010 | US7846998 Sealant epoxy-resin molding material, and electronic component device |
| 12/07/2010 | US7846988 CYCLIC TRIMETHYLOLPROPANE FORMAL ACRYLATE monomer such as SR531, an amine modified epoxy diacrylate oligomer such as Ebecryl 3703, pentaerythritol triacrylate, tetrahydrofurfuryl acrylate , pigment, photoinitiators and methyl ethyl ketone solvent; durable low viscosity ink jet ink for printing golf ball |
| 12/02/2010 | WO2010138346A1 Polymeric glycidyl ethers reactive diluents |
| 12/02/2010 | WO2010137636A1 Epoxy resin-based coating composition |
| 12/02/2010 | WO2010136772A1 Engineered crosslinked thermoplastic particles for interlaminar toughening |
| 12/02/2010 | WO2010136725A1 Novel method for producing thermosetting epoxy resins |
| 12/02/2010 | WO2009087653A3 An epoxy foam resin |
| 12/02/2010 | CA2778920A1 Engineered cross-linked thermoplastic particles for interlaminar toughening |
| 12/02/2010 | CA2759184A1 Engineered crosslinked thermoplastic particles for interlaminar toughening |
| 12/01/2010 | EP2256541A1 A liquid crystal orientating agent, a liquid crystal orientating film and a liquid crystal display element |
| 12/01/2010 | EP2256163A1 Epoxy resin composition, fiber-reinforced composite material and method for producing the same |
| 12/01/2010 | EP2254853A1 Polyphenolic compounds and epoxy resins comprising cycloaliphatic moieties and process for the production thereof |
| 12/01/2010 | EP1917316B1 Coating mass |
| 12/01/2010 | CN101903437A Film-like resin composition for encapsulation filling, method for manufacturing semiconductor package or semiconductor device using the same, and semiconductor device |
| 12/01/2010 | CN101903436A Phenalkamine and salted amine blends as curing agents for epoxy resins |
| 12/01/2010 | CN101903426A Copolymer, resin composition, spacer for display panel, planarization film, thermosetting protective film, microlens, and process for producing copolymer |
| 12/01/2010 | CN101899196A Water-borne phenolic epoxy resin emulsion and preparation method thereof |
| 12/01/2010 | CN101899195A Dam composition and method for fabrication of multilayer semiconductor device |
| 12/01/2010 | CN101899194A Single-component epoxy resin composition |
| 12/01/2010 | CN101899163A Method for preparing self-emulsifiable non-ionic water-borne novolac epoxy resin emulsion |
| 12/01/2010 | CN101899149A Preparation method of self-antiflaming epoxy resin curing agent |
| 12/01/2010 | CN101899141A Self-emulsifying water borne epoxy resin curing agent and preparation method thereof |
| 12/01/2010 | CN101445646B Preparation method of polymeric based carbon nano tube composite material in the technical field of nano-materials |
| 12/01/2010 | CN101253454B Photosensitive composition for volume hologram recording |
| 12/01/2010 | CN101208373B Polyamide resin, epoxy resin compositions, and cured articles thereof |
| 12/01/2010 | CN101128502B Latent hardener for epoxy resin and epoxy resin composition |
| 11/30/2010 | US7844153 rapid curing polymer having epoxy and aromatic hydrocarbon functionality and photoinitiator in solvent; optical waveguides; simple, efficient; adhesion is improved if the composition is combined with a photo-sensitizer or photo-radical generator |
| 11/30/2010 | US7842762 cure agent free of tin or bismuth metal catalyst; epoxy functional polymer; |
| 11/25/2010 | WO2010135730A2 One-component epoxy coating compositions |
| 11/25/2010 | WO2010135086A1 Epoxy resins with improved flexural properties |
| 11/25/2010 | WO2010133292A1 Method for producing epoxide amine addition compounds |
| 11/25/2010 | US20100298506 Method for producing an amino group-containing phosphate compound, and a flame-retardant resin and flame-retardant resin composition |
| 11/25/2010 | CA2761815A1 One-component epoxy coating compositions |
| 11/25/2010 | CA2757641A1 Epoxy resin with improved flexural properties |