Patents
Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286)
01/2011
01/20/2011WO2011008480A1 Polymer compositions and methods of making and using same
01/20/2011WO2011008295A1 Oxygen barrier compositions and related methods
01/20/2011WO2011008081A2 Heat-resistant, chemical resistant, room temperature curable, solvent-free resin compositions to apply as protective coating
01/20/2011WO2011006530A1 Epoxy resin composition
01/20/2011WO2010138662A3 Engineered cross-linked thermoplastic particles interlaminar toughening
01/20/2011CA2766307A1 Polymer compositions and methods of making and using same
01/19/2011EP2274359A1 Activator for epoxy resin compositions
01/19/2011EP1922135B1 Hindered cyclic polyamines and their salts for acid gas scrubbing process
01/19/2011CN201713460U Gas guide tube for synthetic resin production
01/19/2011CN201713456U Device for separating ECH
01/19/2011CN101952365A Curable resin composition and cured resin
01/19/2011CN101952364A Microencapsulated silane coupling agent
01/19/2011CN101948611A Winding epoxy resin composition, preparation method thereof and use thereof
01/19/2011CN101948610A Low-viscosity bi-component epoxy resin potting adhesive and preparation method thereof
01/19/2011CN101948609A Black rubber and preparation method thereof
01/19/2011CN101273076B Process for producing latent catalyst and epoxy resin composition
01/19/2011CN101031602B Epoxy resin composition for sealing optical semiconductor
01/18/2011US7871694 impregnating a resin composition comprising a resin with an imide structure (polyamideimide copolymer, polyamideimidesoloxane) and a thermosetting resin ( epoxy or polyepoxide)into a fiber base material; prepreg having a property that it can be bent; metal foil-clad laminate and printed circuit board
01/18/2011US7871556 combination of high viscosity and slower acting low viscosity resins, curable toughener, initiator and stabilizer; rapid homogeneous droplet merging and curing; tensile strength, ductility; computer controlled piezoelectric printing of three dimensional multilayer articles
01/18/2011CA2531794C Epoxy-capped polythioethers
01/13/2011WO2011005420A1 Hardener composition for epoxy resins
01/13/2011WO2011004756A1 Thermosetting composition for protective film for wiring board
01/13/2011WO2011004721A1 Composition for forming resist underlayer film and method for forming resist pattern using same
01/13/2011WO2011004706A1 Adhesive composition, adhesive sheet, circuit board and semiconductor device both produced using these, and processes for producing these
01/13/2011WO2010135730A3 One-component epoxy coating compositions
01/12/2011EP2038104B1 Assembly of prepregs for producing structures, for example ones which deploy through inflation
01/12/2011CN101946291A Magnetic sheet composition, magnetic sheet, and method for producing magnetic sheet
01/12/2011CN101946210A Composition for forming resist underlayer film and method for forming resist pattern using the same
01/12/2011CN101945944A Epoxy resin composition, fiber-reinforced composite material and method for producing the same
01/12/2011CN101945916A Epoxy resin composition, prepreg, abd fiber-reinforced composite material
01/12/2011CN101945915A Oil extended rubber compositions
01/12/2011CN101942073A Curable resin composition for encapsulating optical semiconductor and cured product thereof
01/12/2011CN101942072A Synthetic method of epoxy acrylate
01/12/2011CN101942063A Water-borne epoxy ester modified alkyd resin emulsion and preparation method thereof
01/12/2011CN101418070B Epoxy resin combination, composite material and preparation method thereof
01/12/2011CN101392089B Surface improver for reinforced composite compositions
01/12/2011CN101193975B Hardenable resin composition
01/12/2011CN101107285B Epoxy resin composition, method for forming latent of the same and semiconductor device
01/12/2011CN101058709B Epoxy resin molding material for sealing use and semiconductor device
01/11/2011US7868067 Improved tribological properties, namely reduction of friction and wear
01/11/2011US7868056 coating with silane anchoring compounds; for textiles covered with silicone elastomers; electrical insulators, plastic films, thermal transfer ribbons, protective packaging films; siloxane with two polymerizable/crosslinkable epoxy or oxetane groups; cationic initiator
01/11/2011US7867568 textile sheets impregnated with epoxy resin, curing agent; gelled via heat/pressure; for aerospace technology
01/06/2011WO2011001912A1 Energy ray-curable epoxy resin composition having excellent curing properties in deep portions
01/06/2011WO2011001911A1 Energy ray-curable epoxy resin composition having excellent fast curing properties
01/06/2011WO2011001895A1 Liquid crystal sealing agent for liquid crystal dropping method and liquid crystal display cell using same
01/06/2011WO2011001788A1 Curable resin composition and cured products thereof
01/06/2011WO2011001485A1 Photocurable heat-curable resin composition
01/06/2011WO2011000619A1 2-component laminating adhesive
01/06/2011US20110001419 Polymerizable epoxy composition, and sealing material composition comprising the same
01/05/2011EP2270114A1 Photobase generator
01/05/2011EP2268697A1 Epoxy-imidazole catalysts useful for powder coating applications
01/05/2011EP2268696A1 Use of filler that undergoes endothermic phase transition to lower the reaction exotherm of epoxy based compositions
01/05/2011EP2268694A1 Polyurethane polymer based on an amphiphilic block copolymer and its use as impact modifier
01/05/2011EP2268689A1 Adducts and curable compositions using same
01/05/2011EP2268596A1 Composition comprising glycerol, process for obtaining same and use thereof in the manufacture of dichloropropanol
01/05/2011CN101940080A Curable electromagnetic shielding adhesive film, method for producing the same, use of the same, method for producing electromagnetic shielding article, and electromagnetic shielding article
01/05/2011CN101939379A Flux activator, adhesive resin composition, adhesive paste, adhesive film, semiconductor device fabrication method, and semiconductor device
01/05/2011CN101939377A Vibration dampening compositions
01/05/2011CN101939160A Novel compositions comprising structural isomers of 1,4-cyclohexanedimethanol dibenzoate and polymer compositions containing same
01/05/2011CN101935388A Resin composite and application thereof in preparing composite material core
01/05/2011CN101935387A Modified UV photocuring pure acrylic resin and preparation method thereof
01/05/2011CN101405342B Epoxy resin composition, fiber-reinforced composite material and method for producing the same
01/04/2011US7863399 Curing silicone composition and cured product thereof
01/04/2011US7862972 for developing electrostatic images, comprising a polycondensation polyester resin produced in the presence of at least one titanium-containing polymerization catalyst such as titanium dihydroxybis(triethanolaminate); low-temperature fixing properties to a toner
01/04/2011US7862851 applying at least one electrocoat material to an electrically conductive substrate and curing it to give an electrocoat and subsequently applying at least one layer of pulverulent coating material to the electrocoat and curing it to give a powder coat; high intercoat adhesion
01/04/2011CA2502536C Epoxy resin curing agent for enhanced wear resistance and weatherability of cured materials
01/04/2011CA2405314C Hydrogels and methods for their production
12/2010
12/30/2010US20100331497 Brominated and epoxidized flame retardants
12/30/2010US20100331454 Modified epoxy resins comprising the reaction product of a biomass derived compound and an epoxy resin, and aqueous dispersions and coatings comprising such resins
12/30/2010US20100330353 Method for producing organic-inorganic hybrid thin film and organic-inorganic hybrid thin film
12/29/2010WO2010150524A1 Polyvalent carboxylic acid, composition thereof, curable resin composition, cured product, and method for manufacturing a polyvalent carboxylic acid
12/29/2010WO2010150487A1 Resin composition for sealing semiconductors, and semiconductor device
12/29/2010EP2265658A1 Thermosetting resin containing irradiated thermoplastic toughening agent
12/29/2010EP2265657A2 Epoxy resin compositions having improved low temperature cure properties and processes and intermediates for making the same
12/29/2010CN101933182A Resin composition for fuel cell separator, process for producing same, and fuel cell separator
12/29/2010CN101932631A Silicon-containing particle, process for producing the same, organic-polymer composition, ceramic, and process for producing the same
12/29/2010CN101929109A Active diluent modified paper wet strength agent and preparation method thereof
12/29/2010CN101928508A Polyethylene glycol-modified epoxy acrylate coating and preparation method thereof
12/29/2010CN101928444A Halogen-free thermosetting resin composition, prepreg and metal clad foil laminated plate manufactured by using same
12/29/2010CN101928381A Photocurable resin composition and optical component using the same
12/29/2010CN101928380A Method for preparing flame resistance polyepoxy compound
12/29/2010CN101928379A Ultraviolet-cured low-viscosity epoxy acrylate and preparation method thereof
12/29/2010CN101928378A Photosensitive resin and use thereof for preparing liquid photoimageable solder resist ink
12/29/2010CN101928374A Fast-photocurable water-based epoxy acrylic resin
12/29/2010CN101591421B Silicon framework hyperbranched epoxy resin, preparation method and high temperature-resisting solvent-free insulated paint consisting of same
12/29/2010CN101585905B Organic silicon modified phenolic epoxy curing agent for copper-clad board of printed circuit and preparation method thereof
12/29/2010CN101544746B Modified epoxy resin adhesive and preparation method and application thereof
12/29/2010CN101427312B Ultraviolet-curable composition for optical disk and optical disk
12/29/2010CN101348559B Preparation of m-xylene diamine epoxide resin
12/28/2010US7858726 Process for producing low-molecular polyphenylene ether
12/28/2010US7858713 1-Imidazolymethyl-2-naphthol and 3,3'-diallylbisphenol A asa promoter mixture for high-speed curing of amine-modified epoxy resins and polyepoxides; prepregs; lamination; very good interlaminar shear strengths; storage stability; castings; sintered powder; encapsulation; molding materials
12/23/2010WO2010147161A1 Base and radical generator, composition using same and method for curing same
12/23/2010WO2010147070A1 Resin composition and organic-electrolyte battery
12/23/2010WO2010146979A1 Resin composition for encapsulation of photosemiconductors
12/23/2010WO2010146766A1 Resin composition for nanoimprint, and method for forming structure
12/23/2010US20100324215 Affinity structures for the specific binding of substances by means of non-covalent interaction types
12/23/2010US20100324170 Microcapsule-type latent curing agent
12/23/2010US20100323201 Polymeric Thermoplastic Compositions Having Excellent Resistance to Moisture and Oxygen Transmission and Sheet Which are Made of These Polymeric Thermoplastic Compositions
12/22/2010EP2264081A1 Photocurable resin composition and optical component using the same
12/22/2010EP2239293A9 Hardeners for epoxy coatings
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