Patents
Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286)
02/2011
02/23/2011CN101980995A Composition comprising glycerol, process for obtaining same and use thereof in the manufacture of dichloropropanol
02/23/2011CN101979436A Method for preparing carbon nanofiber and carbon nanotube modified carbon fiber/epoxy resin multi-dimensional hybrid composite
02/22/2011US7893130 Photocurable dental composition
02/22/2011US7893129 Stable, cationically polymerizable/crosslinkable dental compositions
02/22/2011US7892396 Toughened activatable material for sealing, baffling or reinforcing and method of forming same
02/17/2011WO2011019033A1 Porous cured epoxy resin, water quality preserving material, antibacterial material, and process for production of the porous cured epoxy resin
02/17/2011WO2011019003A1 Thermosetting resin composition for surface protection layers
02/17/2011US20110040046 Adducts of epoxy resins and process for preparing the same
02/17/2011US20110039982 Epoxy resins and processes for preparing the same
02/17/2011US20110037028 Flame retardant composition
02/16/2011EP2284162A2 Process for producing dichloropropanol
02/16/2011EP2284147A2 Process for producing dichloropropanol
02/16/2011EP2284146A2 Process for producing dichloropropanol
02/16/2011EP2284004A1 Electric circuit board composition and a method of preparing circuit board
02/16/2011EP2283922A2 Curable composition, cured film and related electronic device
02/16/2011EP2283093A1 Epoxy resin reactive diluent compositions
02/16/2011EP2283060A1 Adducts of epoxy resins and process for preparing the same
02/16/2011EP2283059A1 Epoxy resins derived from non-seed oil based alkanolamides and a process for preparing the same
02/16/2011EP2283058A1 Epoxy resins derived from seed oil based alkanolamides and a process for preparing the same
02/16/2011CN101978313A Sealing material for liquid-crystal dropping process, vertical-conduction material, and liquid-crystal display element
02/16/2011CN101977952A Adducts and curable compositions using same
02/16/2011CN101974304A Vinylester resin stone adhesive and preparation method thereof
02/16/2011CN101974237A Epoxy bitumen material for highway and road bridge and preparation method thereof
02/16/2011CN101974232A High-thermosetting epoxy asphalt material and preparation method thereof
02/16/2011CN101974231A High-performance epoxy bitumen material for roads and bridges and preparation method thereof
02/16/2011CN101974227A Low-stress epoxy/organic silicon/POSS nano hybrid material, and preparation method and application thereof
02/16/2011CN101974206A Epoxy resin composition
02/16/2011CN101974162A Low-VOC (Volatile Organic Compound) self-emulsifying solid epoxy resin water-based emulsion and preparation method thereof
02/16/2011CN101974144A Method for preparing plant oil-based polyol for flexible polyurethane foam
02/16/2011CN101974143A Organic silicon modified epoxy acrylate aqueous dispersion and preparation method thereof
02/16/2011CN101973986A Benzimidazole structure-containing diamine benzoxazine intermediate and preparation method thereof
02/15/2011US7888436 Compositions comprising thioether-functional oligomeric polythiols
02/15/2011CA2469659C Cleaning agent composition comprising polymers containing nitrogen
02/10/2011WO2011016492A1 Fluorine-containing adamantane derivative and resin compositions containing same
02/10/2011WO2011016385A1 Epoxy resin composition
02/10/2011US20110034631 Surface improver for reinforced composite compositions
02/10/2011US20110034580 Carbon-Negative Bio-Plastic Furniture
02/10/2011US20110031527 Thermosetting resin composition, epoxy resin molding material, and polyvalent carboxylic acid condensate
02/09/2011EP2282622A1 Resin composition for forming the adhesive layers of a multi-layer flexible printed circuit board
02/09/2011CN201737874U Secondary condensing plant for distillation in production of brominated epoxy resin
02/09/2011CN101971106A Composition for holographic recording medium
02/09/2011CN101970572A Photocurable composition
02/09/2011CN101970526A Epoxy resin composition and molded object
02/09/2011CN101970525A Curable composition, anisotropic conductive material and connection structure
02/09/2011CN101970524A Process for producing urethane (meth)acrylate
02/09/2011CN101970523A Water-borne epoxy resin systems
02/09/2011CN101967275A Nano magnesium carbonate modified fire protection engineering plastic and preparation method thereof
02/09/2011CN101967269A Yellowing resistant epoxy acrylate and preparation method thereof
02/09/2011CN101967267A Impregnating resin applied to wind driven generator insulating vacuum pressure impregnating treatment and impregnating method
02/09/2011CN101967266A Halogen-free fire-retarding epoxy resin composition
02/09/2011CN101967265A High-frequency resin composition and high-frequency circuit substrate manufactured by using same
02/09/2011CN101967264A Epoxy resin composition and high frequency circuit board made of same
02/09/2011CN101379107B Resin composition for semiconductor encapsulation and semiconductor device
02/09/2011CN101208368B Biphenylene-bridged phenol novolak resins and use thereof
02/09/2011CN101151294B 环氧树脂组合物 The epoxy resin composition
02/09/2011CN101111533B Ring-opening polymerization method and activated carbon catalyst for ring-opening polymerization
02/08/2011US7884172 epoxy resin is obtained by glycidylating one or more phenol compounds comprising 95% or more 1,1,2,2-tetrakis(hydroxyphenyl)ethane; forms cured object having high heat resistance, which is improved in impact resistance and moisture resistance
02/08/2011CA2496480C Polyether polyamine agents and mixtures therefor
02/08/2011CA2459374C Photoactivable nitrogen bases
02/03/2011WO2011014342A1 Flooring underlayments
02/03/2011WO2011013630A1 Composition for forming resist underlayer film for nanoimprint lithography
02/03/2011WO2011013326A1 Liquid resin composition and semiconductor device formed using same
02/03/2011WO2011012647A1 Epoxy resin-based compositions modified for impact resistance
02/03/2011WO2011011920A1 Amine-phenolic dual cure hardener blend for resin compositions
02/03/2011US20110028682 Process for producing polyalkylene oxide
02/03/2011US20110028602 Epoxy-imidazole catalysts useful for powder coating applications
02/03/2011US20110025612 Touch display panel, sealant thereof, and composition for forming sealant
02/03/2011US20110024168 Biomass-derived epoxy resin composition
02/03/2011CA2769176A1 Liquid resin composition and semiconductor device using the same
02/02/2011EP2280044A1 Epoxy resin composition for encapsulating electronic part
02/02/2011CN101962436A High-temperature-resistant modified polyfunctional epoxy matrix resin for advanced composite material and preparation thereof
02/02/2011CN101962435A Paint wax epoxy resin and preparation method thereof
02/02/2011CN101602854B Polyamide epoxy hardener and preparation method thereof
02/02/2011CN101098905B Latent curing agent
01/2011
01/27/2011WO2011010689A1 Fuel cell separator
01/27/2011WO2011010549A1 Aluminum chelate-based latent curing agents and process for preparation thereof
01/27/2011WO2011010047A1 Two part epoxy adhesive system having improved open time
01/27/2011WO2011009648A1 Catalysis of epoxy resin formulations having sparingly soluble catalysts
01/27/2011US20110021005 Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device
01/27/2011US20110020656 Process for Functionalizing Hard Material Particles
01/27/2011US20110020557 Polymerization of a Reactive Diluent in the Presence of an Epoxy-Amine Material, and Coating Compositions Prepared thereby
01/27/2011US20110020555 Epoxy resin compositions having improved low temperature cure properties and processes and intermediates for making the same
01/27/2011DE102009027825A1 Katalyse von Epoxidharzformulierungen mit schwerlöslichen Katalysatoren Catalysis of epoxy resin formulations with sparingly soluble catalysts
01/27/2011CA2768958A1 Fuel cell separator
01/27/2011CA2767927A1 Catalysis of epoxy resin formulations having sparingly soluble catalysts
01/26/2011EP2277963A2 Resin composition for precoated steel sheet having excellent workability, heat resistance and corrosion resistance, and precoated steel sheet manufactured using same
01/26/2011EP2276808A1 Improved moulding processes
01/26/2011EP2276787A1 Coating composition
01/26/2011EP2276770A1 Silylimidazolium salt complexes
01/26/2011EP2094758B1 Curable epoxy resin composition, cured body thereof, and use thereof
01/26/2011EP1867672B1 Epoxy resin composition
01/26/2011CN1661475B Photocuring resinoid compositio and printed circuit board using same
01/26/2011CN101959925A Curable reaction resin system
01/26/2011CN101959924A Modified reaction resin
01/26/2011CN101959923A Curable composition and color filter
01/26/2011CN101959922A Curable epoxy composition, anisotropic conductive material and connection structure
01/26/2011CN101959917A Novel chain elongators for polyurethane elastomer compositions
01/26/2011CN101426827B Adamantyl group-containing epoxy-modified (meth)acrylate and resin composition containing the same
01/26/2011CN101128504B Coating system
01/25/2011US7875697 Poly(orthoester) polymers, and methods of making and using same
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