| Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
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| 06/27/2002 | US20020082321 Thermosetting epoxy powder coatings having improved degassing properties |
| 06/27/2002 | US20020081505 A photosensitive material containing epoxides, cyclic or aromatic acrylic ester, a cationic photoinitiator, a free-radical photoinitiator, when exposed to actinic radiation shows specific mechanical properties |
| 06/27/2002 | US20020081434 Thermosetting resin composition composed mainly of a polycarbodiimide obtained from organic polyisocyanates |
| 06/27/2002 | US20020079051 Process for coating and laminating film using 100% solids adhesive at room temperature |
| 06/26/2002 | EP1216266A1 Transparent liquid resin material for smt-enabled led-applications at higher temperatures and higher luminosities |
| 06/26/2002 | EP1216265A1 Hydroxyaliphatic functional epoxy resins |
| 06/26/2002 | EP0755415B1 Epoxidized low viscosity rubber toughening modifiers for epoxy resins |
| 06/26/2002 | CN1355820A Process for preparation of reaction products of cycloaliphatic epoxides with multifunctional hydroxy compounds |
| 06/26/2002 | CN1355738A Process and apparatus for preparing composition using slurry feed |
| 06/26/2002 | CN1355726A Process and apparatus for preparing composition for matter utilizing ultrasonic device |
| 06/26/2002 | CN1086711C Aqueous epoxy composition |
| 06/25/2002 | US6410926 Determining the thickness of a dryable or curable film-forming coating by incorporating a fluorescent component into the coating. |
| 06/25/2002 | US6410801 Continuous process for the production of polyether polyols |
| 06/25/2002 | US6410658 Jeffamines? |
| 06/25/2002 | US6410617 Self-dispersing, hardenable epoxy resins, processes for producing the same and methods of using the same |
| 06/25/2002 | US6410127 Epoxy resin compositions, epoxy resin compositions for fiber-reinforced composite materials, and fiber-reinforced composite materials comprising the same |
| 06/25/2002 | US6409316 Thermal ink jet printhead with crosslinked polymer layer |
| 06/20/2002 | WO2002048236A1 Varnish for laminate or prepreg, laminate or prepreg obtained with this varnish, and printed circuit board made with this laminate or prepreg |
| 06/20/2002 | WO2002048235A1 Epoxy resins, process for production thereof, epoxy resin compositions and cured articles |
| 06/20/2002 | WO2002048234A2 Epoxy resins and process for making the same |
| 06/20/2002 | WO2002048226A1 Ultraviolet-curable resin composition and photosolder resist ink containing the composition |
| 06/20/2002 | WO2002036692A3 Coating composition |
| 06/20/2002 | WO2002009863A3 Microcapsule, method for producing the same, and the use thereof in adhesives |
| 06/20/2002 | WO2001090817A3 Data storage medium comprising colloidal metal and preparation process thereof |
| 06/20/2002 | US20020077422 Obtained by reacting 4,4'-dihydroxy-3,3',5,5'-tetramethylbiphenyl and an epihalohydrin in the presence of alkali metal compound; useful in electrical and electronic fields |
| 06/20/2002 | US20020077421 Adherent to the surface of silicon flip chips, especially polyimide resins and nitride films; shock resistance |
| 06/20/2002 | US20020076566 Ambient-temperature-stable, one-part curable epoxy adhesive |
| 06/20/2002 | DE10127704A1 Harzformulierung, Verfahren zu ihrer Härtung und ihre Verwendung Resin formulation, method of curing and their use |
| 06/19/2002 | EP1215723A1 Process for producing epoxy resin composition for photosemiconductor element encapsulation |
| 06/19/2002 | EP1215718A2 Novel high temperature underfilling material with low exotherm during use |
| 06/19/2002 | EP1214614A1 Photonic crystal materials |
| 06/19/2002 | EP1214191A1 Treated copper foil and process for making treated copper foil |
| 06/19/2002 | CN1354763A Resin composition for photofabrication of three dimensional objects |
| 06/19/2002 | CN1354199A Polyester composition and connector |
| 06/19/2002 | CN1086399C Photogeneration of amine by using alpha-amino acetophenone |
| 06/19/2002 | CN1086397C Method for preparing double metal cyanide complex catalysts |
| 06/18/2002 | US6407183 Liquid crystals; radiation transparent |
| 06/18/2002 | US6407150 Reacting phenolic compound and dicyclopentadiene, 4-vinylcyclohexene, 5-vinylnorborn-2-ene, a-pinene, or limonene in friedel-crafts catalyst presence; reacting epihalohydrin; good color tone, heat resistance; |
| 06/18/2002 | CA2154074C Urethane modified epoxy resin compositions |
| 06/18/2002 | CA2115533C Urethane modified epoxy resin compositions |
| 06/13/2002 | WO2002046507A2 Onium salts and the use therof as latent acids |
| 06/13/2002 | WO2002046264A1 Resin compound for forming interlayer insulating layer of printed wiring board, resin sheet and copper foil with resin for forming insulating layer using the resin compound, and copper-clad laminate using them |
| 06/13/2002 | WO2002046263A1 Resin formulation, method for curing the same, and its use |
| 06/13/2002 | WO2002022701A3 Method of preparing particulate crosslinked polymer |
| 06/13/2002 | WO2001094467A3 Soft polymer composition including epoxy |
| 06/13/2002 | US20020072576 Emulsifiable and/or soluble in water and which are employed in production of aqueous epoxy resin emulsions or dispersions |
| 06/13/2002 | US20020072575 Curing agents for expoxide compounds, method for their production and use of same |
| 06/13/2002 | US20020071955 Comprises ungelled reaction product of monohydroxy aromatic compound, aminoplast compound, hydrocarbon, and formaldeyde |
| 06/13/2002 | DE10060314A1 Epoxidverbindungen enthaltende Mischungen und ihre Verwendung Epoxide-containing compounds and their use |
| 06/13/2002 | CA2364933A1 Novel high temperature underfilling material with low exotherm during use |
| 06/12/2002 | EP1213334A1 Aqueous coating compositions with phosphonic acid based compounds |
| 06/12/2002 | EP1213314A1 Curing agents for curing epoxy resins |
| 06/12/2002 | EP1213313A2 Storage stable cationically polymerisable preparations with improved hardening characteristics |
| 06/12/2002 | EP1213312A1 Compositions containing epoxy resins and use thereof |
| 06/12/2002 | EP1082391B1 Thermosetting resinous binder compositions, their preparation and use as coating materials |
| 06/12/2002 | EP1073697B1 Epoxy/thermoplastic photocurable adhesive composition |
| 06/12/2002 | EP0964858B1 Process for the manufacture of epoxy compounds |
| 06/12/2002 | EP0925321B1 Prepolymers containing maleimid functions, method of producing and use thereof |
| 06/12/2002 | CN1353745A Waterborne sanitary can coating compositions |
| 06/11/2002 | US6403757 Modified polyamide resin obtained from reaction of acid anhydride compound with epoxy-terminated polyamide |
| 06/11/2002 | US6403715 Powder coating of epoxy resin and COOH- and ester-terminated anhydride |
| 06/11/2002 | US6403678 Rope of chemical anchoring adhesive |
| 06/11/2002 | US6403669 Alveolar materials that contain at least one thermoplastic polymer, at least one modified epoxide resin and at least one pore-forming agent |
| 06/11/2002 | US6403221 Epoxy resin containing phosphorus, phenolic curing agent, bisphenol s phenolic resin and accelerator; heat resistance; peeling strength |
| 06/11/2002 | US6403220 Phosphorus element-containing crosslinking agents and flame retardant phosphorus element-containing epoxy resin compositions prepared therewith |
| 06/11/2002 | US6403201 Substrate material for wiring and substrate material for printed circuit using the same |
| 06/06/2002 | WO2002044274A1 Liquid thermosetting resin composition, printed wiring boards and process for their production |
| 06/06/2002 | WO2002044273A1 Filled epoxy resin system having high mechanical strength values |
| 06/06/2002 | WO2002044241A1 Liquid epoxy resin composition for encapsulating material |
| 06/06/2002 | WO2002044240A1 Hydroxyl-group-containing polyether amine adducts |
| 06/06/2002 | WO2002004541A3 No-flow flux adhesive compositions |
| 06/06/2002 | US20020068223 Holographic storage medium comprising polyfunctional epoxy monomers capable of undergoing cationic polymerization |
| 06/06/2002 | US20020068174 Cold-curing; epoxide compounds, reactive epoxide thinner, epoxy-amine addition product with terminal amino groups and xylene-formaldehyde resin; solvent-free; low irritant potential, faultless surface; coatings for bathroom |
| 06/06/2002 | US20020068172 Specified polyol-modified amino group-containing epoxy resin; corrosion resistance; cationic electrodeposition |
| 06/06/2002 | US20020066528 Method of producing a laminated structure |
| 06/06/2002 | DE10058870A1 Wässriger Beschichtungsstoff, Verfahren zu seiner Herstellung und seine Verwendung Aqueous coating material, process for its preparation and its use |
| 06/06/2002 | CA2430074A1 Filled epoxy resin system having high mechanical strength values |
| 06/06/2002 | CA2429300A1 Hydroxyl-group-containing polyether amine adducts |
| 06/05/2002 | EP1210480A1 Method of producing paper, paperboard and cardboard |
| 06/05/2002 | EP1210394A1 Composition to be used in paints |
| 06/05/2002 | CN1086031C Thermal transfer compositions, articles and graphic articles made with same |
| 06/04/2002 | US6399277 Photopolymerizable thermosetting resin composition |
| 06/04/2002 | CA2034968C Rubber modified epoxy resin compositions |
| 05/30/2002 | WO2002042391A2 Extrusion freeform fabrication of soybean oil-based composites by direct deposition |
| 05/30/2002 | WO2002042387A1 Aqueous coating material, method for producing the same and use thereof |
| 05/30/2002 | WO2002042349A2 Hardener for epoxy of polyols and n-containing hardener |
| 05/30/2002 | WO2002019040A3 Holographic storage medium comprising polyfunctional epoxy monomers capable of undergoing cationic polymerization |
| 05/30/2002 | US20020065386 Glass transition temperature, low moisture absorption, adhesion |
| 05/30/2002 | US20020063239 Derivatives of cycloaliphatic diamines as cosolvents for aqueous hydrophobic amines |
| 05/30/2002 | US20020062926 Resin composition with excellent dielectric property |
| 05/30/2002 | US20020062919 Method of producing a laminated structure |
| 05/30/2002 | US20020062918 Adhesives and electric devices |
| 05/29/2002 | EP1209253A2 Process for treating adhesion promoted metal surfaces with epoxy resins |
| 05/29/2002 | EP1209211A1 Adhesive, adhesive member, circuit substrate for semiconductor mounting having adhesive member, and semiconductor device containing the same |
| 05/29/2002 | EP1209207A1 Resin composition and cationic electrodeposition coating composition |
| 05/29/2002 | EP1209200A2 Polyester composition and connector |
| 05/29/2002 | EP1208570A1 High voltage capable non-volatile low viscosity insulating resins |
| 05/29/2002 | EP1208128A1 Polyamines comprising urea groups, method for their production, and their use as hardeners for epoxide resins |
| 05/29/2002 | EP0964857B1 Process for the manufacture of epoxy compounds |
| 05/29/2002 | EP0929590B1 Hydroxy-phenoxyether polymer thermoplastic composites |