Patents
Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286)
01/2002
01/09/2002EP1169357A1 Hydroxy-epoxide thermally cured undercoat for 193 nm lithography
01/09/2002EP0785967B1 Increasing the molecular weight of polycondensates
01/09/2002CN1330694A Epoxy functional polyester resins having increased molecular weight, process for their preparation and outdoor durable coating compositions comprising them
01/09/2002CN1330686A Acrylic terpolymer for use as self-fixuring adhesive
01/09/2002CN1330676A Highly branched oligomers, process for their preparation and application thereof
01/08/2002US6337384 Mixing bismaleimide with furan compound with oxirane group to form diepoxy compound, adding amine curing agent
01/08/2002US6337363 Epoxy resin composition with non-halogen, non-phosphorus flame retardant
01/03/2002WO2002000791A1 Epoxy resin composition and cured object obtained therefrom
01/03/2002WO2002000758A1 Accelerators useful for energy polymerizable compositions
01/03/2002WO2002000757A1 Accelerators for cationic polymerization catalyzed by iron-based catalysts
01/03/2002WO2002000755A2 Epoxy resing and process for making the same
01/03/2002WO2002000667A1 Phosphorus-containing hydroquinone derivatives, process for their production, phosphorus-containing epoxy resins made by using the derivatives, flame-retardant resin compositions, sealing media and laminated sheets
01/03/2002WO2001053072A3 Laminate and process for producing a laminate of this type
01/03/2002WO2001046305A3 Recycling of articles comprising hydroxy-phenoxyether polymers
01/03/2002WO2001045941A3 Laminates and coated materials comprising hydroxy-phenoxyether polymers
01/03/2002US20020002244 Hard-rubber coatings for protection against corrosion
01/03/2002US20020002243 Biodegradable elastomer, item made of the same and production method of item
01/03/2002US20020002212 Epoxides, cycloepoxides, aromatic epoxides, having 1-18 carbon ateoms, wherein one or more carbon atoms can be replaced by ether, carbonyl, ester, silane, or amine
01/03/2002US20020001720 Adhesives; coatings; encapsulation
01/03/2002CA2412909A1 Epoxy resins and process for making the same
01/02/2002EP1167483A1 Adhesive tape for electronic parts
01/02/2002EP1167479A2 Underwater application of a paint
01/02/2002EP1167417A1 Flame-retardant vinyl esters, resins and resin compositions containing the same, and cured products thereof
01/02/2002EP1165708A1 Radiation curable water based cationic inks and coatings
01/02/2002EP1165688A1 Hardenable composition with a particular combination of characteristics
01/02/2002EP1165677A1 Compositions and methods for controlling stickies
01/02/2002EP1165647A1 Single component adhesive with an adaptable open joint time
01/02/2002EP1165627A1 Photopolymerizable vinyl ether based monomeric formulations and polymerizable compositions which may include certain novel spiroorthocarbonates
01/02/2002EP0861230B1 Liquid crystalline (meth)acrylate compounds, composition and method
01/02/2002CN1329642A Hydrophobic epoxide resin system
01/02/2002CN1329626A Epoxy functional polyester resins, process for their preparation, and outdoor durable coating compositions comprising them
01/02/2002CN1077121C Semiconductor encapsulating epoxy resin compositions and semiconductor devices encapsulated therewith
01/01/2002US6335423 Boroxine compositions
01/01/2002US6335389 Resin compositions for powdery coatings
01/01/2002US6335304 Coating formulation that is stable at room temperature, humidity resistant and non-yellowing
01/01/2002CA2220531C Flame resistant polyester resin composition
01/01/2002CA2026015C Polymeric compositions and components therefore
12/2001
12/27/2001WO2001098428A1 Adhesive for resin roll assembly and resin roll
12/27/2001WO2001098411A1 Sealing material for plastic liquid crystal display cells
12/27/2001US20010056174 Polyimide derived from a dianhydride and diamine having hydroxyl or carboxyl groups, which are modified with a diepoxide or unsaturated group-containing epoxide; curable; heat resistance, dielectric, film-forming
12/27/2001US20010056137 Aqueous two-component cross-linkable composition
12/27/2001US20010055461 Method for producing an optical waveguide
12/26/2001CN1328588A Impact-resistant epoxide resin compositions
12/26/2001CN1328071A Process for modifying epoxy resin by organosilicon
12/25/2001US6333425 Ionic compounds derived from malononitrile in which anionic charge is delocalized; excellent properties of solubility and dissociation
12/25/2001US6333383 And an epoxidized block copolymer of butadiene-styrene; excellent in moldability, improved in transparency and impact resistance
12/25/2001US6333369 Coating a resin for transfer printing, epoxy resins, hardener, acceleration and solvents, mixing with triethanol amine and diethanolamine and hardening
12/25/2001US6333102 Expandable reinforcing sheet material for vehicle outer panel
12/20/2001WO2001096452A2 Method for making or adding structures to an article
12/20/2001WO2001096440A1 Epoxy resin composition and laminate using the same
12/20/2001WO2001072869A3 Mannich bases and further compounds based on alkyldipropylenetriamines as hardeners for epoxy resins
12/20/2001US20010053818 Polyadducts produced from nonlinear-optically active copolymers and polymerizable nonlinear-optically active monomers
12/20/2001US20010053817 Curable; radiation transparent
12/20/2001US20010053448 Thermosetting resin composition
12/20/2001US20010053437 Cured film of acid- modified, vinyl group-containing epoxy resin, and an elastomer; heat resistance, humidity resistance adhesibility, mechanical characteristics, given elastic modulus
12/20/2001US20010053426 Sealing agent for liquid crystal display and liquid crystal deisplay using the sealing agent
12/20/2001US20010052588 Such as isophoronediamine, diaminocyclopentane, and diaminocyclohexane
12/19/2001EP1163288A2 Heat-curable, thermally expandable moulded part
12/19/2001EP1163280A1 Epoxy resin compositions having a long shelf life
12/19/2001EP1115519A4 Foundry binder of epoxy resin, acrylated polyisocyanate and acrylic monomer and/or polymer; and cold-box process
12/19/2001EP0767931B1 Increasing the useful range of cationic photoinitiators in stereolithography
12/19/2001CN1327552A Rapid on chip voltage generator for low power integrated circuit
12/19/2001CN1327457A Hardener for epoxy resin and epoxy resin composition
12/19/2001CN1327020A Connection material and connection structure body
12/19/2001CN1327019A Solidifying composition for prestress concrete steel bar and steel bar
12/19/2001CN1076379C Curable binder for pressure sensitive adhesives and seal glue adhesive and seal glue containing said binder
12/19/2001CN1076361C Flame retardant polymer compositions comprising thermally stable resins
12/18/2001US6331583 Acid catalyzed polymerization of aqueous epoxy resin emulsions and uses thereof
12/18/2001CA2050114C Compositions suitable as binders and their use in coating and sealing compositions
12/18/2001CA2041831C N-glycidyl compound
12/13/2001WO2001094467A2 Soft polymer composition including epoxy
12/13/2001WO2001094435A1 Glyoxal-phenolic condensates with enhanced fluorescence
12/13/2001WO2001000698A3 Poly(mercaptopropylaryl) curatives
12/13/2001WO2000001750A3 Thermally stable polyetheramines
12/13/2001EP1144470A3 Thermally stable polyetheramines
12/13/2001CA2407650A1 Glyoxal-phenolic condensates with enhanced fluorescence
12/12/2001EP1162228A1 Epoxy resin composition for fiber-reinforced composite material, prepreg, and fiber-reinforced composite material
12/12/2001EP1162225A1 Hardener for epoxy resin and epoxy resin composition
12/12/2001EP1162224A2 Curable composition for tendon for prestressed concrete and tendon
12/12/2001EP1159342A4 Storage-stable compositions useful for the production of structural foams
12/12/2001EP0923587B1 Adduct of an epoxy compound and cyclic phosphite
12/12/2001CN1326477A Curable coating compositions
12/11/2001US6329492 Useful as material for encapsulating electronic devices, for lamination or for adhesion; curing agent for epoxy resins
12/11/2001US6329474 For printed wiring boards; heat resistance, hydrophobic; corrosion resistance, discoloration inhibition
12/11/2001US6329473 Used as coating for crack bridging, as an adhesive and in powder surface coatings
12/11/2001CA2028673C Thermoplastic resin composition
12/06/2001WO2001092368A1 Epoxy resin composition for fiber-reinforced composite material
12/06/2001WO2001092367A1 Powder compositions for heat sensitive substrates
12/06/2001US20010049023 Composition for providing an abrasion resistant coating on a substrate
12/06/2001US20010049009 Halogen-free, flame-retardant insulating epoxy resin composition and circuit board comprising insulation layer formed thereof
12/06/2001CA2408653A1 Powder compositions for heat sensitive substrates
12/05/2001EP1160857A2 Epoxy-based adhesive for mounting a semiconductor device on a substrate
12/05/2001EP1159342A1 Storage-stable compositions useful for the production of structural foams
12/05/2001EP0935628B1 Copolymer of styrene and maleic anhydride comprising an epoxy resin composition and a co-cross-linking agent
12/05/2001CN1075823C Low VOC laminating formulations
12/04/2001CA2195014C Positive photoactive compounds based on 2,6-dinitrobenzyl groups
11/2001
11/29/2001WO2001090817A2 Data storage medium comprising colloidal metal and preparation process thereof
11/29/2001WO2001090211A1 Composition based on renewable raw materials
11/29/2001US20010047062 Impact strength, flexibility
11/29/2001US20010046642 Polyepoxide compounds, cationic photoinitiator, unsaturated hydroxy-functional compound, a saturated hydroxy compound, a poly(meth)acrylate compound, and a liquid cyclic di- acrylate having no hydroxy groups, diluent; no free radical initiator