| Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
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| 02/12/2002 | US6346582 Curable coating composition comprising composition prepared by glycidating at least one carboxy polyfunctional polyester, at least one alpha, alpha-branched monocarboxylic acid having tertiary carbon atom or glydicyl ester thereof, curing agent |
| 02/12/2002 | US6346573 Amine-modified epoxy resin reacted in presence of latent hardener |
| 02/12/2002 | US6346331 Radiation transparent |
| 02/12/2002 | US6346329 Curable resin composition |
| 02/12/2002 | US6346292 Coating and heat curing on steel surface |
| 02/12/2002 | US6346170 Paper containing composition comprising water soluble, azetidinium ion-containing polyamidoamine/epichlorohydrin resin bearing polyol sidechains attached to resin by carbon-nitrogen bond |
| 02/07/2002 | WO2002009863A2 Microcapsule, method for producing the same, and the use thereof in adhesives |
| 02/07/2002 | US20020016411 Epoxy resin comprising reactive silicon group- containing polyoxyalkylene polymer with a copolymer having alkyl acrylate monomers, and curing agent; peel strength |
| 02/07/2002 | US20020016398 Semiconductor encapsulating epoxy resin composition and semiconductor device |
| 02/07/2002 | US20020015893 Gel electrolyte solution of a crosslinked polymer |
| 02/07/2002 | US20020014706 Epoxy resin composition to seal semiconductors and resin-sealed semiconductor device |
| 02/06/2002 | EP1178065A1 Composition based on renewable raw materials |
| 02/06/2002 | EP1001852A4 Polymerizable fluxing agents and fluxing adhesive compositions therefrom |
| 02/06/2002 | CN1334305A Viscous and amine-cured chemical anchoring adhesive |
| 02/06/2002 | CN1334304A Chemical canchoring adhesive rope |
| 02/06/2002 | CN1334303A Adhesive tape for electronic component |
| 02/06/2002 | CN1334301A Coating composition for optic waveguide and optic waveguide coated therewith |
| 02/06/2002 | CN1334292A Epoxy resin composition for packaging semiconductor and resin packaged semiconductor device |
| 02/06/2002 | CN1078904C Powder coating hardener |
| 02/05/2002 | US6344526 Fluorine-containing epoxy resin composition, and surface modification process, ink jet recording head and ink jet recording apparatus using same |
| 02/05/2002 | US6344154 Reactive liquid crystal compounds |
| 02/05/2002 | US6344152 Such as isophoronediamine, diaminocyclopentane, and diaminocyclohexane |
| 02/05/2002 | CA2253432C Diglycidyl ether |
| 02/05/2002 | CA2226675C Acid composition comprising a coated polyvalent carboxylic acid solid particle and a powder coating comprising the same |
| 02/05/2002 | CA2058364C Thermosetting coating composition and coated article |
| 01/31/2002 | WO2002008309A2 Use of cross-linker and compositions made therefrom |
| 01/31/2002 | WO2001072919A3 Anisotropically conductive adhesive composition and anisotropically conductive adhesive film formed from it |
| 01/31/2002 | WO2001070867A3 Flame retardant epoxy molding compositions |
| 01/31/2002 | US20020013449 High strength polymers and aerospace sealants therefrom |
| 01/31/2002 | US20020013425 Polymerizable compositions |
| 01/31/2002 | US20020013420 Polyepoxides; electronic packages |
| 01/31/2002 | US20020013380 Photopolymerizable vinyl ether based monomeric formulations and polymerizable compositions which may include certain novel spiroorthocarbonates |
| 01/31/2002 | US20020011308 7575654 not granted per USPTO |
| 01/31/2002 | US20020011190 Curable composition for tendon for prestressed concrete and tendon |
| 01/30/2002 | EP1176180A1 Viscous and amine-cured chemical anchoring adhesive |
| 01/30/2002 | EP1176179A2 Rope of chemical anchoring adhesive |
| 01/30/2002 | EP1176176A2 Fine textured powder coatings for wood substrates |
| 01/30/2002 | EP1176175A2 Matte texture powder coatings |
| 01/30/2002 | EP1176171A2 Dielectric material and method of manufacture thereof |
| 01/30/2002 | EP1176160A2 Water soluble active sulfones of poly(ethylene glycol) |
| 01/30/2002 | EP1176159A1 Thermosetting resin composition and flexible-circuit overcoating material comprising the same |
| 01/30/2002 | EP1175465A1 Flowable powder coating composition |
| 01/30/2002 | EP1151365A4 Rapid on chip voltage generation for low power integrated circuits |
| 01/30/2002 | EP0942949B1 Gas barrier coating compositions containing platelet-type fillers |
| 01/30/2002 | EP0911326B1 Diglycidyl ethers |
| 01/30/2002 | EP0847419B1 Composition comprising coated acid particles and powder coating comprising the same |
| 01/30/2002 | EP0469037B1 Aqueous coating composition |
| 01/30/2002 | CN1333794A Partial oxidation of polyoxyalkylene polyol compositions to polycarboxylic acid compositions |
| 01/29/2002 | US6342577 Between semiconductor and printed circuit; epoxy resin and latent hardener comprising cyanate ester and imidazole |
| 01/29/2002 | US6342309 Epoxy resin, curing agent, inorganic filler and catalyst |
| 01/29/2002 | US6342274 Clear powder coating |
| 01/29/2002 | CA2093322C Epoxy resins based on diaminobisimide compounds |
| 01/24/2002 | WO2002006398A1 Volume-modified casting compounds based on polymeric matrix resins |
| 01/24/2002 | WO2002006371A2 Radiation-curable compositions and cured articles |
| 01/24/2002 | WO2002006038A2 Method of manufacturing a replica as well as a replica obtained by carrying out a uv light-initiated cationic polymerization |
| 01/24/2002 | WO2001046495A3 Coated metal substrates and methods for preparing and inhibiting corrosion of the same |
| 01/24/2002 | US20020010289 Epoxy resins |
| 01/24/2002 | US20020010288 Copper clad laminates |
| 01/24/2002 | US20020010287 Latency curing agents; storage stability |
| 01/24/2002 | US20020010286 Multifunctional cyanate ester and epoxy blends |
| 01/24/2002 | US20020010284 Electrodepositon coatings; corrosion resistance |
| 01/24/2002 | US20020010270 Silicone amino-epoxy cross-linking system |
| 01/24/2002 | US20020010266 Thermosetting compositions containing epoxy functional polymers prepared by atom transfer radical polymerization |
| 01/24/2002 | US20020010231 Especially an amino- ethanol or propanol-capped ethylene oxide or propylene oxide adduct reacted with an epoxy resin from a diglycidyl ether of a polyoxypropylene glycol and bisphenol A; may contain an oxazoline ring; dimer acid |
| 01/24/2002 | US20020009654 Pigment dispersion composition for color filter, production method thereof, and color filter for display |
| 01/24/2002 | US20020009650 High electroconductivity |
| 01/24/2002 | US20020009597 Heat curing an epoxy resin, a phenol compound having two or more phenolic hydroxyl groups and a latent curing agent; shrinkage inhibition; used in mounting of semiconductor devices, such as an LSI circuit, on a circuit substrate |
| 01/24/2002 | US20020009581 Epoxy resin composition for a fiber-reinforced composite material, yarn prepreg, and process and apparatus for preparing the same |
| 01/24/2002 | US20020007910 Thermosettable pressure sensitive adhesive |
| 01/24/2002 | CA2415707A1 Radiation-curable compositions and cured articles |
| 01/23/2002 | EP1174481A2 One-part, heat-cured epoxy adhesive |
| 01/23/2002 | EP1174478A2 Low temperature curing, sag-resistant epoxy primer |
| 01/23/2002 | EP1174456A2 High tg potting compound |
| 01/23/2002 | EP1174455A1 Epoxy resin composition for encapsulating semiconductor |
| 01/23/2002 | CN1332778A Sealant compositions and sealant articles using the same |
| 01/23/2002 | CN1332759A Accelerators useful for energy polymerizable compositions |
| 01/22/2002 | US6340721 Flame-retardant thermoplastic resin composition |
| 01/22/2002 | CA2048320C Process for the preparation of pigment paste resins for cathodically depositable coating compositions |
| 01/18/2002 | CA2351963A1 One-part, heat cured epoxy adhesive |
| 01/17/2002 | WO2002004542A2 High functional polymers |
| 01/17/2002 | WO2002004541A2 No-flow flux adhesive compositions |
| 01/17/2002 | WO2001051540A3 Polymerizable preparations based on epoxies that contain silicon |
| 01/17/2002 | US20020007022 Thermosetting resin, compound containing one functional group which can react with thermosetting resin or its curing agent; sports applications, aerospace applications, industrial applications |
| 01/17/2002 | US20020006484 Adhesive and coating formulations for flexible packaging |
| 01/17/2002 | CA2412574A1 High functional polymers |
| 01/16/2002 | EP1172408A1 Volume modified casting masses based on polymer matrix resins |
| 01/16/2002 | EP1172393A1 Curable resin composition, process for producing the same, and coated object made with the same |
| 01/16/2002 | EP1172391A1 Coating compositions for optical wave guides and optical waveguides coated therewith |
| 01/16/2002 | EP1172192A2 A curing method to cure epoxy resins in a short time, and a method for absorbing electromagnetic wave through cured epoxy resins obtained by said curing method |
| 01/16/2002 | EP1171502A1 Resin composition for photofabrication of three dimensional objects |
| 01/16/2002 | EP1005509B1 Conductive epoxy resin compositions, anisotropically conductive adhesive films and electrical connecting methods |
| 01/16/2002 | CN1331720A Thermally stable polyetheramines |
| 01/15/2002 | US6339114 Liquid crystalline (meth)acrylate compounds, composition and method |
| 01/15/2002 | US6338869 Coating composition |
| 01/11/2002 | CA2352835A1 A curing method to cure epoxy resins in a short time, and a method for absorbing electromagnetic wave through cured epoxy resins obtained by said curing method |
| 01/10/2002 | WO2002002666A1 Low moisture absorption epoxy resin systems |
| 01/10/2002 | US20020004562 Thermosetting resin composition |
| 01/10/2002 | US20020004557 Blend of polyepoxy and acrylic polymers |
| 01/09/2002 | EP1170317A1 Curable compositions on the basis of glycidyl compounds, amine curing agents and low viscosity curing accelerators |
| 01/09/2002 | EP1169395A1 Matting agents for thermally curable systems |