| Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
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| 05/29/2002 | EP0869983B1 Branched epoxide functional polyester |
| 05/29/2002 | CN1351092A Midezole-phosphate as accelerator for dicyandiamide in epoxy composition in a separated container |
| 05/29/2002 | CN1351091A 2-phenylmidezole-phosphate as accelerator for acid anhydride curing agent in epoxy composition in a separated container |
| 05/29/2002 | CN1085689C Water soluble active sulfones of poly(ethylene glycoL) and relative polymer for modifying surface and molecule of substances |
| 05/28/2002 | US6395845 Comonomers of long chain dicarboxylic acid and aminoalkylpiperazine; polyamine, filler; roofing, ponds, swimming pool liners, bridges |
| 05/28/2002 | US6395828 Blend containing acrylate-styrene-acrylonitrile interpolymer; weatherproof; computer housings, appliances, automobiles |
| 05/28/2002 | US6395806 Ester interchange of a,b-usaturated carboxylic acid ester and alcohol; reacting with aminopolyoxyalkylene oxide; reaction with polyepoxide and primary or secondary amine; chemical and acid resistant coatings |
| 05/28/2002 | US6395452 Photoresist ink |
| 05/28/2002 | US6395367 Electroconductivity |
| 05/28/2002 | US6395340 Coating composition and method for coating therewith |
| 05/28/2002 | US6395124 Providingstructure comprising at least two layers and a photopolymerizable adhesive between layers; directing actinic radiation within identified spectral region to cure photopolymerizable adhesive and form laminate structure |
| 05/27/2002 | CA2363788A1 Resin composition and cationic electrodeposition coating composition |
| 05/23/2002 | WO2002041079A2 Positive type photosensitive epoxy resin composition and printed circuit board using the same |
| 05/23/2002 | WO2002040589A1 Thermally conductive casting compound |
| 05/23/2002 | WO2002000755A3 Epoxy resing and process for making the same |
| 05/23/2002 | US20020061972 Safe and consistant filling of end use containers of one component heat curable, solvent free, hot melt epoxy resin compositions which have a melting point less than 55 degrees C. |
| 05/23/2002 | US20020061971 One-pack type epoxy resin composition and cured epoxy resin |
| 05/23/2002 | US20020061970 Polyurethanepolyol reacted with a hydroxycarboxylic acid and an epoxy compound; curing agent; water resistance, a solvent resistance and an adhesive property. |
| 05/23/2002 | US20020061942 Resin composition |
| 05/23/2002 | US20020061941 Aqueous resin composition |
| 05/23/2002 | US20020061364 Fuser member coating composition and processes for providing elastomeric surfaces thereon |
| 05/23/2002 | CA2427923A1 Positive type photosensitive epoxy resin composition and printed circuit board using the same |
| 05/22/2002 | EP1207424A1 Photosolder resist composition |
| 05/22/2002 | EP1207187A1 Aqueous binder based on Epoxy Resins |
| 05/22/2002 | EP1206496A1 Semi-interpenetrating networks comprising polyepoxides |
| 05/22/2002 | CN1350045A Binder and electric apparatus |
| 05/22/2002 | CN1350037A Photo-curing composition and its curing method |
| 05/22/2002 | CN1350032A Epoxy resin composition and method of producing the same |
| 05/22/2002 | CN1350026A Phenol curing agent for epoxy resin and epoxy resin composition using said curing agent |
| 05/22/2002 | CN1350019A Terpine-epoxypropane chloride copolymer and its prepn |
| 05/21/2002 | US6392006 Condensation polymer containing hydroxyalkylamide groups |
| 05/21/2002 | US6392003 Flame retardant |
| 05/21/2002 | US6391979 Reacting p-hydroxystyrene and epichlorhydrin |
| 05/21/2002 | US6391970 Polyesterurethane copolymer |
| 05/21/2002 | US6391436 Modified epoxy resin impregnated unidirectional glass, quartz, polyamide, carbon or graphite fibers; prepreg; aerospace; aircraft |
| 05/21/2002 | US6391391 Coating substrate with atom transfer radical polymerized carboxyl polymer and polyepoxide |
| 05/16/2002 | WO2002008309A3 Use of cross-linker and compositions made therefrom |
| 05/16/2002 | WO2001079374A3 Stabilized cationically polymerizable composition, and adhesive film and conductor circuit comprising the same |
| 05/16/2002 | US20020058778 Used as an underfilling sealant between such a semiconductor device and a circuit board to which the semiconductor device is electrically connected |
| 05/16/2002 | US20020058756 Underfill sealants with improved adhesion, improved resistance to moisture absorption and improved resistance to stress cracking |
| 05/16/2002 | US20020058742 As underfill for flip-chip type semiconductor devices for optical communications |
| 05/16/2002 | US20020058210 A fluorine-containing epoxy resin having in one molecule at least one perfluoroalkyl group having 6 to 12 carbon atoms and atleast two alicyclic epoxy groups, and a cationic polymerization catalyst |
| 05/16/2002 | US20020058145 Light-transmissive epoxy resin composition and semiconductor device |
| 05/16/2002 | DE10054504A1 Production of high-molecular weight cyclic dicarboxylic acid for use e.g. in epoxy coating material, involves reacting diacid anhydride with diol to form a half-ester and then reacting with more anhydride, using a cyclic reactant |
| 05/15/2002 | EP1205504A1 Thermosetting epoxy powder coatings having improved degassing properties |
| 05/15/2002 | EP1204691A1 Solvent-free, room temperature curing reactive systems and the use thereof in the production of adhesives, sealing agents, casting compounds, molded articles or coatings |
| 05/15/2002 | EP0846137B1 Aminourethane accelerators, epoxy-based coating materials containing them and the use of such coating materials |
| 05/15/2002 | CN1348972A Method for prodn. of epoxy resin composite used for optical semiconductor sealing |
| 05/14/2002 | US6388024 Acid functional and epoxy functional polyester resins |
| 05/14/2002 | US6387990 Blend containing thermoplastic resin |
| 05/14/2002 | US6387989 Using a,b-unsaturated carboxylic acid ester |
| 05/14/2002 | US6387988 Epoxy resin hardener from aminopolyalkylene oxide/unsaturated ester, polyepoxide and amine |
| 05/14/2002 | US6387987 Acetylide-form propargyl-containing resin composition for cationic electrocoating |
| 05/14/2002 | US6387975 Organometallic compound complex |
| 05/14/2002 | US6387506 Resin composition for paper-coating, coating composition for paper and coated paper |
| 05/14/2002 | US6387505 Prepreg which is composed of mixture of polycarbodiimide resin and epoxy resin and which has film shape |
| 05/14/2002 | US6387496 Condensation polymer containing hydroxyalkylamide groups |
| 05/14/2002 | US6387486 Crosslinked poly(alkylene oxide) release layer |
| 05/14/2002 | US6387310 Thermosetting resin composition for prestressed concrete tendon, its use and prestressed concrete tendon using the composition |
| 05/14/2002 | CA2049854C Binder compositions and their use in coating compositions and sealing compositions |
| 05/10/2002 | WO2002036692A2 Coating composition |
| 05/10/2002 | WO2002036343A1 Process for coating and laminating film using 100% solids adhesive at room temperature |
| 05/10/2002 | WO2002006038A3 Method of manufacturing a replica as well as a replica obtained by carrying out a uv light-initiated cationic polymerization |
| 05/10/2002 | WO2002004542A3 High functional polymers |
| 05/10/2002 | WO2001046303A3 Hydroxy-phenoxyether polymer/fiber composites and foams |
| 05/09/2002 | US20020055609 Reacting cyclic anhydride (phthalic anhydride) with alkanolamine to form beta-substituted hydroxyalkylamide which is polycondensed to form polyester amide; useful in thermosetting powder paint compositions |
| 05/09/2002 | US20020055605 Reacting diamine and alkenyl compound in presence of strong base catalyst to form amino compound useful as curing agent for epoxy resins; pot life |
| 05/09/2002 | US20020055550 Containing units from 4,4'-(9H-fluoren-9-ylidene) bis((2-propenyl) phenol) |
| 05/09/2002 | US20020053302 Epoxy resin composition for encapsulating semiconductor, and resin-encapsulated type semiconductor apparatus |
| 05/08/2002 | EP1203792A1 Resin composition for semiconductor encapsulation, semiconductor device obtained with the same, and process for producing semiconductor device |
| 05/08/2002 | EP1203782A1 Imidazole-Phosphoric acid salts as accelerators for dicyandiamide in one-component epoxy compositions |
| 05/08/2002 | EP1203781A1 2-phenylimidazole-phosphoric acid salt as an accelerator for acid anhydride curatives in one-component epoxy compositions |
| 05/08/2002 | EP1203515A1 Thermosetting polymer systems and electronic laminates |
| 05/08/2002 | EP1203033A1 Composition that hardens with visible light and use thereof |
| 05/08/2002 | EP1203029A1 Process for the continuous production of gel free polymers, and powder and liquid coating applications containing gel free polymers |
| 05/08/2002 | CN1348481A Resin composition for semiconductor encapsulation, semiconductor device obtained with the same, and process for producing semiconductor device |
| 05/08/2002 | CN1084348C Water-based epoxy resin composition and its water-based coating composition |
| 05/07/2002 | US6384152 Insulating resin of epoxy resin, epoxy diluent, phenolic accelerator and organotin catalyst |
| 05/07/2002 | US6384134 Polymer gel composition comprising maleated polyalkylene grated via grafting agent to poly(alkenyl-co-maleimide), epoxy polymer, and optionally, extender; vibration damping material |
| 05/07/2002 | US6383659 Autopolymerizable epoxy resin or curable phenolic resin; semiconductor packaging; filler, curing catalyst, and thermoplastic resin |
| 05/07/2002 | US6383643 Copper alloy; cured epoxy resin coating; wear resistance; automobiles; plumbing, housings |
| 05/02/2002 | WO2002034846A1 Coating composition and method of can inside coating |
| 05/02/2002 | WO2002034832A1 Epoxy resin composition and its use |
| 05/02/2002 | WO2002034812A1 High functional polymers |
| 05/02/2002 | WO2002034714A1 Base-proliferating prepolymers |
| 05/02/2002 | WO2002034418A2 Method for producing a multilayer coating and the use thereof |
| 05/02/2002 | WO2001046523A3 Hydroxy-phenoxyether polymers in papermaking |
| 05/02/2002 | US20020051942 Photo-or heat-curable resin composition and multilayer printed wiring board |
| 05/02/2002 | EP1201650A2 Ionic malonitril derivatives and their uses |
| 05/02/2002 | EP1200533A1 Method of producing a laminated structure |
| 05/02/2002 | EP1200502A1 Amine hardener for epoxy resins |
| 05/02/2002 | EP1200498A1 Method and materials for fabrication of alumoxane polymers |
| 05/02/2002 | EP1200036A1 Adhesive systems |
| 05/02/2002 | EP0942944B1 Multilayer packaging material for oxygen sensitive food and beverages |
| 05/02/2002 | EP0894097A4 Radiation curable rheology modifiers |
| 05/02/2002 | EP0877769B1 Process for coating a heat-sensitive substrate by using a storage-stable moulding powder based on epoxy resins |
| 05/02/2002 | DE10052438A1 Verfahren zur Erzeugung einer Mehrschichtlackierung Method for producing a multi-layer coating |
| 05/02/2002 | CA2422897A1 High functional polymers |
| 05/01/2002 | CN1347439A Flowable powder coating composition |
| 05/01/2002 | CN1346859A Cationic paint composition |