Patents
Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286)
11/2001
11/29/2001DE10025356A1 Hartgummi-Beschichtungen für den Korrosionsschutz Hard Rubber coatings for corrosion protection
11/28/2001EP1158012A1 Ebonite coatings for corrosion resistance
11/28/2001EP1157075A1 Sealant compositions and sealant articles using the same
11/28/2001EP1157057A1 Accelerators useful for energy polymerizable compositions
11/28/2001EP1156765A1 Hemostatic polymer useful for rapid blood coagulation and hemostasis
11/28/2001CN1324372A Curable epoxy resin compositions
11/28/2001CN1324123A 锂电池 Lithium Battery
11/28/2001CN1075525C One-pack epoxy resin composition, one-pack corrosion-resistant paint composition, and coating method using said comositions
11/27/2001US6323306 Adding to aqueous solution of an amine functionalized cationic base polymer cross-linking agent reactive with primary, secondary or tertiary amines of base polymer to form higher molecular weight polymer
11/27/2001US6323264 Corrosion barrier coating composition
11/27/2001US6323263 Epoxy resin with curing agent and inorganic filler
11/27/2001US6322892 Cation-polymerizable coating composition
11/27/2001CA2179712C Crosslinked polymeric ammonium salts
11/22/2001WO2001088959A2 No-flow reworkable epoxy underfills for flip-chip applications
11/22/2001WO2001088053A1 Rigid substrate lamination adhesive
11/22/2001WO2001088047A1 Corrosion resistant coatings
11/22/2001WO2001088034A1 Thermosetting composition
11/22/2001WO2001088033A1 Sound deadening and structural reinforcement compositions and methods of using the same
11/22/2001WO2001088013A2 Process for manufacturing a hydroxyester derivative intermediate and epoxy resins prepared therefrom
11/22/2001CA2409750A1 Sound deadening and structural reinforcement compositions and methods of using the same
11/22/2001CA2403560A1 Corrosion resistant coatings
11/21/2001EP1156085A1 Binders for use in cathodic electrodeposition coatings, process for their preparation and cathodic electrodeposition coating compositions containing same
11/21/2001EP1155063A1 Epoxy compounds for dental medical and/or dental technical applications
11/21/2001EP1155022A1 Phosphorus-comprising materials, their preparation and use
11/21/2001EP0917547B1 Polyglycidyl ethers of secondary alcohols
11/21/2001CN1075044C Glass fibre size composition, method using the same composition and resulted products
11/20/2001US6320020 Polymer or copolymer containing a sulfur atom whose principal backbone comprises ether and/or thioether bonds; optical disk substrate; a liquid-crystal plastic substrate; various optical lenses including an eyeglass; and an led sealing coat.
11/20/2001US6320013 Heating: a heavy oil or pitch of given average molecular weight; formaldehyde or a formaldehyde precursor; and an allylphenol with stirring in the presence of an acid catalyst
11/20/2001US6319967 Thermosetting compositions containing epoxy-functional polymers prepared using atom transfer radical polymerization
11/20/2001US6319652 To form cured resin having dimensional stability, humidity absorption, chemical resistance; for stereolithography
11/20/2001US6319603 Poly(meth)acrylate polymer with epoxy groups, ring opening polymerization monomer with glycidyl groups, cationic initiators and free radical photoinitiators
11/20/2001US6319557 Coating composition and method for application thereof
11/20/2001US6319428 Perfluorinated amide salts and their uses as ionic conducting materials
11/20/2001CA2041833C A process for the preparation of n,n,n',n'-tetraglycidyl-3,3'-dialkyl-4,4'-diaminodiphenylmethanes
11/20/2001CA2025831C Radiation-polymerizable mixture and process for producing a solder resist mask
11/15/2001US20010041784 Process for producing a lens by polymerizing bis(beta-epithiopropyl) ether
11/15/2001US20010041782 Novel latent curing agent and moisture-curable epoxy resin composition
11/14/2001EP1153980A1 Epoxy resin composition
11/14/2001EP1153952A1 Sealing agent for liquid-crystal display cell, composition for sealing agent for liquid-crystal display cell, and liquid-crystal display element
11/14/2001EP1153941A1 Polymer and epoxy resin compositions
11/14/2001EP1153905A1 Novel crystalline ion-association substance, process for producing the same, and polymerization initiator
11/14/2001EP1153057A1 Self-dispersible hardenable epoxide resins
11/14/2001CN1322219A Method for producing vinyl compounds
11/14/2001CN1322156A Foundry binder of epoxy resin, acrylated polyisocyanate and acrylic monomer and/or polymer, and cold-box process
11/14/2001CN1321694A Epoxy resin solidified microsphere water-base system and its preparation method
11/14/2001CN1074773C Aqueous dispersion and composition prepared therefrom
11/14/2001CN1074705C Coated abrastive article and method of making same
11/13/2001USRE37448 Free from epoxy groups; reaction product of an epoxide and a carboxyl- and ester-group-containing compound formed from 1) dicarboxylic acid and 2)(meth)acrylated polyol containing ethylene oxide groups
11/13/2001US6316583 Fluorescence, ultraviolet radiation absorbance and solubility in organic solvents, can be epoxidized to form epoxy products whicha are used in manufacture of laminates, coatings, and adhesives
11/13/2001US6316529 Used for elastic bridging of cracks; chemical resistance
11/13/2001US6316109 Reaction product of; polyhydric aromatic compound and an aminotriazine compound having one or less non-alkylated nh bond per triazine ring;, is essentially free of hydroxyl functionality; contains benzoxazine groups
11/13/2001US6316049 Epoxy resin; curative which is an optionally substituted methylenedisalicylic acid; boron trifluoride:amine complex is used as the cure catalyst.
11/08/2001WO2001083629A1 Method of bonding adherend
11/08/2001WO2001083627A1 Water-based coating composition curable with actinic energy ray, coated metallic material with cured film of the composition, production process, and method of bonding coated metallic material
11/08/2001WO2001083618A1 Blends of polyarylether sulphone and polyamide, with improved viscosity and flowability
11/08/2001WO2001083607A1 Rheology-controlled epoxy-based compositions
11/08/2001WO2001083580A2 Polymerizable composition, cured material thereof and method for manufacturing the same
11/08/2001US20010039305 Lubricating coating compound, sliding structure combining two sliding members in which lubricating coating compound is applied to one of the sliding members, and slide bearing apparatus using the same
11/08/2001US20010039300 Photo-curable resin composition, process for producing the same and products using the same
11/08/2001US20010038965 Cresol or xylenol resin that has been esterified with 1,2-naphthoquinonediazide-4 or 5-sulfonic acid
11/07/2001EP1151854A1 Process for aqueous coating
11/07/2001EP1151365A1 Rapid on chip voltage generation for low power integrated circuits
11/07/2001EP1151046A1 Epoxy functional polyester resins having an increased molecular weight, process for their preparation, and outdoor durable coating compositions comprising them
11/07/2001EP1151025A1 Epoxy resin system
11/07/2001EP1151021A1 Initiator compositions and methods for their synthesis and use
11/07/2001EP1115768A4 Epoxy curing agent of phenol-aldehyde reacted with polyamine
11/07/2001EP0853774B1 Holographic medium and process
11/06/2001US6313257 Poly (mercaptopropylaryl) curatives
11/06/2001US6313250 Polyfunctionally reactive polymer substances
11/06/2001US6313221 Powder coating of epoxy-acrylic resin, polycarboxylic acid, crosslinked particles and liquid resin
11/06/2001US6313188 Photocationically polymerizable composition comprising a polycyclic aromatic compound
11/06/2001US6312829 Epoxy resin and resin-sealed type semiconductor apparatus
11/06/2001US6312826 Cross-linked drying oil or cross-linked, functionally modified drying oil
11/06/2001US6312812 First pretreatment composition including a transition element compound of a group 3b, 4b or lanthanide element; second pretreatment composition including a reaction product of an epoxy compound and a phosphorus, amine or sulfur compound
11/06/2001US6312801 Adhesive tape for electronic parts
11/01/2001WO2001081468A1 Coherent insert
11/01/2001WO2001081445A1 Epoxy resin composition and prepreg made with the epoxy resin composition
11/01/2001WO2001027184A3 Method of preparation of a curing agent for epoxy compositions, the curing agent for epoxy compositions and the epoxy composition
11/01/2001US20010037003 Latent catalyst, thermosetting resin composition comprising the catalyst, epoxy resin molding material comprising the catalyst, and semiconductor device
11/01/2001US20010036591 Radiation sensitive compositions of a cationically polymerizable or curable compound, a compound that increases solubility in developer under acidification, and asymmetrical diaryliodonium salt; storage stable; relief images
11/01/2001US20010035111 Curable two-component mortar composition and its use
10/2001
10/31/2001EP1149130A1 Acrylic terpolymer for the use as a self-fixturing adhesive
10/31/2001DE10020785A1 Polyarylethersulfon/Polyamid-Blends mit verbesserter Zähigkeit und Fließfähigkeit Polyarylethersulfone / polyamide blends with improved strength and flowability
10/31/2001CN1320132A Phenolic resin, epoxy resin, and processes for producing these
10/31/2001CN1074017C Method for increasing molecular weight of polycondensates
10/30/2001US6310147 Epoxy-resin composition and use thereof
10/30/2001US6310120 A sealing material comprising a liquid epoxy resin, a curing agent, spherical silica, a soft x-ray non-transmissive spherical inorganic filler and a curing accelerator; improved thin-film infiltration and storage stability
10/30/2001US6309757 Gas barrier coating of polyamine, polyepoxide and hydroxyaromatic compound
10/30/2001US6309751 Film forming blend
10/30/2001US6309527 Thermosetting resinous binder compositions, their preparation and use as coating materials
10/30/2001US6309502 Curable alicyclic epoxy resin, styrene thermoplastic elastomer with epoxy group, ultraviolet-active cationic polymerization catalyst; and fluorenediol; heat resistance, waterproofing
10/30/2001CA2238227C Crosslinked poly(amino acids) and method of preparation
10/30/2001CA2057537C Heat resistant resin compositions, articles and method
10/25/2001WO2001079374A2 Stabilized cationically polymerizable composition, and adhesive film and conductor circuit comprising the same
10/25/2001WO2001042253A3 Phosphorus element-containing crosslinking agents and flame retardant phosphorus element-containing epoxy resin compositions prepared therewith
10/25/2001US20010034409 Mannich bases and further compounds based on alkyldipropylenetriamines
10/25/2001US20010034382 Sealing material for flip-chip semiconductor device, and flip-chip semiconductor device made therewith
10/24/2001EP1147154A1 Improvements in or relating to powdered coating compositions
10/24/2001EP0799217B1 Epoxy-functional hydroxy esters useful as emulsifiers or reactive diluents in epoxy resin compositions
10/24/2001EP0779337B1 Fluorine-containing epoxy resin composition highly soluble in solvents