Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
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11/29/2001 | DE10025356A1 Hartgummi-Beschichtungen für den Korrosionsschutz Hard Rubber coatings for corrosion protection |
11/28/2001 | EP1158012A1 Ebonite coatings for corrosion resistance |
11/28/2001 | EP1157075A1 Sealant compositions and sealant articles using the same |
11/28/2001 | EP1157057A1 Accelerators useful for energy polymerizable compositions |
11/28/2001 | EP1156765A1 Hemostatic polymer useful for rapid blood coagulation and hemostasis |
11/28/2001 | CN1324372A Curable epoxy resin compositions |
11/28/2001 | CN1324123A 锂电池 Lithium Battery |
11/28/2001 | CN1075525C One-pack epoxy resin composition, one-pack corrosion-resistant paint composition, and coating method using said comositions |
11/27/2001 | US6323306 Adding to aqueous solution of an amine functionalized cationic base polymer cross-linking agent reactive with primary, secondary or tertiary amines of base polymer to form higher molecular weight polymer |
11/27/2001 | US6323264 Corrosion barrier coating composition |
11/27/2001 | US6323263 Epoxy resin with curing agent and inorganic filler |
11/27/2001 | US6322892 Cation-polymerizable coating composition |
11/27/2001 | CA2179712C Crosslinked polymeric ammonium salts |
11/22/2001 | WO2001088959A2 No-flow reworkable epoxy underfills for flip-chip applications |
11/22/2001 | WO2001088053A1 Rigid substrate lamination adhesive |
11/22/2001 | WO2001088047A1 Corrosion resistant coatings |
11/22/2001 | WO2001088034A1 Thermosetting composition |
11/22/2001 | WO2001088033A1 Sound deadening and structural reinforcement compositions and methods of using the same |
11/22/2001 | WO2001088013A2 Process for manufacturing a hydroxyester derivative intermediate and epoxy resins prepared therefrom |
11/22/2001 | CA2409750A1 Sound deadening and structural reinforcement compositions and methods of using the same |
11/22/2001 | CA2403560A1 Corrosion resistant coatings |
11/21/2001 | EP1156085A1 Binders for use in cathodic electrodeposition coatings, process for their preparation and cathodic electrodeposition coating compositions containing same |
11/21/2001 | EP1155063A1 Epoxy compounds for dental medical and/or dental technical applications |
11/21/2001 | EP1155022A1 Phosphorus-comprising materials, their preparation and use |
11/21/2001 | EP0917547B1 Polyglycidyl ethers of secondary alcohols |
11/21/2001 | CN1075044C Glass fibre size composition, method using the same composition and resulted products |
11/20/2001 | US6320020 Polymer or copolymer containing a sulfur atom whose principal backbone comprises ether and/or thioether bonds; optical disk substrate; a liquid-crystal plastic substrate; various optical lenses including an eyeglass; and an led sealing coat. |
11/20/2001 | US6320013 Heating: a heavy oil or pitch of given average molecular weight; formaldehyde or a formaldehyde precursor; and an allylphenol with stirring in the presence of an acid catalyst |
11/20/2001 | US6319967 Thermosetting compositions containing epoxy-functional polymers prepared using atom transfer radical polymerization |
11/20/2001 | US6319652 To form cured resin having dimensional stability, humidity absorption, chemical resistance; for stereolithography |
11/20/2001 | US6319603 Poly(meth)acrylate polymer with epoxy groups, ring opening polymerization monomer with glycidyl groups, cationic initiators and free radical photoinitiators |
11/20/2001 | US6319557 Coating composition and method for application thereof |
11/20/2001 | US6319428 Perfluorinated amide salts and their uses as ionic conducting materials |
11/20/2001 | CA2041833C A process for the preparation of n,n,n',n'-tetraglycidyl-3,3'-dialkyl-4,4'-diaminodiphenylmethanes |
11/20/2001 | CA2025831C Radiation-polymerizable mixture and process for producing a solder resist mask |
11/15/2001 | US20010041784 Process for producing a lens by polymerizing bis(beta-epithiopropyl) ether |
11/15/2001 | US20010041782 Novel latent curing agent and moisture-curable epoxy resin composition |
11/14/2001 | EP1153980A1 Epoxy resin composition |
11/14/2001 | EP1153952A1 Sealing agent for liquid-crystal display cell, composition for sealing agent for liquid-crystal display cell, and liquid-crystal display element |
11/14/2001 | EP1153941A1 Polymer and epoxy resin compositions |
11/14/2001 | EP1153905A1 Novel crystalline ion-association substance, process for producing the same, and polymerization initiator |
11/14/2001 | EP1153057A1 Self-dispersible hardenable epoxide resins |
11/14/2001 | CN1322219A Method for producing vinyl compounds |
11/14/2001 | CN1322156A Foundry binder of epoxy resin, acrylated polyisocyanate and acrylic monomer and/or polymer, and cold-box process |
11/14/2001 | CN1321694A Epoxy resin solidified microsphere water-base system and its preparation method |
11/14/2001 | CN1074773C Aqueous dispersion and composition prepared therefrom |
11/14/2001 | CN1074705C Coated abrastive article and method of making same |
11/13/2001 | USRE37448 Free from epoxy groups; reaction product of an epoxide and a carboxyl- and ester-group-containing compound formed from 1) dicarboxylic acid and 2)(meth)acrylated polyol containing ethylene oxide groups |
11/13/2001 | US6316583 Fluorescence, ultraviolet radiation absorbance and solubility in organic solvents, can be epoxidized to form epoxy products whicha are used in manufacture of laminates, coatings, and adhesives |
11/13/2001 | US6316529 Used for elastic bridging of cracks; chemical resistance |
11/13/2001 | US6316109 Reaction product of; polyhydric aromatic compound and an aminotriazine compound having one or less non-alkylated nh bond per triazine ring;, is essentially free of hydroxyl functionality; contains benzoxazine groups |
11/13/2001 | US6316049 Epoxy resin; curative which is an optionally substituted methylenedisalicylic acid; boron trifluoride:amine complex is used as the cure catalyst. |
11/08/2001 | WO2001083629A1 Method of bonding adherend |
11/08/2001 | WO2001083627A1 Water-based coating composition curable with actinic energy ray, coated metallic material with cured film of the composition, production process, and method of bonding coated metallic material |
11/08/2001 | WO2001083618A1 Blends of polyarylether sulphone and polyamide, with improved viscosity and flowability |
11/08/2001 | WO2001083607A1 Rheology-controlled epoxy-based compositions |
11/08/2001 | WO2001083580A2 Polymerizable composition, cured material thereof and method for manufacturing the same |
11/08/2001 | US20010039305 Lubricating coating compound, sliding structure combining two sliding members in which lubricating coating compound is applied to one of the sliding members, and slide bearing apparatus using the same |
11/08/2001 | US20010039300 Photo-curable resin composition, process for producing the same and products using the same |
11/08/2001 | US20010038965 Cresol or xylenol resin that has been esterified with 1,2-naphthoquinonediazide-4 or 5-sulfonic acid |
11/07/2001 | EP1151854A1 Process for aqueous coating |
11/07/2001 | EP1151365A1 Rapid on chip voltage generation for low power integrated circuits |
11/07/2001 | EP1151046A1 Epoxy functional polyester resins having an increased molecular weight, process for their preparation, and outdoor durable coating compositions comprising them |
11/07/2001 | EP1151025A1 Epoxy resin system |
11/07/2001 | EP1151021A1 Initiator compositions and methods for their synthesis and use |
11/07/2001 | EP1115768A4 Epoxy curing agent of phenol-aldehyde reacted with polyamine |
11/07/2001 | EP0853774B1 Holographic medium and process |
11/06/2001 | US6313257 Poly (mercaptopropylaryl) curatives |
11/06/2001 | US6313250 Polyfunctionally reactive polymer substances |
11/06/2001 | US6313221 Powder coating of epoxy-acrylic resin, polycarboxylic acid, crosslinked particles and liquid resin |
11/06/2001 | US6313188 Photocationically polymerizable composition comprising a polycyclic aromatic compound |
11/06/2001 | US6312829 Epoxy resin and resin-sealed type semiconductor apparatus |
11/06/2001 | US6312826 Cross-linked drying oil or cross-linked, functionally modified drying oil |
11/06/2001 | US6312812 First pretreatment composition including a transition element compound of a group 3b, 4b or lanthanide element; second pretreatment composition including a reaction product of an epoxy compound and a phosphorus, amine or sulfur compound |
11/06/2001 | US6312801 Adhesive tape for electronic parts |
11/01/2001 | WO2001081468A1 Coherent insert |
11/01/2001 | WO2001081445A1 Epoxy resin composition and prepreg made with the epoxy resin composition |
11/01/2001 | WO2001027184A3 Method of preparation of a curing agent for epoxy compositions, the curing agent for epoxy compositions and the epoxy composition |
11/01/2001 | US20010037003 Latent catalyst, thermosetting resin composition comprising the catalyst, epoxy resin molding material comprising the catalyst, and semiconductor device |
11/01/2001 | US20010036591 Radiation sensitive compositions of a cationically polymerizable or curable compound, a compound that increases solubility in developer under acidification, and asymmetrical diaryliodonium salt; storage stable; relief images |
11/01/2001 | US20010035111 Curable two-component mortar composition and its use |
10/31/2001 | EP1149130A1 Acrylic terpolymer for the use as a self-fixturing adhesive |
10/31/2001 | DE10020785A1 Polyarylethersulfon/Polyamid-Blends mit verbesserter Zähigkeit und Fließfähigkeit Polyarylethersulfone / polyamide blends with improved strength and flowability |
10/31/2001 | CN1320132A Phenolic resin, epoxy resin, and processes for producing these |
10/31/2001 | CN1074017C Method for increasing molecular weight of polycondensates |
10/30/2001 | US6310147 Epoxy-resin composition and use thereof |
10/30/2001 | US6310120 A sealing material comprising a liquid epoxy resin, a curing agent, spherical silica, a soft x-ray non-transmissive spherical inorganic filler and a curing accelerator; improved thin-film infiltration and storage stability |
10/30/2001 | US6309757 Gas barrier coating of polyamine, polyepoxide and hydroxyaromatic compound |
10/30/2001 | US6309751 Film forming blend |
10/30/2001 | US6309527 Thermosetting resinous binder compositions, their preparation and use as coating materials |
10/30/2001 | US6309502 Curable alicyclic epoxy resin, styrene thermoplastic elastomer with epoxy group, ultraviolet-active cationic polymerization catalyst; and fluorenediol; heat resistance, waterproofing |
10/30/2001 | CA2238227C Crosslinked poly(amino acids) and method of preparation |
10/30/2001 | CA2057537C Heat resistant resin compositions, articles and method |
10/25/2001 | WO2001079374A2 Stabilized cationically polymerizable composition, and adhesive film and conductor circuit comprising the same |
10/25/2001 | WO2001042253A3 Phosphorus element-containing crosslinking agents and flame retardant phosphorus element-containing epoxy resin compositions prepared therewith |
10/25/2001 | US20010034409 Mannich bases and further compounds based on alkyldipropylenetriamines |
10/25/2001 | US20010034382 Sealing material for flip-chip semiconductor device, and flip-chip semiconductor device made therewith |
10/24/2001 | EP1147154A1 Improvements in or relating to powdered coating compositions |
10/24/2001 | EP0799217B1 Epoxy-functional hydroxy esters useful as emulsifiers or reactive diluents in epoxy resin compositions |
10/24/2001 | EP0779337B1 Fluorine-containing epoxy resin composition highly soluble in solvents |