| Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
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| 03/27/2002 | CN1342182A Heat-curable, thermally expandable epoxy resin moulded part |
| 03/27/2002 | CN1081664C Liquid-state epoxy resin potting material |
| 03/27/2002 | CA2357574A1 Resin composition |
| 03/26/2002 | US6362246 Porous surface compositions and methods of retaining biological samples on said surface |
| 03/26/2002 | US6361924 Applied, in the form of coatings, onto substrates such as printed circuit boards |
| 03/26/2002 | US6361866 Prepreg and laminated board |
| 03/21/2002 | WO2002022709A1 Highly branched water-soluble polyamine oligomers, process for their preparation and applications thereof |
| 03/21/2002 | WO2002022704A1 Phosphorus-containing epoxy resin, flame-retardant highly heat-resistant epoxy resin composition containing the resin, and laminate |
| 03/21/2002 | WO2002022701A2 Method of preparing particulate crosslinked polymer |
| 03/21/2002 | US20020035446 Models and methods of integrating simulation techniques for advanced material predictive analysis |
| 03/21/2002 | US20020035233 Blend containing phosphorous compound |
| 03/21/2002 | US20020035201 No-flow reworkable epoxy underfills for flip-chip applications |
| 03/21/2002 | US20020035199 Composition (e.g. ink or varnish) which can undergo cationic and/or radical polymerization and/or crosslinking by irradiation, based on an organic matrix, a silicone diluent and a photoinitiator |
| 03/21/2002 | US20020033547 Method of manufacturing a replica as well as a replica obtained by carrying out an UV light-initiated cationic polymerization |
| 03/20/2002 | EP1188778A1 Thermosetting resin composition, and resin coated metal foil, prepreg and film-shaped adhesive all using the composition |
| 03/20/2002 | EP1188740A2 Amino compound and process for producing the same |
| 03/20/2002 | EP1165627A4 Photopolymerizable vinyl ether based monomeric formulations and polymerizable compositions which may include certain novel spiroorthocarbonates |
| 03/20/2002 | CN1340586A Resin composition for sealing semiconductor, semiconductor device, semiconductor chip and semiconductor mounting structural body |
| 03/19/2002 | US6359147 Reactions catalyzed by chromium (III) carboxylates |
| 03/19/2002 | US6359108 Method for polymerizing cyclic ether |
| 03/19/2002 | US6359082 Reacting dicarboxylic anhydrides with meth)acrylic acid and tri- or tetrahydric ether alcohols containing at least two ethylene and/or propylene oxide units to form epoxy (meth)acrylate |
| 03/19/2002 | US6359080 Coating of epoxy-functional polyester advanced with polyester or acid (anaydride) |
| 03/19/2002 | US6359039 Preparing solution containing a barbituric acid modified bismaleimide; mixing with an methyl ethyl ketone solution containing carboxylated acrylonitrile rubber, epoxy resin, hardening agent and catalyst |
| 03/19/2002 | US6359037 Polyamine/epoxy-functional amidoamine product with epoxy resin |
| 03/19/2002 | US6359036 1-Aminopyrrolidine or its salt as epoxy resin hardener |
| 03/19/2002 | US6359027 Coated abrasive article |
| 03/19/2002 | US6358568 Powder varnish dispersion |
| 03/19/2002 | US6358354 UV and thermally curable adhesive formulation |
| 03/14/2002 | WO2001088013A3 Process for manufacturing a hydroxyester derivative intermediate and epoxy resins prepared therefrom |
| 03/14/2002 | WO2001075524A3 Solid imaging compositions for preparing polypropylene-like articles |
| 03/14/2002 | US20020032286 Epoxidized low viscosity rubber |
| 03/14/2002 | US20020032280 One-part, thermally-curable adhesive composition comprising: an epoxy resin substantially free of hydroxyl functionality; and an anhydride curing agent. |
| 03/14/2002 | US20020032279 Epoxy resin modified with a side chain having a reactive phosphorus-containing compound, e.g., 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide |
| 03/14/2002 | US20020032242 Especially preparing polyurethanes, polyureas and polyepoxides |
| 03/14/2002 | DE10048179C1 Epoxidharzzusammensetzung mit halogenfreiem, phosphorfreiem Flammschutzmittel Epoxy resin with halogen-free, phosphate-free flame retardants |
| 03/13/2002 | EP1186624A1 Organosiloxane polymers and photo-curable resin compositions |
| 03/13/2002 | EP1185574A2 Poly(mercaptopropylaryl) curatives |
| 03/13/2002 | EP0669949B1 Tertiary amine derivatives as components of polymer forming systems |
| 03/13/2002 | CN1340082A 环氧树脂组合物 The epoxy resin composition |
| 03/13/2002 | CN1340067A Process for producing phenol-dicarbonyl condensates with increased fluorescence, epoxy resins, epoxy resin systems and laminates made with the same |
| 03/13/2002 | CN1339535A 阳离子树脂组合物 Cationic resin composition |
| 03/13/2002 | CN1080740C UV curable composition |
| 03/13/2002 | CN1080735C Toughening modified epoxy resin composition |
| 03/13/2002 | CN1080734C Outdoor durable powder coating compositions |
| 03/13/2002 | CN1080733C Epoxy resin, epoxy resin composition and hardened product thereof |
| 03/13/2002 | CN1080732C Process for preparing epoxy compounds |
| 03/13/2002 | CN1080727C Monohydroxylated diene polymers and epoxidized derivatives thereof |
| 03/12/2002 | US6355763 Epoxy resin, polyamine hardener and N,N′,N″-tris(dialkylaminoalkyl)hexahydrotriazine |
| 03/12/2002 | US6355740 Silicone-modified epoxy resin and its preparing method and silicone-modified epoxy resin composition |
| 03/12/2002 | US6355735 Non-glycidyl epoxy and olefin monomers; palladium compound polymerization catalyst uniformly distributed; vibration damping; adhesives, seals, gaskets |
| 03/12/2002 | US6355137 Repulpable wet strength paper |
| 03/07/2002 | WO2002019440A1 Encapsulants for solid state devices |
| 03/07/2002 | WO2002019040A2 Holographic storage medium comprising polyfunctional epoxy monomers capable of undergoing cationic polymerization |
| 03/07/2002 | WO2002018469A1 Epoxy resin mixture with a phosphor-modified epoxy resin |
| 03/07/2002 | WO2001060701A3 Gas barrier compositions having improved barrier properties |
| 03/07/2002 | CA2424366A1 Holographic storage medium comprising polyfunctional epoxy monomers capable of undergoing cationic polymerization |
| 03/06/2002 | EP1184419A2 Resin composition for selaing semiconductor, semiconductor device using the same semiconductor wafer and mounted structure of semiconductor device |
| 03/06/2002 | EP1183294A1 Process for producing phenol-dicarbonyl condensates with increased fluorescence, epoxy resins, epoxy resin systems and laminates made with the same |
| 03/06/2002 | CN1080277C Improved polyether-containing double-metal cyanide catalysts |
| 03/05/2002 | US6353082 Reacting epoxide groups of multi-functional di- or higher epoxide group containing compound reactant with acid chloride groups of multi-functional di- or higher acid chloride group containing compound reactant to form ester products |
| 03/05/2002 | US6353081 Composition comprising epoxy resin mixture containing curing agent for epoxy resin mixtures consisting essentially of pseudohalogenide of bivalent or trivalent metal |
| 03/05/2002 | US6353080 Flame retardant epoxy resin composition |
| 03/05/2002 | US6353079 Epoxy resin and epoxy di (meth)acrylate from hydroxyaliphatic bisphenol |
| 03/05/2002 | US6353061 Fillings for teeth, fillers and methacrylate terminated epoxide-carboxylic acid macromomer with diepoxide, dicarboxylic acid and unsaturated carboxylic acid |
| 03/05/2002 | US6353059 Crosslinking; stable molecular orientation |
| 03/05/2002 | US6353043 Multi-colored epoxy coating system |
| 03/05/2002 | CA2055982C Thermoplastic film, reinforced hollow glass microsphere reinforced laminates for thin low dielectric constant substrates |
| 02/28/2002 | WO2002017422A2 Epoxy nitrile insulator and seal for fuel cell assemblies |
| 02/28/2002 | WO2001070843A3 High molecular weight epoxy resin and resinous composition for printed circuit board |
| 02/28/2002 | US20020025991 Oligomeric and polymeric photosensitizers |
| 02/28/2002 | US20020025431 Tape automated bonding (TAB); adhesive strength, moderate elastic modulus and coefficient of expansion; adhesive layer of a thermoplastic resin and a polyepoxide having skeleton containing one of dicyclopentadiene, terpene, or biphenyl |
| 02/28/2002 | US20020024170 Curing method to cure epoxy resins in a short time, and a method for absorbing electromagnetic wave through cured epoxy resins obtained by said curing method |
| 02/28/2002 | CA2419136A1 Epoxy nitrile insulator and seal for fuel cell assemblies |
| 02/27/2002 | CN1337975A Electronic circuit device comprising an epoxy-modified aromatic vinyl-conjugated diene block copolymer |
| 02/26/2002 | US6350843 Epoxy resin low electronic impedance high molecular polymer |
| 02/26/2002 | US6350826 Epoxy vinyl ester and urethane vinyl ester derived from low and high MW glycols |
| 02/26/2002 | US6350825 Reacting diglycidyl, bisphenol and monophenol with catalyst and mixing with polyglycidyl |
| 02/26/2002 | US6350792 Radiation-curable compositions and cured articles |
| 02/26/2002 | US6350344 Solventless primers which are hardenable by radiation |
| 02/26/2002 | US6349747 Thermoplastic polymer and an epoxy resin modified by at least one aromatic polyamine to coat surfaces of pipes through which hot oil is transported. |
| 02/26/2002 | CA2011867C Process for the condensation of at least one epoxide on at least one cyclic anhydride in the presence of a catalyst containing at least one titanium complex |
| 02/21/2002 | WO2002015259A1 High reliability non-conductive adhesives for non-solder flip chip bondings and flip chip bonding method using the same |
| 02/21/2002 | WO2002014334A1 Phenol compounds, resin compositions and products of curing thereof |
| 02/21/2002 | US20020022713 For producing resin which is used for optical material such as a plastic lens, a prism, an optical fiber, a substrate for an information recording medium, a filter and a light emitting diodes; refractive index |
| 02/21/2002 | US20020022709 Reacting an epoxy resin comprising materials containing hydrolyzable halide with a base; heating while agitating; neutralizing heated mixture with carbon dioxide to form a crude product; distilling using molecular distillation |
| 02/21/2002 | US20020022310 Useful as dielectric layer in integrated circuits and electronic circuit encapsulants; heat resistance, mechanical properties |
| 02/21/2002 | DE10037729A1 Mikrokapsel, Verfahren zu deren Herstellung und deren Verwendung in Klebstoffen Microcapsule, to processes for their preparation and their use in adhesives |
| 02/20/2002 | EP0724613B1 Binders based on fat chemical reaction products |
| 02/19/2002 | US6348523 Curable composition |
| 02/19/2002 | CA2043732C Epoxy resin compositions |
| 02/14/2002 | US20020019511 Polymerizable composition |
| 02/14/2002 | US20020019500 Epoxy acrylates |
| 02/14/2002 | US20020019499 Thermosetting epoxy powder coatings having improved degassing properties |
| 02/14/2002 | US20020019463 Curable compositions of glycidyl compounds, aminic hardeners and novel low viscosity curing accelerators |
| 02/14/2002 | US20020019449 Recycling of articles comprising hydroxy-phenoxyether polymers |
| 02/14/2002 | US20020018959 Solid imaging compositions for preparing polypropylene-like articles |
| 02/13/2002 | EP1179549A1 Polyamines as crosslinker for binder compositions which may be used in the preparation of coating compositions |
| 02/13/2002 | EP0595803B1 Porous, absorbent, polymeric macrostructures and methods of making the same |
| 02/13/2002 | CN1335757A Hemostatic polymer useful for rapid blood coagulation and hemostasis |
| 02/12/2002 | US6346596 Polyesters from diglycidyl ether with diacid |