| Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
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| 08/08/2002 | US20020106516 Free of halogen elements, flame retardancy, water resistance, heat resistance, peeling strength |
| 08/08/2002 | US20020106515 Novel high temperature underfilling material with low exotherm during use |
| 08/08/2002 | US20020106458 Contacting metal surface with adhesion promotion formulation to form a micro-roughened conversion coated metal surface; contacting micro-roughened conversion coated metal surface with epoxy resin to prepare for receiving polymer |
| 08/08/2002 | CA2431558A1 Gel coat composition |
| 08/07/2002 | EP0964882B1 Process for preparation of flat structures made of renewable raw materials |
| 08/07/2002 | CN1088719C Aromatic amine epoxy curing agent and preparation thereof |
| 08/06/2002 | US6429281 Curable; nonhydrolyzing thermosetting resins |
| 08/06/2002 | US6429238 Liquid epoxy resin and modified polyethersiloxane cured with imidazole-derived cure accelerator; sealing material for flip-chip semiconductor devices; improved thin-film infiltration and storage stability; no need to clean flux |
| 08/06/2002 | CA2255533C Wrinkle finish powder coating with pattern control |
| 08/01/2002 | WO2002059177A2 Poly (hydroxyaminoethers) having a low chloride content |
| 08/01/2002 | WO2002041079A3 Positive type photosensitive epoxy resin composition and printed circuit board using the same |
| 08/01/2002 | WO2002024799A3 Aminoplast-based crosslinkers and powder coating compositions containing such crosslinkers |
| 08/01/2002 | US20020103270 Photo- or heat-curable resin composition and multilayer printed wiring board |
| 08/01/2002 | US20020103102 Useful as low foaming surfactants and as defoaming agents in aqueous and nonaqueous liquid compositions |
| 08/01/2002 | US20020102429 Good flow and curing properties, reliability, do not pose hazard to human health or environment |
| 08/01/2002 | US20020102407 Reaction product of a vinylphosphonic acid and an epoxy resin; metallic pigment |
| 08/01/2002 | US20020102380 Ionic compounds in which the anionic load has been delocalized; ionic conducting materials, electronic conducting materials, colorant, and the catalysis of various chemical reactions including polymerization |
| 08/01/2002 | US20020100566 Sizing, strength |
| 07/31/2002 | EP1226200A1 Coating composition and method of coating substrates |
| 07/31/2002 | CN1361800A Solvent-free, room temperature curing reactive systems and the use thereof in the production of adhesives, sealing agents, casting compounds, molded articles or coatings |
| 07/31/2002 | CN1361191A Crystalline epoxy, its producing method and solidifiable composition containing the same |
| 07/30/2002 | US6425655 Dual curable encapsulating material |
| 07/25/2002 | WO2002057361A2 Curing agent for epoxy resins and epoxy resin composition |
| 07/25/2002 | WO2002057360A1 Thermoplastic resin composition for use under vacuum, method for producing the same and vacuum device using the same |
| 07/25/2002 | WO2002057333A2 Epoxy resin composition for semiconductor encapsulation |
| 07/25/2002 | WO2002057279A1 Flame-proofing agents |
| 07/25/2002 | WO2002056921A2 Nonaqueous compositions and additives therefor |
| 07/25/2002 | WO2002019040A9 Holographic storage medium comprising polyfunctional epoxy monomers capable of undergoing cationic polymerization |
| 07/25/2002 | WO2002006371A3 Radiation-curable compositions and cured articles |
| 07/25/2002 | US20020099168 For incorporation into thermosetting resins; less susceptible to popcorning upon cure or use in high temperature applications |
| 07/25/2002 | US20020099150 Polyester composition and connector |
| 07/24/2002 | EP0973759B1 Cycloaliphatic epoxides and the method for making the same |
| 07/24/2002 | CN1360619A 可固化的组合物 The curable composition |
| 07/24/2002 | CN1360598A Process for continuous production of epoxy addition polymers and powder and liquid coating applications contg. same |
| 07/24/2002 | CN1360597A Process for continuous production of gel free polymers, and powder and liquid coating applications contg. gel free polymers |
| 07/24/2002 | CN1359975A Method for preparing epoxy resin composition for sealing optoelectronic semiconductor elements |
| 07/24/2002 | CN1088081C High solids epoxy coatings based on primary-tertiary diamines |
| 07/23/2002 | US6423367 Adhesives; coatings; encapsulation |
| 07/18/2002 | WO2002055603A1 Thermosetting resin composition, and prepreg, laminate for circuit board, and printed circuit board each made therewith |
| 07/18/2002 | WO2002055579A1 Epoxy resin adduct based on telechelic amino polydiene and its use for reinforcing impact strength of epoxy resin systems |
| 07/18/2002 | WO2002055578A1 Epoxy resin, coating composition, and method of can inside coating |
| 07/18/2002 | WO2001070886A3 Silicone amino-epoxy cross-linking system |
| 07/18/2002 | WO2001040396A3 Urethane modified epoxy adhesive composition |
| 07/18/2002 | US20020094945 Reaction product of monoetherified, monoaminated, or monothioetherified polyoxyalkylene adducts or polymers with di-or polyepoxides such as glycerol, diglycidyl ether; use as low foaming surfactants |
| 07/18/2002 | CA2770436A1 Thermosetting resin composition, and prepreg, laminated board for wiring board and printed wiring board using the same |
| 07/18/2002 | CA2660875A1 Thermosetting resin composition, and prepreg, laminated board for wiring board and printed wiring board using the same |
| 07/17/2002 | EP1222221A1 Alkyldipropylenentriamines and their adducts as hardeners for expoxy resins |
| 07/17/2002 | EP1196463A4 Epoxy resin prepared from p-hydroxystyrene having high functionality, low melt viscosity with high glass transition temperature |
| 07/17/2002 | CN1359410A Liquid thermosetting resin composition and method of permanent hole-filling for printed wiring board using the same |
| 07/17/2002 | CN1358809A Polyester with acid functional group and epoxy functional group |
| 07/17/2002 | CN1358798A High-temp. under mould-filling material with low heat generating in use |
| 07/17/2002 | CN1358780A Epoxy resin bromide with high glass transfusion temp. for glass fibre laminated board |
| 07/16/2002 | US6420607 Cationically polymerizable compositions capable of being coated by electrostatic assistance |
| 07/16/2002 | US6420496 Basic catalyst for phenol aldehyde for curing |
| 07/16/2002 | US6420494 Epoxy compounds and organo siloxanes and silicates |
| 07/16/2002 | US6420472 Curable coating compositions having improved effect pigment orientation and a method using the same |
| 07/16/2002 | US6420464 Thermosetting resin epoxy resins |
| 07/16/2002 | US6420460 Curable compound releasing protons |
| 07/16/2002 | US6420458 Solid amine-cured anchoring adhesive |
| 07/16/2002 | US6420450 Cationically hardening mass, the use thereof and process for preparing hardened polymer masses |
| 07/16/2002 | US6419989 Applying powder slurry clearcoat to substrate; heating; film forming |
| 07/16/2002 | CA2102107C Stereolithography using vinyl ether-epoxide polymers |
| 07/11/2002 | WO2002053621A1 Advanced resin derived from a low molecular weight glycidyl ether and a di-tertiary carboxylic acid and powder coating compositions comprising it |
| 07/11/2002 | WO2002053200A2 Biocompatible adhesives |
| 07/11/2002 | US20020091223 Hydroxyaliphatic functional epoxy resins |
| 07/11/2002 | US20020091195 Aqueous binders based on epoxy resins |
| 07/11/2002 | US20020090573 Resin with radical polymerization groups and carboxyl groups obtained by reacting a cyclic ether vinyl monomer to addition copolymer with carboxylic groups; polyfunctional acrylate; cyclic ether (e.g., epoxide); photopolymerization initiator |
| 07/11/2002 | CA2431546A1 Biocompatible adhesives |
| 07/10/2002 | EP1221453A1 Curing agent composition and curable epoxy resin composition |
| 07/10/2002 | EP1221451A1 Novolak Aralkyl resin, preparation process thereof, and composition containing said resin |
| 07/10/2002 | EP0675894B1 Ion-conductive polymer and electrolyte additives |
| 07/10/2002 | CN1358211A Method for producing fiber reinforced materials |
| 07/09/2002 | US6417316 Curable epoxy resin compositions |
| 07/09/2002 | US6417243 Monomers, oligomers and polymers comprising terminal oxirane groups, their process of preparation and their cationic polymerization under irradiation |
| 07/09/2002 | CA2220104C Silicone aminopolyalkyleneoxide block copolymers |
| 07/09/2002 | CA2051362C Epoxy resin, epoxy resin composition and cured product thereof |
| 07/04/2002 | US20020086941 Thermosetting powder coating mixture contains acid functional acrylic resin(s), polyepxoy resin(s), first and second catalysts |
| 07/04/2002 | US20020086161 Radiation-curable compositions and cured articles |
| 07/04/2002 | US20020086104 Thermosetting powder coating composition and curing agent composition |
| 07/03/2002 | EP1219656A1 Composition for coating having a gas barrier property, coating and coated film having a gas barrier property used the same |
| 07/03/2002 | EP1218421A1 Resins containing carbamate groups, method for their production and use of the same |
| 07/03/2002 | EP1218178A1 An adhesion promoting layer for use with epoxy prepregs |
| 07/02/2002 | US6413697 Photopolymerization |
| 07/02/2002 | US6413696 Liquid, radiation-curable composition, especially for producing cured articles by stereolithography having heat deflection temperatures |
| 06/27/2002 | WO2002050239A1 Branched alkoxide reaction products, and uses thereof |
| 06/27/2002 | WO2002050238A1 Reaction products of melamine and derivatives thereof |
| 06/27/2002 | WO2002050237A1 Reaction products of polycarboxylic acids and derivatives thereof |
| 06/27/2002 | WO2002050236A1 Branched reaction products of alcohols and aldehydes |
| 06/27/2002 | WO2002050235A1 Branched reaction products of amines and multifunctional compounds |
| 06/27/2002 | WO2002050222A1 Reaction products of alkoxylated compounds and polyepoxides |
| 06/27/2002 | WO2002050200A1 Coating compositions containing alcoholic reactive diluents |
| 06/27/2002 | WO2002050155A1 One-pack moisture-curing epoxy resin composition |
| 06/27/2002 | WO2002050154A1 One-pack moisture-curable epoxy resin composition |
| 06/27/2002 | WO2002050153A1 Flame-retardant epoxy resin composition, and prepregs and fiber-reinforced composite materials made by using the composition |
| 06/27/2002 | WO2002050146A1 Polyaldehyde reaction products |
| 06/27/2002 | WO2001083580A3 Polymerizable composition, cured material thereof and method for manufacturing the same |
| 06/27/2002 | US20020082379 Novel epoxy hardeners for improved properties, processing and handling |
| 06/27/2002 | US20020082350 To produce laminates and printed wiring boards |
| 06/27/2002 | US20020082349 Resistance to heat and humidity, producing virtually no voluminal expansion even under the conditions of high temperature and high humidity |
| 06/27/2002 | US20020082322 For use in composite material, laminated plates, printed circuit boards, electronic products, electrical products |