| Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
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| 05/01/2002 | CN1083872C Solvent-free epoxy based adhesives for semiconductor chip attachment and process for preparing same |
| 05/01/2002 | CN1083851C 环氧树脂组合物 The epoxy resin composition |
| 04/30/2002 | US6380277 As polymerization catalyst, used for the radiation curing of cationically curing formulations |
| 04/30/2002 | US6379866 Stereolithography utilizing photosensitive compound comprising epoxide, aromatic/cylcoaliphatic acrylic material, hydroxy compound, and photoinitiator which is cured with actinic radition |
| 04/30/2002 | US6379800 Glyoxal-phenolic condensates with enhanced fluorescence |
| 04/30/2002 | US6379799 Curable epoxide reaction product of phenol, dicyclopentadiene and epichlorohydrin; heat resistance, waterproofing; aerospace |
| 04/30/2002 | US6379759 Bisphenol type epoxy compound and a non-bisphenol type epoxy compound, and a crosslinking agent of at least one aromatic or alicyclic amine; resistant to liquid crystals, heat resistance, flexibility |
| 04/30/2002 | CA2244613C Powdered crosslinkable textile binder composition |
| 04/30/2002 | CA2208853C Ultraviolet curable epoxidized alkyds |
| 04/25/2002 | WO2002032997A1 Silicone-modified single-component sealing compound |
| 04/25/2002 | WO2001096452A3 Method for making or adding structures to an article |
| 04/25/2002 | CA2324794A1 Organic-inorganic hybrid photocurable compositions |
| 04/24/2002 | EP1198518A1 Method for producing flat articles from renewable raw materials |
| 04/24/2002 | EP1198482A1 Polyreactions in non-aqueous miniemulsions |
| 04/24/2002 | EP1198481A1 Process for the continuous production of epoxy - (meth)acrylic - styrene polymers and their use in coating |
| 04/24/2002 | EP1015511B1 High internal phase ratio emulsions and stable aqueous dispersions of hydroxy-functional polymers |
| 04/24/2002 | CN1346375A Sealing agent for liquid-crystal display, cell, composition for sealing agent for liquid-crystal display cell, and liquid-crystal display element |
| 04/23/2002 | US6376923 Liquid epoxy resin, curing agent, copolymer of alkenyl group-containing epoxy resin and an sih group-containing organopolysiloxane, inorganic filler surface treated with an aminosilane or organosilazane |
| 04/23/2002 | US6376638 Latent curing agent for epoxy resin initiated by heat and UV-light and epoxy resin composition containing the same and cured epoxy products |
| 04/23/2002 | US6376609 Soldering photoresists for printed circuits |
| 04/23/2002 | US6376579 Low temperature curing, sag-resistant epoxy primer |
| 04/23/2002 | US6376564 Storage-stable compositions useful for the production of structural foams |
| 04/23/2002 | US6376101 Epoxy resin composition and semiconductor devices |
| 04/23/2002 | US6376081 Self-crosslinking resin and coating compositions made therefrom |
| 04/23/2002 | US6375867 Process for making a positive temperature coefficient conductive polymer from a thermosetting epoxy resin and conductive fillers |
| 04/23/2002 | CA2034395C Hydroxy-functional polyethers as thermoplastic barrier resins |
| 04/18/2002 | WO2002031018A1 Die-attaching paste and semiconductor device |
| 04/18/2002 | WO2002031017A1 Epoxy resin, epoxy resin mixtures, epoxy resin compositions and products of curing of the same |
| 04/18/2002 | US20020045752 Method for reducing an organic solvent remaining in beta-form tris- (2,3,-epoxypropyl) - isocyanurate crystals |
| 04/18/2002 | US20020045709 Liquid epoxy resin composition and semiconductor device |
| 04/18/2002 | US20020045707 Process for manufacturing a hydroxyester derivative intermediate and epoxy resins prepared therefrom |
| 04/18/2002 | US20020045125 Preferred non-aromatic compounds of the invention are conjugated aliphatic and alicyclic compounds which greatly enhance the plasma etch rate of the composition. |
| 04/18/2002 | US20020043728 Resin composition for sealing semiconductor, semiconductor device using the same, semiconductor wafer and mounted structure of semiconductor device |
| 04/18/2002 | DE10107985C1 Polymerizable formulation used for coating and/or bonding substrates or as dental formulation, contains organosilicon compound with aliphatic and cycloaliphatic epoxide groups, filler and initiator, inhibitor and/or accelerator |
| 04/18/2002 | DE10051051A1 One-component casting material, e.g. for insulation of electrical components and for production of fuel tanks, contains epoxy resin, a silicone-containing component, filler and initiator |
| 04/18/2002 | CA2394053A1 Epoxy resin, epoxy resin mixtures, epoxy resin compositions and products of curing of the same |
| 04/17/2002 | EP1196508A1 Curable composition |
| 04/17/2002 | EP1196485A1 High performance cyanate-bismaleimide-epoxy resin compositions for printed circuits and encapsulants |
| 04/17/2002 | EP1196481A1 Method for producing fiber reinforced materials |
| 04/17/2002 | EP1196471A1 Process for the preparation of reaction products of cycloaliphatic epoxides with multifunctional hydroxy compounds |
| 04/17/2002 | EP1196463A1 Epoxy resin prepared from p-hydroxystyrene having high functionality, low melt viscosity with high glass transition temperature |
| 04/17/2002 | EP1196422A1 Polymerisation catalysts |
| 04/17/2002 | EP1196272A1 Process and apparatus for preparing a composition using a slurry feed |
| 04/17/2002 | EP1196239A1 Process and apparatus for preparing a composition of matter utilizing an ultrasonic device |
| 04/17/2002 | EP0877651B1 Improved double metal cyanide catalysts and methods for making them |
| 04/17/2002 | EP0728164B1 Process for the production of compounds based on silanes containing epoxy groups |
| 04/17/2002 | CN1345324A Phosphorus-comprising materials, their preparation and use |
| 04/17/2002 | CN1082971C Process for preparation of composition for use in the preparation of thermosetitng powder paints |
| 04/17/2002 | CN1082833C Highly active double metal cyanide complex catalysts |
| 04/16/2002 | US6372861 Having reduced increase in viscosity permitting longer processing times which leads to complete curing; used for printed circuit boards, for impregnation of fibers in filament winding process and production of molding materials |
| 04/16/2002 | US6372825 Hydrazine compounds for epoxy resins |
| 04/16/2002 | US6372351 Laser markability, electrical properties, moldability, reliability and package surface appearance |
| 04/16/2002 | US6372350 For bonding an electronic component to a carrier substrate |
| 04/16/2002 | US6372336 Coated abrasive article |
| 04/16/2002 | US6372108 Increase the throwing power; alkaline polymeric binders containing beta-hydroxyethyl urethane and beta-hydroxypropyl urethane groups byreacting ethylene carbonate and/or propylene carbonate with an amino-containing resin, such as amino epoxy |
| 04/11/2002 | WO2002028939A2 Self-crosslinking resins and coating compositions made therefrom |
| 04/11/2002 | WO2002028849A1 Reworkable epoxidized 1-(cyclo)alkenyl ether/polycarboxylic acid product |
| 04/11/2002 | WO2001077197A3 Hydrogels and methods for their production |
| 04/11/2002 | US20020042493 Polyester/polyether oligomer or polymer having an epoxy or phenolic and moieties derived from diglycidyl ethers or diglycidyl esters, anhydrides and dihydric phenols |
| 04/11/2002 | DE10057111C1 Casting composition for removing thermal energy from electrical or electronic device, comprises epoxide resin, silicone, filler and initiator and cures by chemical reaction, has specified thermal conductivity |
| 04/10/2002 | EP1194953A1 Controllably degradable composition of heteroatom carbocyclic or epoxy resin and curing agent |
| 04/10/2002 | EP1194465A1 Compositions for protecting cable strands for highway structures |
| 04/10/2002 | CN1344302A Radiation curable water based cationic inks and coatings |
| 04/10/2002 | CN1344298A Matting agents for thermally curable systems |
| 04/10/2002 | CN1344285A High solid epoxy, melamine and isocyanate compsn. |
| 04/10/2002 | CN1082449C Liquid jet recording head and process for prodn. thereof |
| 04/09/2002 | US6369183 Methods and materials for fabrication of alumoxane polymers |
| 04/09/2002 | US6369164 (alk)acrylated alkyleneamine macromonomer, (meth)acrylate monomer with phosphonate group, filler, polymerization initiator and stabilizer; bonding and compressive strength; curable; shrinkage inhibition |
| 04/09/2002 | US6369134 Cationic electrodeposition coating composition containing plasticizer |
| 04/09/2002 | US6368769 Aromatic sulfonium compounds, photoacid generators comprising the same, photopolymerizable compositions containing the same, stereolithographic resin compositions, and stereolithographic process |
| 04/09/2002 | CA2088262C Amide diol extended cathodic electrodeposition resins |
| 04/04/2002 | WO2002027780A1 Resin-sealed semiconductor device, and die bonding material and sealing material for use therein |
| 04/04/2002 | WO2002026846A1 Modified polyolefin resin, modified polyolefin resin composition, and use thereof |
| 04/04/2002 | US20020040103 Epoxy compounds for use in dental medicine and/or dentistry |
| 04/03/2002 | EP1193293A1 Resin composition |
| 04/03/2002 | EP1192199A1 Phenol-novolacs with improved optical properties |
| 04/03/2002 | EP0927209B1 Liquid curable resin composition |
| 04/03/2002 | EP0879257B1 Polymerizable substances based on epoxides |
| 04/03/2002 | EP0728155B1 Water soluble active sulfones of poly(ethylene glycol) |
| 04/03/2002 | CN1082067C Epopxy resin composition for sealing photosenmiconductor device |
| 04/03/2002 | CN1082064C Fire-retardant compound, process for producing said fire-retardant compound and fire-retarding thermoplastic resin composition including said fire-retardant compound |
| 04/02/2002 | US6365708 Hydroxypolyamine and epichlorohydrin for coatings |
| 04/02/2002 | US6365707 Catalytic polyepoxides or polythioepoxides and amino compounds |
| 04/02/2002 | US6365699 Acrylated siloxane resins and acrylated melamine-formaldehyde resin with tricarbamoyl triazines |
| 04/02/2002 | US6365644 Photo-curable resin composition used for photo-fabrication of three-dimensional object |
| 04/02/2002 | US6365068 Heterocyclic aromatic anion salts, and their uses as ionic conducting materials |
| 04/02/2002 | CA2018589C Curable resins with reduced foaming characteristics and articles incorporating same |
| 03/28/2002 | WO2002024799A2 Aminoplast-based crosslinkers and powder coating compositions containing such crosslinkers |
| 03/28/2002 | WO2002024782A1 Aminoplast-based crosslinkers and powder coating compositions containing such crosslinkers |
| 03/28/2002 | WO2001088959A3 No-flow reworkable epoxy underfills for flip-chip applications |
| 03/28/2002 | US20020037976 Photo curable adhesive composition |
| 03/28/2002 | US20020037975 Coated film excellent in impact, heat and corrosion resistance |
| 03/28/2002 | DE10043205A1 Epoxy resin mixture for production of composites, e.g. prepregs and laminates for printed circuit boards, contains special phosphorus-modified epoxy resin, dicyandiamide or aromatic amine and hardening accelerator |
| 03/28/2002 | CA2420209A1 Aminoplast-based crosslinkers and powder coating compositions containing such crosslinkers |
| 03/27/2002 | EP1191062A1 Epoxy resin composition and semiconductor devices |
| 03/27/2002 | EP1190001A1 Waterborne sanitary can coating compositions |
| 03/27/2002 | EP1189966A1 Epoxy resin hardener compositions |
| 03/27/2002 | EP1189962A1 Coating material containing a mixture of silicic acids and urea and/or urea derivatives |
| 03/27/2002 | EP0770103B1 Low voc refinish coating composition |
| 03/27/2002 | EP0621879B1 Epoxy resin composition and uses thereof, particularly in composite structures |