| Patents for B28D 5 - Fine working of gems, jewels, crystals, e.g. of semiconductor material; Apparatus therefor (6,662) |
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| 11/13/2013 | CN103387334A Method and device for cutting out hard-brittle substrate |
| 11/13/2013 | CN103386715A Method for preparing single-crystal-like seed crystal by electric spark process |
| 11/13/2013 | CN103386714A Solar silicon rod single-wire one-step cutting method |
| 11/13/2013 | CN103386713A Silicon rod cutting tooling |
| 11/13/2013 | CN102241084B Double-cutterhead horizontal ultra-precision hydrostatic motorized spindle system |
| 11/13/2013 | CN102120344B Single-crystal material cutting method based on fluctuation characteristic of cutting force and fine tuning tool rest |
| 11/07/2013 | US20130291589 Silicon Carbide Princess Cut Gemstone |
| 11/06/2013 | EP2660856A1 Method for manufacturing hexagonal semiconductor plate crystal |
| 11/06/2013 | CN203266968U Glass plate for cutting solar silicon chips |
| 11/06/2013 | CN203266963U Squaring machine |
| 11/06/2013 | CN203266962U Fret saw cutting semiconductor work piece |
| 11/06/2013 | CN203266961U Spherical jewelry suspension cutting device |
| 11/06/2013 | CN103381625A Slicing device and chip manufacturing method using slicing device |
| 11/06/2013 | CN102172799B Laser processing method and laser processing device |
| 10/31/2013 | US20130284160 Method for manufacturing hexagonal semiconductor plate crystal |
| 10/30/2013 | CN203254526U Flange capable of prolonging life of precise part and steel wire take-up device based on flange |
| 10/30/2013 | CN203254524U Cutting head in crystal bar cutting machine |
| 10/30/2013 | CN103380482A Monocrystalline substrate production method and monocrystalline member with modified layer formed therein |
| 10/30/2013 | CN103372922A Method of cutting ingot by wire-cutting mesh |
| 10/30/2013 | CN103372921A Composite wire saw with plating and manufacturing method thereof |
| 10/30/2013 | CN103372920A Wire-type cutting device |
| 10/30/2013 | CN103372919A Tool for demounting scrap steel wires on slicing machine |
| 10/30/2013 | CN102604031B Preparation method and application of polyester polyurethane elastomer |
| 10/24/2013 | US20130280466 Large Diameter, High Quality SiC Single Crystals, Method and Apparatus |
| 10/24/2013 | US20130276610 Method and apparatus for scribing silicon carbide plate |
| 10/23/2013 | CN203246007U Guide panel for method for controlling line drift of line cutting machine |
| 10/23/2013 | CN103358414A Monocrystal bar line cutting fixing device and monocrystal bar line cutting method |
| 10/23/2013 | CN103358413A Method for regulating use proportion of recycling sand in silicon wafer cutting |
| 10/23/2013 | CN103358412A 切削装置 Cutting device |
| 10/23/2013 | CN103358411A Wire for semiconductor wire saw and wire saw |
| 10/23/2013 | CN103358410A Method for manufacturing semiconductor device |
| 10/23/2013 | CN103358409A 切削装置 Cutting device |
| 10/23/2013 | CN103358408A Processing method for sapphire wafer |
| 10/23/2013 | CN103358407A Production method of polycrystalline silicon chips |
| 10/23/2013 | CN102486989B Method and loading plate for degumming cleaning silicon wafer |
| 10/23/2013 | CN101979230B Method for cutting silicon carbide crystal in sections by using multi-line cutter |
| 10/16/2013 | CN103350460A Cutting technology for improving slice production rate of monocrystalline silicon and device of cutting technology |
| 10/10/2013 | WO2013151660A1 Method of and apparatus for thermal laser scribe cutting for electrochromic device production; corresponding cut glass panel |
| 10/10/2013 | WO2013151075A1 Glass film fracturing method and glass film laminate body |
| 10/10/2013 | WO2013151074A1 Glass film fracturing method and glass film laminate body |
| 10/10/2013 | WO2013150990A1 Reinforced glass sheet-cutting method and reinforced glass sheet-cutting system |
| 10/09/2013 | EP2646194A2 Method of separating surface layer of semiconductor crystal using a laser beam perpendicular to the separating plane |
| 10/09/2013 | CN203228325U Single-crystal cut-off feeding bracket |
| 10/09/2013 | CN103348453A Compound semiconductor single crystal substrate and method for manufacturing same |
| 10/09/2013 | CN103347828A Glass plate cutting method and glass plate cutting device |
| 10/09/2013 | CN103347651A Wire saw, and roller positioning method for wire saw |
| 10/09/2013 | CN103341919A Pretreatment process capable of increasing slicing rate of polycrystalline silicon rod |
| 10/09/2013 | CN103341918A Resin fret saw and preparation method thereof |
| 10/09/2013 | CN102017063B Wafer stack cleaning device and method |
| 10/08/2013 | US8551865 Method of cutting an object to be processed |
| 10/03/2013 | WO2013143844A1 Method for producing a fused-quartz hollow cylinder |
| 10/02/2013 | CN203221584U High self-sharpening diamond for fretsaw |
| 10/02/2013 | CN203221583U Novel sapphire ingot rod picking machine |
| 10/02/2013 | CN103331831A Multi-wire cutting method of large neodymium iron boron workpiece |
| 10/02/2013 | CN103331830A Wire-wrapping wheel slide rail device for silicon wafer multi-wire cutting machine |
| 10/02/2013 | CN103331829A Mechanical micro-feeding knife rest for KDP crystal ultra-precise flying cutting machining machine tool |
| 10/02/2013 | CN103331828A Cutting technique of oversized-diameter silicon rod |
| 09/26/2013 | US20130252402 Laser processing method |
| 09/26/2013 | DE102005033953B4 Waferteilungsverfahren und -vorrichtung Wafer dividing method and apparatus |
| 09/25/2013 | EP2641695A1 Method and apparatus for cutting-off rare earth magnet blocks with a multiple blade assembly |
| 09/25/2013 | CN203210536U Automatic punching machine for balls |
| 09/25/2013 | CN103317608A Line breaking detecting device of multi-line cutting machine |
| 09/25/2013 | CN103317607A Ingot cutting device |
| 09/25/2013 | CN103317606A 切削装置 Cutting device |
| 09/25/2013 | CN103317605A Method for processing flat orientation of sapphire ingot |
| 09/24/2013 | US8539940 Jewelry bench dust shield |
| 09/18/2013 | CN203204380U Wire bending monitoring system and wire saw device |
| 09/18/2013 | CN203198083U Protective door device of silicon block slicing machine |
| 09/18/2013 | CN203198082U Automatic cutting line aligning device of sapphire slicer |
| 09/18/2013 | CN203197464U Multiple-laser processing device using polarization characteristics |
| 09/18/2013 | CN103302754A Diamond fretsaw cutting method and device |
| 09/18/2013 | CN103302753A Cutting method for chip scale package glass |
| 09/18/2013 | CN103302752A Cutting method |
| 09/18/2013 | CN103302398A Laser processing apparatus |
| 09/18/2013 | CN101653972B Swing mechanism of workbench |
| 09/18/2013 | CN101644934B Cutting line constant tension closed-loop control method of single-line cutting machine |
| 09/12/2013 | WO2013133030A1 Scribing wheel and method for manufacturing same |
| 09/12/2013 | US20130237402 Sapphire material and production method thereof |
| 09/12/2013 | US20130236386 Cooling and/or lubricating fluids for wafer production |
| 09/11/2013 | CN203185519U Specialized mortar nozzle system |
| 09/11/2013 | CN203185147U Mortar spraying pipe capable of regulating spraying angle |
| 09/11/2013 | CN103286870A Optical chip cutting fixture, chip cutting device and optical chip cutting method |
| 09/11/2013 | CN103286868A Reversing disc applied to superfine diamond wire cutting |
| 09/11/2013 | CN103286867A Steel wire for cutting silicon slices and production method of steel wire |
| 09/11/2013 | CN103286866A Method for low-cost high-quality cutting of solar-grade polycrystalline silicon chips |
| 09/11/2013 | CN103286865A Diamond line and manufacturing method thereof |
| 09/11/2013 | CN103286864A Multi-wire sawing machine |
| 09/11/2013 | CN103286863A Method and apparatus for cutting semiconductor workpieces |
| 09/11/2013 | CN103286862A Method for dividing alumina substrate |
| 09/11/2013 | CN103286861A Method for dividing ceramics substrate |
| 09/11/2013 | CN103286399A Wire cutting machine and groove path device therefore |
| 09/11/2013 | CN102049818B Cutting method for crystalline silicon ingot |
| 09/11/2013 | CN102049817B Wire arraying mechanism of wire winding drum of diamond wire cutting machine |
| 09/11/2013 | CN102049816B Constant tension numerical control multi-thread square cutting machine without pressure sensor |
| 09/11/2013 | CN101947819B Method for processing small-size quartz crystal substrate for manufacturing resonator |
| 09/11/2013 | CN101610870B Method of machining u-shaped groove of substrate of fragile material, removal method, boring method and chamfering method using the same method |
| 09/11/2013 | CN101263592B Device and method for separating electronic components |
| 09/06/2013 | WO2013130581A1 Method and apparatus for separation of strengthened glass and articles produced thereby |
| 09/06/2013 | WO2013128258A1 Holding device |
| 09/05/2013 | DE102009060575B4 Verfahren sowie Vorrichtung zum Vereinzeln von Wafern aus einem Ingot A method and apparatus for separating wafers from an ingot |