Patents
Patents for B28D 5 - Fine working of gems, jewels, crystals, e.g. of semiconductor material; Apparatus therefor (6,662)
01/2014
01/01/2014CN203371667U Moving device for guide wheels in wire cutting machines
01/01/2014CN203371666U Diamond wire moving steering auxiliary device
01/01/2014CN203371665U Crystal corner-expanding forming machine
01/01/2014CN103481387A Main shaft system of multi-wire cutting machine
01/01/2014CN103481386A Work table swinging mechanism of multi-wire cutting machine
01/01/2014CN103481385A Liquid distributing pipe structure of oil-sand multi-wire sawing machine
01/01/2014CN103481384A 切削装置 Cutting device
01/01/2014CN103481383A Methods and apparatus for recovery of silicon and silicon carbide from spent wafer-sawing slurry
01/01/2014CN103481382A Novel tool used for cutting graphite crucible
01/01/2014CN103481381A Cutting method for fragile sheet structures
01/01/2014CN101604659B Optical device wafer dividing method
12/2013
12/31/2013US8616192 Round brilliant cut gemstone and method for cutting the same
12/26/2013US20130344686 Method of cutting object to be processed
12/25/2013EP2211656B1 Gemstones and methods for controlling the appearance thereof
12/25/2013CN203357709U Improved silicon wafer collecting device
12/25/2013CN203357708U Cutting line tension meter protecting device of multi-line cutting machine
12/25/2013CN203357707U Reversing disk for ultrafine diamond line cutting
12/25/2013CN203357706U Diamond jigsaw for cutting machining of photovoltaic power materials
12/25/2013CN203357705U Combined type roller frame
12/25/2013CN203357704U Directional slivering tool for wafer
12/25/2013CN103465385A Flexible thin-film solar cell and segmentation, connection and preparation methods thereof
12/25/2013CN101970194B Methods for processing ornamental diamonds and corresponding ornamental diamonds
12/25/2013CN101752240B Group III nitride semiconductor substrate production method, and group III nitride semiconductor substrate
12/19/2013WO2013185952A1 Method for cutting a single crystal
12/19/2013US20130333682 Method for simultaneously slicing a multiplicity of wafers from a cylindrical workpiece
12/19/2013DE102012209974A1 Verfahren zum gleichzeitigen Abtrennen einer Vielzahl von Scheiben von einem zylindrischen Werkstück A method for simultaneously separating a plurality of slices of a cylindrical workpiece
12/19/2013CA2874906A1 Method for cutting a single crystal
12/18/2013CN203344196U Wire gauze break processing device
12/18/2013CN203344195U Automatic feeding device of solar cell piece cutting machine
12/18/2013CN103459082A Method of separating surface layer of semiconductor crystal (variations)
12/18/2013CN103456617A Production method of illuminating element
12/18/2013CN103448155A Angle regulation system used for slicer
12/18/2013CN103448154A Silicon-block cutting method
12/18/2013CN103448153A Cutting technique and machining fixture for sapphire ingot
12/18/2013CN103448152A Guide wheel device for extracting solar silicon rod
12/18/2013CN103448151A Wafer cutting device and production method of semiconductor element
12/18/2013CN102241077B Method for manufacturing similar mono-crystal silicon ingot seed crystal by adopting casting process
12/18/2013CN101903129B Laser processing apparatus and laser processing method
12/12/2013US20130327308 Apparatus for slicing ingot
12/11/2013CN203331256U Ultraprecise KDP crystal special cutting machine
12/11/2013CN203331255U Device for improving edge reject ratio of NTC 442 slicing machine
12/11/2013CN203331254U Silicon wafer cutting assembly
12/11/2013CN203331253U Device utilizing diamond saw blade to achieve polycrystalline silicon ingot squaring cutting
12/11/2013CN203331252U Cutting machine
12/11/2013CN203331251U Excavator cutting fluid circulating device
12/11/2013CN103434037A Turning clamp and turning method of polycrystalline rod material
12/11/2013CN103434036A Crystal rod orientation device
12/11/2013CN103434034A Polycrystalline ingot squaring fixation device
12/11/2013CN103434033A Polycrystalline ingot squaring device
12/11/2013CN103434032A Steel wire arc height automatic control system of slicer
12/11/2013CN103434031A Method for cutting silicon ingot
12/11/2013CN103434030A Method for cutting silicon ingot by squaring machine
12/11/2013CN101890763B Wiring transversely-moving rack
12/05/2013WO2013179498A1 Adhesive composition for resin-bonded wire saw and method for producing resin-bonded wire saw
12/05/2013US20130319391 Recovery of silicon value from kerf silicon waste
12/05/2013US20130319045 Silicon Carbide Krupps Cut Gemstone
12/04/2013CN203317582U Mortar bearing barrel
12/04/2013CN203317580U Silk yarn guider and laser ablation system
12/04/2013CN203317572U Cutting machine for non-magnetic materials
12/04/2013CN103429387A Wire saw
12/04/2013CN103426743A Method of dicing semiconductor wafer, and dicing tape for processing semiconductor using the same
12/04/2013CN103419290A Tool feeding method for multi-wire sawing of silicon wafers
12/04/2013CN103419289A 一种硅晶体切割机 A silicone crystal cutting machine
12/04/2013CN103419288A Bar saving processing method after wire breaking of multi-wire cutting crystal bar
12/04/2013CN103419287A Automatic punch for ball
12/04/2013CN102219369B Disjunction method of brittle material substrate and substrate disjunction device applied in the method
12/04/2013CN102198702B Wire unreeling device of multi-wire cutting machine
12/03/2013US8598015 Laser processing method
11/2013
11/28/2013WO2013176089A1 Cutting method for item to be processed, item to be processed and semiconductor element
11/28/2013DE102009060575B9 Verfahren sowie Vorrichtung zum Vereinzeln von Wafern aus einem Ingot A method and apparatus for separating wafers from an ingot
11/27/2013CN203305395U Multi-wire cutting machine capable of preventing wire jump of wire net
11/27/2013CN203305394U Hydraulic spool vehicle for producing silicon wafer
11/27/2013CN203305393U Tension arm CDA (Command and Data Acquisition) system of silicon wafer cutter
11/27/2013CN203305392U Control drive device of silicon ingot cutting machine
11/27/2013CN203305391U Diamond fret saw cutting equipment
11/27/2013CN203305390U Solar silicon wafer cutting machine
11/27/2013CN203305389U Solar silicon wafer cutting mortar filtering device
11/27/2013CN203305388U Silicon wafer processing mold
11/27/2013CN103407009A Multi-diamond-wire cutting machine
11/27/2013CN103407008A Improvement method for crystal rod cutting
11/27/2013CN103407007A Winding tool
11/27/2013CN103407006A Filtering device of cutting chamber
11/27/2013CN102189611B Equidensity mortar cutting method for linear cutting of solar wafer
11/26/2013US8591288 Method and device for mechanically processing diamond
11/20/2013EP2664402A1 Wire saw and process for cutting work pieces, in particular work pieces of hard and brittle material
11/20/2013CN203293391U Multi-wire cutting machine winding handpiece and cutting machine
11/20/2013CN103395132A Method for adjusting and detecting utilization proportion of old mortar in silicon wafer cutting
11/20/2013CN103395131A Multi-wire cutting machine guide wheel wire groove and machining method thereof
11/20/2013CN103395130A Diamond wire electrical discharge machine capable of completely flat wiring
11/20/2013CN102133777B Wire-break processing device for multi-wire cutting machines
11/20/2013CN102092102B Crystal-block bonding rod slicing process
11/20/2013CN101959813B Separation device and separation method of mother board for plane display panel
11/14/2013WO2013166976A1 Method for manufacturing resin diamond wire
11/14/2013US20130298605 Silicon Carbide Asscher Cut Gemstone
11/13/2013EP2662432A1 Methods to recover and purify silicon particles from saw kerf
11/13/2013EP2662186A1 Method and apparatus for scribing silicon carbide board
11/13/2013CN203282617U Device for cleaning sizing agents on steel wire of fret saw and fret saw
11/13/2013CN203282616U Net dividing support and wire cutting machine with same
11/13/2013CN203282429U Disassembling tool and jigsaw cutting machine
11/13/2013CN103391992A Water-soluble working fluid for fixed abrasive grain wire saw
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