Patents
Patents for B28D 5 - Fine working of gems, jewels, crystals, e.g. of semiconductor material; Apparatus therefor (6,662)
02/2014
02/05/2014CN203418656U Linear cutting guide wheel and linear cutting machine tool
02/05/2014CN203418655U Cooling liquid nozzle for diamond wire cutting
02/05/2014CN103552166A Device for adjusting crystal-orientation deviation degree of silicon rod
02/05/2014CN103552165A Handling method for line-broken scrapped silicon block
02/05/2014CN103552164A Scrap collection device of slicer
02/05/2014CN103552163A Handling method adopted after cutting wire breakage of multi-wire sawing machine
02/05/2014CN103552162A Method for removing silicon slice bonding surface check lines
02/05/2014CN103551748A Laser beam machining method and laser beam machining device
02/05/2014CN103551747A Laser beam machining method and laser beam machining device
02/05/2014CN103551746A Laser beam machining method and laser beam machining device
02/05/2014CN103551745A Laser beam machining method
02/05/2014CN103551744A Laser beam machining method
02/05/2014CN103551738A Laser beam machining method and laser beam machining device
02/05/2014CN103551737A Laser beam machining method
02/05/2014CN103551736A Cutting method for optically transparent material
02/05/2014CN103203807B Ultrasonic rotary corer
01/2014
01/30/2014WO2014017878A2 Scribing wheel having fine structure groove
01/30/2014WO2014017577A1 Sheet glass, method for manufacturing sheet glass, and device for manufacturing sheet glass
01/29/2014CN203409909U Tooling clamp for graphite slender shaft machined part
01/29/2014CN203409908U Diamond broken wire warning device for multi-wire sawing machine
01/29/2014CN203409906U Cutting fluid circulating and guiding device for multi-wire cutting machine
01/29/2014CN203409905U Mortar transfer filtering device for wire cutter
01/29/2014CN203409904U Diamond wire rod for cutting silicon wafer
01/29/2014CN203409903U Sapphire crystal bar drawing mechanism
01/29/2014CN203409902U Quicksand tank for cutting crystal plate
01/29/2014CN103545409A Optical device and processing method of the same
01/29/2014CN103545253A Laser processing method for wafer
01/29/2014CN103538160A Hard and brittle material multi-line cutting method and cutting device
01/29/2014CN103538159A Hard and brittle material cutting device
01/29/2014CN103538158A Magnetic abrasive fretsaw cutting method
01/29/2014CN103538157A Method for cutting crystalline silicon blocks
01/29/2014CN103537809A Laser beam machining method and laser beam machining device
01/29/2014CN103537796A Laser processing method and laser processing apparatus
01/29/2014CN101679041B 多晶金刚石 Polycrystalline diamond
01/23/2014WO2014012879A1 Device for separating wafers
01/22/2014CN203401622U Fan water mist eliminating device
01/22/2014CN203401618U Multi-wire cutting machine device
01/22/2014CN203401617U Multi-wire cutting machine bearing block assembling and disassembling device
01/22/2014CN203401616U Device for reducing broken edges of crystal silicon wafer
01/22/2014CN203401615U Silicon ingot cutting device
01/22/2014CN103534089A Laminate, method for cutting laminate, method for processing laminate, and device and method for cutting brittle plate-like object
01/22/2014CN103531515A Apparatus for supporting a workpiece during processing of the workpiece
01/22/2014CN103526289A Sub-ingot silicon rod with technology protection ends and production method
01/22/2014CN103522433A Wireless-control automatic mortar metering device
01/22/2014CN103522432A Silicon briquette cutting method and device
01/22/2014CN103522431A Silicon wafer cutting technology
01/22/2014CN103522430A Multi-station sapphire cutting machine control system
01/22/2014CN103522429A Method for preventing wire cutting steel wires from being broken and improving silicon wafer yield
01/22/2014CN103522428A Solar silicon wafer processing method and device
01/22/2014CN102126260B Method for processing irregular PDC (Polycrystalline Diamond Composite)
01/22/2014CN101862907B Laser beam machining method, laser beam machining apparatus, and laser machined product
01/16/2014WO2014010686A1 Method for producing functional substrate
01/16/2014WO2014010154A1 Scribing method and scribing device
01/16/2014US20140017985 Abrasive article and method of forming
01/16/2014US20140017984 Abrasive Article and Method Of Forming
01/16/2014US20140013801 Hearts & Arrows SiC Gemstone
01/15/2014EP2684635A1 Substrate and method for preparing the fracture of a substrate for at least a power semiconductor device
01/15/2014CN203391132U Auxiliary emptying device based on backflow cylinder of HCT multi-wire sawing machine
01/15/2014CN203391131U Mortar renewal device for cutting of silicon wafers
01/15/2014CN203391130U 硅片切割装置 Wafer cutting device
01/15/2014CN203391129U Steel wire for cutting silicon wafer
01/15/2014CN203391128U Mortar filtering system for silicon chip cutting machine tool
01/15/2014CN203390668U Multifunctional machining device for zone-melting bars
01/15/2014CN103515491A Manufacturing method for light-emitting diode
01/15/2014CN103507175A Guide pulley structure for silicon wafer cutting
01/15/2014CN103507174A Squarer crystal support
01/15/2014CN103507173A Method for simultaneously slicing a multiplicity of wafers from a cylindrical workpiece
01/15/2014CN103507172A Tip holder
01/15/2014CN103507171A Cutting unit and application device thereof
01/15/2014CN103507170A Tip holder storage body
01/15/2014CN103507168A Substrate processing system and mounting method of tip holder used therein
01/15/2014CN103506910A Optical low pass filter substrate machining process
01/15/2014CN103504734A Manufacturing method of octagonal diamond with eight hearts and eight arrows inside
01/15/2014CN102241079B Crystal bar cutting mechanism with saw
01/15/2014CN102241078B Work cutting device and work cutting method
01/15/2014CN101862906B Laser beam machining method, laser beam machining apparatus, and laser machined product
01/09/2014US20140011434 Abrasive article and method of forming
01/08/2014CN203381056U Wire arrangement detector for multi-wire cutting machine
01/08/2014CN203381055U Main roll of multi-wire sawing machine
01/08/2014CN203381054U 晶块切割装置 Ingot cutting device
01/08/2014CN203381053U Circular flat belt
01/08/2014CN203381052U Resin-diamond wire producing machine
01/08/2014CN203380419U Intelligent inside diameter slicer with sensor
01/08/2014CN103502409A Hydrous cutting fluid for slicing silicon ingot
01/08/2014CN103501975A Method for fixing a single-crystal workpiece to be treated on a processing device
01/08/2014CN103496043A Linear cutting sheave for solar silicon wafers
01/08/2014CN103496042A Slurry flow guide rod mechanism of solar silicon wafer fretsaw cutting machine
01/08/2014CN102083760B Scribing apparatus
01/07/2014US8621738 Glass cutting apparatus, glass-substrate disassembling apparatus, glass-substrate disassembling system, glass cutting method, and glass-substrate disassembling method
01/03/2014WO2014003157A1 Aqueous processing liquid
01/02/2014US20140000580 Method for resuming operation of wire saw and wire saw
01/02/2014DE112012001312T5 Verfahren zur Wiederaufnahme des Betriebs einer Drahtsäge und Drahtsäge Process for the resumption of the operation of a wire saw and wire saw
01/01/2014EP2679662A2 Methods to recover and purify silicon particles from saw kerf
01/01/2014EP2679661A1 Water-soluble working fluid for fixed abrasive grain wire saw
01/01/2014EP2679364A1 Diamond wire saw device
01/01/2014CN203371673U Silicon block fixing tool
01/01/2014CN203371671U Disconnection detecting device of multi-wire sawing machine
01/01/2014CN203371670U Novel mortar cylinder for wire cutting machine
01/01/2014CN203371669U Diamond wire cutting machine capable of arranging wires in full-planar mode
01/01/2014CN203371668U Shaft lever for fixing squaring machine bobbin
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