B24B 37 - Lapping machines or devices; Accessories

Patents for B24B 37 - Lapping machines or devices; Accessories (20,836)
11/2011
11/16/2011	CN101823231B Multi-axial section and axial surface grinder and method thereof
11/16/2011	CN101823230B Triaxial non-spherical processing clamp with adjustable inclination angle
11/16/2011	CN101417408B Synchronous belt drive four-position plane grinding device
11/15/2011	US8058172 Polishing process of a semiconductor substrate
11/15/2011	US8057282 High-rate polishing method
11/15/2011	US8057281 Methods of removing defects in surfaces
11/10/2011	WO2011138304A1 Method for simultaneous double-side material-removing processing of a semiconductor wafer
11/10/2011	US20110275217 Polishing solution for cmp and polishing method using the polishing solution
11/10/2011	DE102010026352A1 Verfahren zur gleichzeitigen beidseitigen Material abtragenden Bearbeitung einer Halbleiterscheibe Method for simultaneous two-sided material-removing processing a semiconductor wafer
11/09/2011	CN202029027U Transmission mechanism
11/09/2011	CN202029026U Floating milling cutter
11/09/2011	CN202029025U Measuring tool antifouling abrader
11/09/2011	CN202029021U Polishing contact of vibratory polishing machine used for roller
11/09/2011	CN202028780U Lathe die head for processing grinding disc plane
11/09/2011	CN102233544A Chemical mechanical polishing method
11/09/2011	CN102233543A Grinder
11/09/2011	CN102233542A Chemical mechanical polishing system, method and system
11/09/2011	CN102233541A Ultraprecision machining technique of sapphire substrate for high-power light-emitting diode (LED)
11/09/2011	CN101879698B Dual-cylinder carriage and combined oilstone clamp mechanism of bearing roller super-precision grinding machine
11/09/2011	CN101681825B Metal film polishing pad and method for polishing metal film using the same
11/09/2011	CN101659034B Method for performing chemical-mechanical polishing (cmp)
11/08/2011	US8053521 Chemical mechanical polishing pad
11/08/2011	US8052504 Method, apparatus and system for use in processing wafers
11/03/2011	WO2011136387A1 Sapphire polishing slurry and sapphire polishing method
11/03/2011	WO2011136106A1 Polishing fluid composition for glass hard disc substrates
11/03/2011	WO2011135949A1 Method for polishing silicon wafer and polishing liquid therefor
11/03/2011	WO2011055960A3 Apparatus and method for polishing and washing a semiconductor wafer
11/03/2011	US20110269378 Chemical mechanical polishing system
11/03/2011	US20110268994 Glass substrate for information recording medium, polishing colloidal silica slurry for manufacturing the same and information recording medium
11/02/2011	EP2383773A2 Method of electrochemical-mechanical polishing of silicon carbide wafers
11/02/2011	EP2382651A1 Chemical-mechanical planarization pad including patterned structural domains
11/02/2011	CN202021548U Rotary driving device of grinding platform
11/02/2011	CN202021543U Grinding head with conical bore
11/02/2011	CN202021542U Portable alternating current pulse type grinder for contact of relay
11/02/2011	CN202021541U Polishing device
11/02/2011	CN102232242A Polishing solution for CMP and polishing method using the polishing solution
11/02/2011	CN102231364A Nanoscale particle simulation substrate reprocessing method
11/02/2011	CN102231018A Display panel and rim narrowing method thereof
11/02/2011	CN102229106A Multi-axis driving device for double-faced grinding machine
11/02/2011	CN102229105A Chemically mechanical polishing method
11/02/2011	CN102229104A Substrate polishing apparatus and method
11/02/2011	CN102229103A Inner circle small-hole grinding machine
11/02/2011	CN102229102A Precision lifting mechanism for gear ring of grinding machine
11/02/2011	CN102229101A Chemically mechanical polishing method
11/02/2011	CN102229100A Novel plug valve grinding machine
11/02/2011	CN102229099A Grinding and cleaning machine of sealing elements
11/02/2011	CN102229098A Jig device of punch forming device
11/01/2011	US8048803 Method for forming contact plug in a semiconductor device
11/01/2011	US8047894 Apparatus for evaluating the quality of a lapping plate
10/2011
10/27/2011	WO2011133386A2 Closed-loop control for improved polishing pad profiles
10/27/2011	WO2011132665A1 Method for manufacturing an aluminosilicate glass substrate for hard disks
10/27/2011	US20110263183 Polishing solution distribution apparatus and polishing apparatus having the same
10/26/2011	EP2379280A1 Coated carrier for lapping and methods of making and using
10/26/2011	CN202015995U Device for grinding inner wall of steel cylinder
10/26/2011	CN102227289A Polishing pad and method for producing same
10/26/2011	CN102225531A Method for rapidly grinding carbon brush of direct current motor
10/26/2011	CN102225530A New process for reproduction of main control valve
10/26/2011	CN101663739B Polishing apparatus
10/26/2011	CN101588895B Process for producing glass substrate for magnetic disk
10/25/2011	US8045295 Method and apparatus for providing an additional ground pad and electrical connection for grounding a magnetic recording head
10/25/2011	US8043870 CMP pad thickness and profile monitoring system
10/25/2011	US8043140 Wafer polishing apparatus and wafer polishing method
10/20/2011	WO2011130072A2 Composition and method for polishing bulk silicon
10/20/2011	WO2011129254A1 Polishing pad
10/20/2011	WO2011128217A1 Method for producing a semiconductor wafer
10/20/2011	US20110256817 Polishing pad and method for producing same
10/20/2011	US20110256815 Method for polishing silicon wafer, method for producing silicon wafer, apparatus for polishing disk-shaped workpiece, and silicon wafer
10/20/2011	US20110256813 Coated carrier for lapping and methods of making and using
10/20/2011	DE102010014874A1 Verfahren zur Herstellung einer Halbleiterscheibe A process for producing a semiconductor wafer
10/19/2011	EP2376257A1 Device for grinding both sides of flat workpieces
10/19/2011	EP1851002B1 Polishing apparatus and polishing method
10/19/2011	EP1828333B1 Polishing composition and polishing method
10/19/2011	CN202010937U Grinding workbench of AC pulsed relay contacts
10/19/2011	CN202010936U DC pulse type grinding work table for relay contacts
10/19/2011	CN202010935U Portable direct current (DC) pulse type grinder for relay contact
10/19/2011	CN1713967B Chemical-solution supplying apparatus
10/19/2011	CN102222638A Method for removing copper residue between copper lead wires
10/19/2011	CN102221416A Polishing solution physical parameter measuring apparatus, measuring method and chemically mechanical polishing equipment
10/19/2011	CN102218700A Chemical mechanical polishing equipment
10/19/2011	CN102218699A Grinder
10/18/2011	US8038749 Composition for removing photoresist layer and method for using it
10/18/2011	US8038509 Chemical mechanical polishing apparatus
10/13/2011	WO2011126599A1 Chemical-mechanical polishing pad conditioning system
10/13/2011	WO2011125254A1 Polishing slurry and polishing method therefor
10/13/2011	WO2011090681A3 Anti-loading abrasive article
10/13/2011	US20110250824 Polishing method and polishing apparatus
10/13/2011	US20110250756 Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing method, kit for chemical mechanical polishing, and kit for preparing aqueous dispersion for chemical mechanical polishing
10/13/2011	US20110250755 Method of polishing wafer surface on which copper and silicon are exposed
10/13/2011	US20110250754 Polishing Composition and Polishing Method
10/13/2011	US20110249533 Glass substrate polishing method, package manufacturing method, piezoelectric vibrator, oscillator, electronic device and radio timepiece
10/13/2011	US20110248788 Glass substrate polishing method, package manufacturing method, piezoelectric vibrator, oscillator, electronic device and radio timepiece
10/12/2011	EP2374852A1 Polishing composition and polishing method
10/12/2011	EP1349701B1 Jet-induced finishing of a substrate surface
10/12/2011	CN202006420U Annular surface grinder
10/12/2011	CN202006419U Grinding head
10/12/2011	CN102212315A Polishing composition and polishing method
10/12/2011	CN102211313A Micrometer caliper grinder with accurately adjustable size
10/12/2011	CN102211312A Large-cycle water-aqua grinding process for precision steel ball
10/12/2011	CN102211311A Chemical-mechanical polishing equipment
10/12/2011	CN102211306A Method of polishing wafer surface on which copper and silicon are exposed

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