| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 04/03/2003 | US20030062616 Electrically conductive path through a dielectric material |
| 04/03/2003 | US20030062601 Surface mount package |
| 04/03/2003 | US20030062403 High-speed direct writing with metallic microspheres |
| 04/03/2003 | US20030062399 Metal/ceramic bonding article and method for producing same |
| 04/03/2003 | US20030062398 Method for manufacturing raised electrical contact pattern of controlled geometry |
| 04/03/2003 | US20030062338 Manufacture and method for obtaining accurately dimensioned features from a metal-containing web processed with a continuous etch process |
| 04/03/2003 | US20030062196 Anchor point for RF circuit boards and related methods |
| 04/03/2003 | US20030062195 Soldered heat sink anchor and method of use |
| 04/03/2003 | US20030062194 Flexible circuit with electrostatic damage limiting feature |
| 04/03/2003 | US20030062192 Method and structure for identifying lead-free solder |
| 04/03/2003 | US20030062184 Package for an electrical device |
| 04/03/2003 | US20030062111 Method of manufacturing glass ceramic multilayer substrate |
| 04/03/2003 | US20030061948 Reservoir stencil with relief areas |
| 04/03/2003 | US20030061927 Stamping apparatus having replaceable dies |
| 04/03/2003 | US20030061711 Method for reducing multiline effects on a printed circuit board |
| 04/03/2003 | US20030061710 Method and apparatus for producing circuitry |
| 04/03/2003 | US20030061709 Extension mechanism and method for assembling overhanging components |
| 04/03/2003 | DE10152330C1 Rear-sided surface mounting method for flexible circuit board components uses pins of pin plate for supporting circuit board with rear side facing upwards |
| 04/03/2003 | DE10138278C1 Elektronisches Bauteil mit aufeinander gestapelten elektronischen Bauelementen und Verfahren zur Herstellung derselben An electronic part having stacked electronic components and methods for making same |
| 04/02/2003 | EP1298972A2 Multilayer wiring circuit board |
| 04/02/2003 | EP1298971A2 Structure for circuit board mounting |
| 04/02/2003 | EP1298970A2 Method for producing metal/ceramic bonding circuit board |
| 04/02/2003 | EP1298968A2 Metal/ceramic circuit board |
| 04/02/2003 | EP1298967A2 Electronic card |
| 04/02/2003 | EP1298726A2 Solder composition for semiconductor bumps |
| 04/02/2003 | EP1298724A2 Package for an electrical device |
| 04/02/2003 | EP1298155A1 Photo-setting and thermosetting resin composition, process for preparing plugged-through-hole printed wiring board, and plugged-through-hole printed wiring board |
| 04/02/2003 | EP1298109A2 Metal/ceramic bonding article and method for producing same |
| 04/02/2003 | EP1298108A2 Metal/ceramic bonding article |
| 04/02/2003 | EP1298007A2 Integrated light and accessory assembly |
| 04/02/2003 | EP1297548A1 Multilayer electrode structure and method for forming |
| 04/02/2003 | EP1297385A2 Material and method for making an electroconductive pattern |
| 04/02/2003 | EP1297383A1 A method for individualised marking of circuit boards |
| 04/02/2003 | EP1297326A2 Optical system |
| 04/02/2003 | EP1297198A2 Electroless platinum-rhodium alloy plating |
| 04/02/2003 | EP1297086A1 Polymeric materials to metal surfaces adhesion process |
| 04/02/2003 | EP1296913A2 Photostructured paste |
| 04/02/2003 | EP1198532A4 Dielectric material including particulate filler |
| 04/02/2003 | EP1192199A4 Phenol-novolacs with improved optical properties |
| 04/02/2003 | EP1083998B1 Device and method for jetting droplets |
| 04/02/2003 | CN1408197A Method, facility and device for producing electrical connecting element, product and semi-finished products thereof |
| 04/02/2003 | CN1407847A Wiring substrate manufacture |
| 04/02/2003 | CN1407846A Method for making tinny holes on printing circuit boards |
| 04/02/2003 | CN1407845A Module element, core substrate assembly, multi-layer substrate and their manufacture |
| 04/02/2003 | CN1407665A Electric connector for printing circuit board |
| 04/02/2003 | CN1407658A Cable assembly with pressed connector |
| 04/02/2003 | CN1407618A Integrated circuit modules and printing circuit board device |
| 04/02/2003 | CN1407611A Laminated film and film carrying band for packaging electronic device |
| 04/02/2003 | CN1407568A Ceramic electronic element with leads |
| 04/02/2003 | CN1407360A Optical connector and element |
| 04/02/2003 | CN1406743A Method and apparatus for pressing component |
| 04/02/2003 | CN1104832C Method for plating independent conductor circuit |
| 04/02/2003 | CN1104749C Laminated electronic spares |
| 04/02/2003 | CN1104742C Bottom lead semiconductor package and fabrication method thereof |
| 04/02/2003 | CN1104643C Foreign matter checking method and device |
| 04/02/2003 | CN1104302C 激光加工装置 The laser processing apparatus |
| 04/02/2003 | CN1104301C Ultrasonic welding of copper foil |
| 04/01/2003 | USRE38053 Liquid crystal display device and manufacturing method thereof |
| 04/01/2003 | US6542384 Riser card local EMI shield for a computer chassis |
| 04/01/2003 | US6542381 Device and method for mounting vibrator |
| 04/01/2003 | US6542379 High density circuit |
| 04/01/2003 | US6542377 Printed circuit assembly having conductive pad array with in-line via placement |
| 04/01/2003 | US6542374 Circuit board, method for manufacturing the circuit board, and display device and electronic equipment employing the circuit board |
| 04/01/2003 | US6542213 Compression-bond-connection substrate, liquid crystal device, and electronic equipment |
| 04/01/2003 | US6542065 Variable voltage protection structures and method for making same |
| 04/01/2003 | US6541868 Interconnecting conductive links |
| 04/01/2003 | US6541865 Porous dielectric material and electronic devices fabricated therewith |
| 04/01/2003 | US6541857 Method of forming BGA interconnections having mixed solder profiles |
| 04/01/2003 | US6541855 Printed board unit |
| 04/01/2003 | US6541853 Randomly oriented magnetic particles in a selected localized region of the dielectric are aligned to form an electrically conductive path between the first conductive point and the second conductive point the dielectric |
| 04/01/2003 | US6541848 Semiconductor device including stud bumps as external connection terminals |
| 04/01/2003 | US6541845 Components with releasable leads and methods of making releasable leads |
| 04/01/2003 | US6541762 Sub chip on board for optical mouse |
| 04/01/2003 | US6541736 Circuit board/printed circuit board having pre-reserved conductive heating circuits |
| 04/01/2003 | US6541731 Use of multiple laser sources for rapid, flexible machining and production of vias in multi-layered substrates |
| 04/01/2003 | US6541712 High speed multi-layer printed circuit board via |
| 04/01/2003 | US6541711 Isolated ground circuit board apparatus |
| 04/01/2003 | US6541710 Method and apparatus of supporting circuit component having a solder column array using interspersed rigid columns |
| 04/01/2003 | US6541709 Inherently robust repair process for thin film circuitry using uv laser |
| 04/01/2003 | US6541701 Containment fence apparatus and potting method |
| 04/01/2003 | US6541378 High density connectors; connecting copper to dielectric; precleaning with argon; polyimide silicone epoxy adhesive |
| 04/01/2003 | US6541365 Insulating interposer between two electronic components and process thereof |
| 04/01/2003 | US6541364 Bump forming method and bump forming apparatus |
| 04/01/2003 | US6541305 Single-melt enhanced reliability solder element interconnect |
| 04/01/2003 | US6541181 Heat sensitive element on lithographic substrate |
| 04/01/2003 | US6541126 Copper microparticles deposited on the surface of carrier foil and covered with the release interface layer and electrodeposited copper layer; very accurate holes formed by laser; high yield in production of printed wiring boards |
| 04/01/2003 | US6541069 Applying a treatment fluid in lieu of cutting oil during the fabrication of the cutting tool, which include a compound containing phosphorus and nitrogen/hydrogen groups, forming phosphorus based protective layer and hydrid and nitride |
| 04/01/2003 | US6540963 Humidity; wires encapsulated with high molecualr weight resin |
| 04/01/2003 | US6540952 Laser ablation of multiple layers |
| 04/01/2003 | US6540866 Method for lamination of fluoropolymer to metal and printed circuit board (PCB) substrate |
| 04/01/2003 | US6540527 Method and adapter for reworking a circuit containing an LGA device |
| 04/01/2003 | US6540525 High I/O stacked modules for integrated circuits |
| 04/01/2003 | US6540152 Dispensing assembly |
| 04/01/2003 | US6540127 Electrostatic methods and apparatus for mounting and demounting particles from a surface having an array of tacky and non-tacky areas |
| 04/01/2003 | US6539855 Method and apparatus for screen printing |
| 04/01/2003 | US6539626 Electroconductive path parallel to the surface are provided internally |
| 04/01/2003 | US6539625 Chromium adhesion layer for copper vias in low-k technology |
| 04/01/2003 | US6539613 Method of forming trimmable resistors |
| 04/01/2003 | CA2196861C Patterned metal foil laminate and method for making same |
| 04/01/2003 | CA2125367C Method for coating using molten organosiloxane compositions |