Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
03/2003
03/27/2003WO2003026371A1 Low signal loss bonding ply for multilayer circuit boards
03/27/2003WO2003026370A1 Surface mounting package
03/27/2003WO2003026368A1 Method for forming image on object surface including circuit substrate
03/27/2003WO2003026367A1 Method for laser beam drilling with a perforated mask
03/27/2003WO2003026366A1 Flexible wiring board and liquid crystal display unit using the same
03/27/2003WO2003026060A1 High-frequency module substrate device
03/27/2003WO2003026010A1 Thin electronic label and method for making same
03/27/2003WO2003026009A2 Power electronics component
03/27/2003WO2003025997A1 Circuit device mounitng method and press
03/27/2003WO2003025976A2 Embedded inductor for semiconductor device circuit
03/27/2003WO2003025974A2 Intermediate support for electronic components and method for solder contacting such an intermediate support
03/27/2003WO2003025955A1 Coated conductive particle, coated conductive particle manufacturing method, anisotropic conductive material, and conductive connection structure
03/27/2003WO2003025953A1 Process relating to polymers
03/27/2003WO2003025589A1 Contact structure, method of manufacturing the structure, and contact assembly using the structure
03/27/2003WO2003025588A1 Contact structure, method of manufacturing the structure, and contact assembly using the structure
03/27/2003WO2003025254A2 Device for the transport and wet-chemical or electrolytic treatment of very thin and planar items to be treated
03/27/2003WO2003024889A1 Printed circuit techniques for polyethylene surfaces
03/27/2003WO2003024711A2 Method for producing a ceramic substrate and ceramic substrate
03/27/2003WO2003024708A1 Security tag and process for making same
03/27/2003WO2003024707A1 Metal-containing web processed with a continuous etch process
03/27/2003WO2003024653A1 Method for the production of a soldered connection
03/27/2003WO2003007078A3 Photocurable resist inks
03/27/2003WO2002023620A3 Connection for conducting high frequency signal between a circuit and a discrete electrical component
03/27/2003WO2002020875A8 Method for producing an adhesive metal coating
03/27/2003US20030061591 Interconnected series of plated through hole vias and method of fabrication therefor
03/27/2003US20030061590 System and method for printed circuit board conductor channeling
03/27/2003US20030060531 Do not require solvent to provide a system having suitable viscosity for convenient handling; rapid cure; adhesively attaching a microelectronic device to a substrate; die-attach paste
03/27/2003US20030060172 Radio frequency module
03/27/2003US20030060066 Solder ball and interconnection structure using the same
03/27/2003US20030060065 Electrical connector with continuous strip contacts
03/27/2003US20030060064 Spiral contactor and manufacturing method for this apparatus, and a semiconductor inspecting equipment and electronical parts using this apparatus
03/27/2003US20030060062 Flexible Printed Circuit Board Having Conductor Lands Formed Thereon
03/27/2003US20030060061 Contact array for semiconductor package
03/27/2003US20030060043 Hardening flux, soldering resist, semiconductor package reinforced by hardening flux, semiconductor device and method of producing semiconductor package and semiconductor device
03/27/2003US20030060040 Method of electroless plating copper on nitride barrier
03/27/2003US20030060000 Wiring board and fabricating method thereof, semiconductor device and fabricating method thereof, circuit board and electronic instrument
03/27/2003US20030059982 Methods of and apparatus for manufacturing ball grid array semiconductor device packages
03/27/2003US20030059964 Electric-circuit fabricating method and system, and electric-circuit fabricating program
03/27/2003US20030059961 Electric-circuit fabricating system and method, and electric-circuit fabricating program
03/27/2003US20030059642 Method of making lead-free solder and solder paste with improved wetting and shelf life
03/27/2003US20030059578 Dimensionally stable composite article and method of making the same
03/27/2003US20030059544 Photodegradation of complex
03/27/2003US20030059541 Vacuum deposition; flexible printed circuits
03/27/2003US20030059151 Waveguide in a printed circuit board and method of forming the same
03/27/2003US20030059102 Device and method for investigating predetermined areas of printed circuit boards
03/27/2003US20030058630 Multilayer circuit board and semiconductor device using the same
03/27/2003US20030058629 Wiring substrate for small electronic component and manufacturing method
03/27/2003US20030058628 Power module adapter
03/27/2003US20030058625 Identifiable flexible printed circuit board and method of fabricating the same
03/27/2003US20030058624 Land grid array integrated circuit device module
03/27/2003US20030058577 Bonding pad of suspension circuit
03/27/2003US20030058398 Display apparatus characterized by wiring structure
03/27/2003US20030058311 Inkjet cartridge and method of identifying color of ink thereof by flexible printed circuit board
03/27/2003US20030058230 Flat-panel type display apparatus
03/27/2003US20030058064 Package substrate, integrated circuit apparatus, substrate unit, surface acoustic wave apparatus, and circuit device
03/27/2003US20030057985 Test socket and methods
03/27/2003US20030057978 Substrate for a probe card having conductive layers for supplying power to IC devices
03/27/2003US20030057974 Arrangement of vias in a substrate to support a ball grid array
03/27/2003US20030057885 Electronic equipment
03/27/2003US20030057731 Door module with electrical wires and connectors
03/27/2003US20030057572 Encapsulation of pin solder for maintaining accuracy in pin position
03/27/2003US20030057565 Making interconnections to a non-flat surface
03/27/2003US20030057559 Methods of forming metallurgy structures for wire and solder bonding
03/27/2003US20030057548 Integrated power delivery and cooling system for high power microprocessors
03/27/2003US20030057543 Film substrate, semiconductor device, method of manufacturing film substrate, method of manufacturing semiconductor device and method of manufacturing circuit board with semiconductor device
03/27/2003US20030057542 Leads of a no-lead type package of a semiconductor device
03/27/2003US20030057515 Electronic interface structure comprising base, elastomeric island supported by base, patterned metallization overlying elastomeric island and including floating pad at least partially overlying elastomeric island
03/27/2003US20030057470 Circuit substrate
03/27/2003US20030057430 Comprises package including circuit board housing attached to a printed circuit board for supporting diode
03/27/2003US20030057265 Methods and electronic board products utilizing endothermic material for filling vias to absorb heat during wave soldering
03/27/2003US20030057264 Paste providing method, soldering method and apparatus and system therefor
03/27/2003US20030057253 Filling device
03/27/2003US20030057193 Method for forming a via hole, flexible wiring board using the method, and method for producing the flexible wiring board
03/27/2003US20030057181 Method of manufacturing a microstrip edge ground termination
03/27/2003US20030056981 Ceramic circuit board and method for manufacturing the same
03/27/2003US20030056980 Multilayer board having precise perforations and circuit substrate having precise through-holes
03/27/2003US20030056979 Device and method for assembling card edge slots into a substrate
03/27/2003US20030056978 Interlayer connection structure of multilayer wiring board, method of manufacturing flexible printed circuit board and method of forming land thereof
03/27/2003US20030056976 Fabricating method of semiconductor devices, fabricating method of printed wired boards, and printed wired board
03/27/2003US20030056975 Anti-tombstoning structures and methods of manufacture
03/27/2003US20030056965 Drive circuit for electric motor and method for assembling the same
03/27/2003US20030056890 Thin film forming apparatus and thin film forming method
03/27/2003US20030056676 Reflow apparatus in continuous printing and mounting apparatus for film-like printing body
03/27/2003US20030056665 Printing screen
03/27/2003US20030056474 Method of inspecting newly purchased or reground materials for making printed circuit boards
03/27/2003US20030056366 Printed circuit board and method for manufacturing the same
03/27/2003US20030056365 Coupon registration mechanism and method
03/27/2003DE20118393U1 Connection system for a flat flexible ribbon cable or foil conductor uses particle coating
03/27/2003DE10145348C1 Intermediate carrier for electronic component has suction used for removal of excess solder at foot of contact projections formed integral with plastics carrier body
03/27/2003CA2460565A1 Security tag and process for making same
03/27/2003CA2460045A1 Coated conductive particle, coated conductive particle manufacturing method, anisotropic conductive material, and conductive connection structure
03/26/2003EP1296453A2 Package substrate for integrated circuit device
03/26/2003EP1296431A2 Bus bar assembly
03/26/2003EP1296375A2 Wire bonding surface
03/26/2003EP1296189A2 Photosensitive resin composition and printed wiring board
03/26/2003EP1296188A2 Photosensitive resin composition and printed wiring board
03/26/2003EP1295671A1 Metal-ceramic composite substrates, producing methods thereof and brazing materials for use in such method
03/26/2003EP1295665A2 Method of manufacturing mount structure without introducing degraded bonding strength of electronic parts due to segregation of low-strength/low-melting point alloy
03/26/2003EP1295518A2 Process for thick film circuit patterning
03/26/2003EP1295517A1 Vialess printed circuit board
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