Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
01/2011
01/11/2011US7866035 Water-cooled photovoltaic receiver and assembly method
01/11/2011CA2476123C Filtration of flux contaminants
01/06/2011WO2011002022A1 Printed circuit board and manufacturing method of printed circuit board
01/06/2011WO2011001900A1 Printed-wiring board and process for manufacture thereof
01/06/2011WO2011001692A1 Tape application apparatus
01/06/2011WO2011001499A1 Electronic part manufacturing method and electronic part manufactured by the method
01/06/2011WO2011001485A1 Photocurable heat-curable resin composition
01/06/2011WO2011001484A1 Photocurable thermosetting resin composition
01/06/2011WO2011001389A1 Household appliance, system and method for testing it
01/06/2011WO2011000694A1 Aqueous alkaline cleaning compositions and methods of their use
01/06/2011WO2011000580A1 Method for generating an electronic system, method for generating a freeform surface having such a system, and electronic system and freeform surface having such a system
01/06/2011WO2010088582A3 Connector using liquid dielectric for improved performance
01/06/2011US20110002685 Camera module and assembling method thereof
01/06/2011US20110001717 Narrow Border for Capacitive Touch Panels
01/06/2011US20110001590 Magnetic assembly and fabricating method thereof
01/06/2011US20110001418 High heat dissipation electric circuit board and manufacturing method thereof
01/06/2011US20110000784 Method and electrode for defining and replicating structures in conducting materials
01/06/2011US20110000701 Ceramic elements module and manufacturing method thereof
01/06/2011US20110000700 Method of connecting circuit boards and connected structure
01/06/2011US20110000535 Spanish shingles with photovoltaic cells, method of producing and method of installation
01/06/2011US20110000083 Method of manufacturing printed circuit board having metal bump
01/05/2011EP2271193A1 Portable terminal
01/05/2011EP2271191A1 Embedded sandwich hybrid circuit
01/05/2011EP2270260A1 Electronic component and method for manufacturing the same
01/05/2011EP2270102A1 Resin composition and cured film thereof
01/05/2011EP2269216A1 Die substrate with reinforcement structure
01/05/2011EP2269155A2 Protection device for an electronic system
01/05/2011EP1606981B1 Method and device for aligning a substrate and a printing screen during solder paste printing
01/05/2011EP1335831B1 Methods of manufacturing a fabric article including electronic circuitry and fabric articles
01/05/2011EP0999731B1 Printed wiring board comprising conductor circuits for solder pads
01/05/2011DE102009030744A1 Ballast for a hand soldering device or a station soldering device with a soldering tip, comprises a controllable voltage converter to convert an input line voltage to an AC voltage that is supplyable to a transformer, and a detection unit
01/05/2011DE102009022514A1 Device for simultaneous defined application of a solder paste on solder points, comprises a metering head having passage openings for solder passage, and metering tubes connected to the passage openings and having different larger diameter
01/05/2011CN201700128U Mask structure being capable of avoiding binding chip module in printing
01/05/2011CN201700092U 柔性电路板承载架 The flexible circuit board carrier
01/05/2011CN201700091U Water squeezing device for absorbent wool
01/05/2011CN201700090U Tray for supporting PCB panel
01/05/2011CN201700089U Physical defoaming device for PCB processing procedure
01/05/2011CN201700088U Water leaching device of PCB board material
01/05/2011CN201700087U 电路板 Board
01/05/2011CN201700084U High-frequency line base plate
01/05/2011CN201700077U Four-layered circuit board with high production yield rate
01/05/2011CN201699364U Electric wire protection tube of equipment for wet process of printed circuit board
01/05/2011CN201699008U Circuit packaging and assembling structure
01/05/2011CN201698560U Vibrator abnormal warning device in PCB manufacture
01/05/2011CN201694775U Copper-clad plate windlass
01/05/2011CN201693287U Pulse type hot-press head
01/05/2011CN201693286U Large-dimension hot pressing head
01/05/2011CN1997482B Method for laser drilling a multilayer workpiece
01/05/2011CN101940076A Panelizing method for printed circuit board manufacturing
01/05/2011CN101940075A Wiring board and semiconductor device using the wiring board
01/05/2011CN101940074A Printed wiring board and method for manufacturing same
01/05/2011CN101940073A Method of connection of flexible printed circuit board and electronic device obtained thereby
01/05/2011CN101940072A Plated dielectric frame with integrated connector
01/05/2011CN101939677A Manufacturing method of optical wiring printed board and optical wiring printed circuit board
01/05/2011CN101939164A Method for making a heating element by depositing thin layers onto an insulating substrate, and resulting element
01/05/2011CN101939130A Solder bonding structure and soldering flux
01/05/2011CN101938886A Method for adhering multi-layer dry films to manufacture circuit boards
01/05/2011CN101938885A Method of manufacturing printed circuit board and printed circuit board manufactured by said method
01/05/2011CN101938884A Explosion positioning method of manually made PCB (Printed Circuit Board)
01/05/2011CN101938883A Single-side double contact flexible circuit board and making method thereof
01/05/2011CN101938881A Printed circuit board for integrated filter and manufacture method thereof
01/05/2011CN101937173A Exposure method of exposure machine
01/05/2011CN101935838A Microetching processing method used before copper deposition of printed circuit board
01/05/2011CN101935836A Surface treatment process of reddened copper foil for high-grade FR-4 copper-clad plate
01/05/2011CN101934438A Lead-free low-temperature solder
01/05/2011CN101662897B Manufacturing method for multilayer stacking printed wiring board
01/05/2011CN101616549B Method for manufacturing single-side thick copper stepped plate by electroplating addition method
01/05/2011CN101567015B Collocation method of elements on circuit board
01/05/2011CN101548029B Method for production of metal-coated polyimide resin substrate having excellent thermal aging resistance property
01/05/2011CN101466201B Device for discarding and blowing printed circuit board
01/05/2011CN101448371B Welding method for preventing scaling powder from entering into surface mounting component and circuit board thereof
01/04/2011US7864543 Printed circuit board
01/04/2011US7864542 Printed circuit board
01/04/2011US7864540 Peripheral card with sloped edges
01/04/2011US7863526 High performance chip carrier substrate
01/04/2011US7863200 Process of vapor depositing glass layers for wafer-level hermetic encapsulation of electronic modules
01/04/2011US7862889 Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring board
01/04/2011CA2561955C Embedded capacitors using conductor filled vias
01/04/2011CA2522239C Anisotropic conductive film and manufacturing method thereof
12/2010
12/30/2010US20100331060 Connector unit and electronic equipment
12/30/2010US20100330364 Adhesive, method of connecting wiring terminals and wiring structure
12/30/2010US20100329802 Cutting drill and method for manufacturing printed wiring board
12/30/2010US20100328919 Method of making a fiber reinforced printed circuit board panel and a fiber reinforced panel made according to the method
12/30/2010US20100328915 Printed circuit board and method of manufacturing printed circuit board
12/30/2010US20100328913 Method for the producing an electronic subassembly, as well as electronic subassembly
12/30/2010US20100328840 Mems device and method of manufacturing the same
12/30/2010US20100328526 Modular camera system and a method of manufacturing the same
12/30/2010US20100328189 Process for Electrically Interconnecting Two Components
12/30/2010US20100328187 Method for producing an antenna system
12/30/2010US20100327436 Apparatus and method for stacking integrated circuits
12/30/2010US20100327164 Optical Proximity Sensor Package with Molded Infrared Light Rejection Barrier and Infrared Pass Components
12/30/2010US20100327152 Miniaturized Single Track Optical Encoder System with Integrated Index Channel(s)
12/30/2010US20100326716 Core via for chip package and interconnect
12/30/2010US20100326714 Printed circuit board, printed circuit board fabrication method, and electronic device including printed circuit board
12/30/2010US20100326712 Circuit board and method for manufacturing the same
12/30/2010US20100326709 Printed wiring board and method for manufacturing the same
12/30/2010US20100326702 Integrated circuit assembly
12/30/2010US20100326596 Adhesive, method of connecting wiring terminals and wiring structure
12/30/2010US20100326566 System for filling holes in a printed circuit board with a fluid fill material
12/30/2010US20100325885 Circuit member, manufacturing method for circuit members, semiconductor device, and surface lamination structure for circuit member