| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 03/16/2011 | CN101193500B Pattern forming method and circuit board |
| 03/16/2011 | CN101111340B Workpiece boring/cutting operation aiding plate material and molding making use of the same |
| 03/16/2011 | CN101102648B Through hole forming method and wiring circuit board manufacturing method |
| 03/16/2011 | CN101029409B Pretreatment and pretreatment solution for direct porous metallizing printing IC board |
| 03/16/2011 | CN101026936B Printed circuit board button solder pad holing method and its button solder pad |
| 03/15/2011 | US7907803 Manufacturing method of opto-electric hybrid module and opto-electric hybrid module obtained thereby |
| 03/15/2011 | US7907417 Printed circuit board (PCB)with enhanced structural integrity |
| 03/15/2011 | US7907036 Microstripline filter and method for manufacturing the same |
| 03/15/2011 | US7905574 Method of fabricating resistor and proximate drive transistor for a printhead |
| 03/15/2011 | US7905012 Method for manufacturing electronic components |
| 03/10/2011 | WO2011028004A2 Copper foil for an embedded pattern for forming a microcircuit |
| 03/10/2011 | WO2011027884A1 Substrate for mounting semiconductor chip and method for producing same |
| 03/10/2011 | WO2011027792A1 Circuit board manufacturing method and circuit board |
| 03/10/2011 | WO2011027695A1 Alkali-developable photocurable resin composition, dried film and cured product of the composition, and printed wiring board comprising the dried film or the cured product |
| 03/10/2011 | WO2011027659A1 Soldering paste, bonding method using same, and bonding structure |
| 03/10/2011 | WO2011027558A1 Printed wiring board, build-up multi-layer board, and production method therefor |
| 03/10/2011 | WO2011027526A1 Curable resin composition |
| 03/10/2011 | WO2011026892A1 Printing method for printing electronic devices and relative control apparatus |
| 03/10/2011 | WO2011026885A1 Substrate processing apparatus and method |
| 03/10/2011 | WO2011026884A1 Multiple control method for printing a multilayer pattern and relative plant |
| 03/10/2011 | WO2011026880A1 Method for centering a print track |
| 03/10/2011 | WO2011026878A1 Method and apparatus to detect the alignment of a substrate |
| 03/10/2011 | WO2011026760A1 Method for producing electrically conductive surfaces |
| 03/10/2011 | WO2011026698A1 Travel paths for painting robots |
| 03/10/2011 | WO2011026456A1 Optoelectronic module comprising at least one first semiconductor body having a radiation outlet side and an insulation layer and method for the production thereof |
| 03/10/2011 | WO2010142272A3 Screen printing frame |
| 03/10/2011 | WO2010012540A9 Method for the hot stamping of at least one conductor track onto a substrate, substrate comprising at least one conductor track and stamping tool |
| 03/10/2011 | US20110058293 electrostatic discharge protection circuit, equipment and method |
| 03/10/2011 | US20110057846 Spatial structure with a transponder and method for the manufacture thereof |
| 03/10/2011 | US20110057742 Semiconductor Device and Method of Forming Directional RF Coupler with IPD for Additional RF Signal Processing |
| 03/10/2011 | US20110057678 Ceramic Substrate, Functional Ceramic Substrate, Probe Card and Method for Manufacturing Ceramic Substrate |
| 03/10/2011 | US20110057296 Delamination resistant packaged die having support and shaped die having protruding lip on support |
| 03/10/2011 | US20110057104 Miniaturized Optical Proximity Sensor |
| 03/10/2011 | US20110056739 Substrate structure and method for manufacturing the same |
| 03/10/2011 | US20110056736 Fabrication method of circuit board, circuit board, and chip package structure |
| 03/10/2011 | US20110056734 Electronic device submounts with thermally conductive vias and light emitting devices including the same |
| 03/10/2011 | US20110056075 Planar layer with optical path |
| 03/10/2011 | US20110056074 Apparatus and method for electronic circuit manufacture |
| 03/10/2011 | DE102009039087A1 Verbindungsanordnung für elektrische Baugruppen Connector assembly for electrical components |
| 03/10/2011 | DE102009028865A1 Reflow soldering plant useful for continuous soldering of soldering material, comprises a pre-heating zone, a soldering zone, a cooling zone and a vacuum zone that connects the soldering zone |
| 03/10/2011 | DE102009013826A1 Schaltungsanordnung, Verfahren zum elektrischen und/oder mechanischen Verbinden und Vorrichtung zum Aufbringen von Verbindungselementen Circuit arrangement, method for electrical and / or mechanical connection and apparatus for applying fasteners |
| 03/10/2011 | DE10196919B4 Elektromagnetisch gekoppeltes Bussystem Electromagnetically coupled bus system |
| 03/09/2011 | EP2293657A1 Electronic component and method of forming an electronic component |
| 03/09/2011 | EP2293656A1 Metal base circuit board |
| 03/09/2011 | EP2293356A2 LED package structure for increasing heat-dissipating and light-emitting efficiency and method for manufacturing the same |
| 03/09/2011 | EP2293324A1 Packaging structure and method for manufacturing packaging structure |
| 03/09/2011 | EP2292440A1 Layer template for technical screen printing |
| 03/09/2011 | EP2292360A1 Method for the removal of surface oxides by electron attachment |
| 03/09/2011 | EP2292081A1 Wire harness and production method therefor |
| 03/09/2011 | EP2291444A2 High dielectric constant laser direct structuring materials |
| 03/09/2011 | EP2055154B1 Standardized electronics housing having modular contact partners |
| 03/09/2011 | EP1978792B1 Substrate structure and electronic device |
| 03/09/2011 | EP1406763B1 Screen printing apparatus |
| 03/09/2011 | EP1258893B1 Chip capacitor with cap support |
| 03/09/2011 | EP1214171B1 Excimer laser ablation process control of multilaminate materials |
| 03/09/2011 | CN201758493U Device for assembling radiator of electronic product |
| 03/09/2011 | CN201758492U PCB holding device |
| 03/09/2011 | CN201758491U High heat-conducting circuit board manufactured by oil printing method |
| 03/09/2011 | CN201758490U Circuit board with high-thermal conductivity manufactured with plating method |
| 03/09/2011 | CN201758484U Modified PCB with thickness more than 90% be metal |
| 03/09/2011 | CN101600299B Rapid subtractive manufacturing process of circuit boards |
| 03/09/2011 | CN101511148B Method for preparing resonant cavity integrated on PCB |
| 03/09/2011 | CN101431867B Mounting structure |
| 03/09/2011 | CN101406114B Shifted segment layout for differential signal traces to mitigate bundle weave effect |
| 03/09/2011 | CN101299413B Process for manufacturing circuit board |
| 03/09/2011 | CN101277604B Substrate operating system |
| 03/09/2011 | CN101125429B Method of positioning and fixing punching metal die |
| 03/08/2011 | US7904148 Biocompatible bonding method and electronics package suitable for implantation |
| 03/08/2011 | US7902678 Semiconductor device and manufacturing method thereof |
| 03/08/2011 | US7902659 Conductive connecting pin and package substrate |
| 03/08/2011 | US7902656 Hybrid integrated circuit device, and method for fabricating the same, and electronic device |
| 03/08/2011 | US7902651 Apparatus and method for stacking integrated circuits |
| 03/08/2011 | US7902482 Laser machining apparatus and control method for the apparatus |
| 03/08/2011 | US7902262 Method of recycling mixed streams of ewaste (WEEE) |
| 03/08/2011 | US7901768 Multilayer anisotropic conductive adhesive and connection structure using the same |
| 03/08/2011 | US7900350 Method of manufacturing a wiring board |
| 03/08/2011 | US7900349 Method of fabricating an electronic device |
| 03/08/2011 | US7900348 Method of manufacturing an electronic component substrate |
| 03/08/2011 | US7900347 Method of making a compliant interconnect assembly |
| 03/08/2011 | CA2591343C Magnet-force clamping apparatus |
| 03/03/2011 | WO2011025229A2 Conductive metal ink composition and method for forming a conductive pattern |
| 03/03/2011 | WO2011025228A2 Conductive metal ink composition and method for forming a conductive pattern |
| 03/03/2011 | WO2011025144A2 Entry sheet for printed circuit board hole boring, water-soluble lubricating resin composition used with same and production method for same |
| 03/03/2011 | WO2011025037A1 Method for production of chip component having conductive post, and method of production of substrate having built-in chip component |
| 03/03/2011 | WO2011024939A1 Semiconductor device and manufacturing method therefor |
| 03/03/2011 | WO2011024921A1 Printed circuit board and manufacturing method thereof |
| 03/03/2011 | WO2011024813A1 Heating and melting treatment device and heating and melting treatment method |
| 03/03/2011 | WO2011024795A1 Electronic device and membrane filtration device comprising same |
| 03/03/2011 | WO2011024790A1 Multiple resin-layered substrate and method of manufacture of multiple resin-layered substrate |
| 03/03/2011 | WO2011024720A1 Method for manufacturing connection structure |
| 03/03/2011 | WO2011024469A1 Substrate producing method and resin substrate |
| 03/03/2011 | WO2011024009A1 Wind turbine composite structures |
| 03/03/2011 | WO2011023486A1 An electronic product having a double-pcb sandwich structure and a method of assembling the same |
| 03/03/2011 | WO2011023398A1 Method for producing at least one strip conductor on a substrate |
| 03/03/2011 | WO2011023159A1 Method and device for producing a transponder unit |
| 03/03/2011 | WO2010134734A3 Conductive contact terminal to be mounted on a substrate surface |
| 03/03/2011 | WO2010048653A3 Method for integrating an electronic component into a printed circuit board |
| 03/03/2011 | US20110052828 Method for high-temperature ceramic circuits |
| 03/03/2011 | US20110051386 Circuit Board, Mounting Structure, and Method for Manufacturing Circuit Board |
| 03/03/2011 | US20110051382 Electro-optical apparatus, flexible printed circuit board, manufacturing method for electro-optical apparatus, and electronic equipment |