| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 02/23/2011 | CN101980861A Assemblies and methods for reducing warp and bow of a flexible substrate during semiconductor processing |
| 02/23/2011 | CN101980590A Multi-piece substrate and method of manufacturing the substrate |
| 02/23/2011 | CN101980082A Photosensitive resin composition, photosensitive element, resist pattern forming method and process for manufacturing printed circuit board |
| 02/23/2011 | CN101980081A Solder resist composition and printed circuit board |
| 02/23/2011 | CN101979709A Novel chemical copper plating method |
| 02/23/2011 | CN101979451A Adhesive film, flexible metal-clad laminate, and processes for producing these |
| 02/23/2011 | CN101979248A Planar position adjustable platform and full-automatic vision printer |
| 02/23/2011 | CN101979205A Circuit board wave-soldering fixture designed by using over-tight coupling board |
| 02/23/2011 | CN101605428B Circuit board with optical waveguide layer and manufacture method thereof |
| 02/23/2011 | CN101394714B Method for producing multilayered wiring substrate, multilayered wiring substrate, and electronic apparatus |
| 02/23/2011 | CN101189925B 嵌入式电容结构 Embedded capacitor structure |
| 02/23/2011 | CN101175366B Multilayer soft printed wiring board and production method thereof |
| 02/22/2011 | US7894919 Fully automated paste dispense system for dispensing small dots and lines |
| 02/22/2011 | US7894203 Multilayer printed wiring board |
| 02/22/2011 | US7894202 Multilayer capacitor |
| 02/22/2011 | US7894192 Integrated circuit package support system |
| 02/22/2011 | US7893792 Duplexer using an embedded PCB and method of fabricating the same |
| 02/22/2011 | US7893360 Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board |
| 02/22/2011 | US7892635 Closed cell polymeric foam material and heat decomposible porogen; providing larger processing window; integrated circuit devices and packaging; heat resistance, noncracking; photolithographic stable |
| 02/22/2011 | US7892404 Method for oxidizing substance and oxidation apparatus therefor |
| 02/22/2011 | US7891295 Printing in a medium |
| 02/22/2011 | US7891280 Method for cutting PCB |
| 02/22/2011 | US7891090 Method for manufacturing an interposer |
| 02/22/2011 | US7891089 Printed board with component mounting pin |
| 02/17/2011 | WO2011019523A2 Roll mechanics for enabling printed electronics |
| 02/17/2011 | WO2011019409A1 Wafer level camera module with molded housing and method of manufacture |
| 02/17/2011 | WO2011019132A1 Conductive adhesive, semiconductor mounting method using same, and wafer level package |
| 02/17/2011 | WO2011019080A1 Circuit board and method for producing same |
| 02/17/2011 | WO2011019055A1 Heat-resistant copper foil and method for producing same, circuit board, and copper-clad laminate board and method for manufacturing same |
| 02/17/2011 | WO2011018983A1 Laminated substrate production method |
| 02/17/2011 | WO2011018979A1 Multilayered substrate |
| 02/17/2011 | WO2011018968A1 Printed wiring board and method for producing the same |
| 02/17/2011 | WO2011018938A1 Multilayer printed circuit board |
| 02/17/2011 | WO2011018907A1 Photosensitive composition and solder resist composition |
| 02/17/2011 | WO2011018862A1 Multilayer flexible printed circuit board, and method for fabricating the same |
| 02/17/2011 | WO2011018861A1 Solder precoat film forming method and device therefor |
| 02/17/2011 | WO2010128833A3 Method for manufacturing an fpcb using a bonding sheet |
| 02/17/2011 | US20110039429 Connector with reinforced mounting structure and method of manufacturing connector |
| 02/17/2011 | US20110039428 Press-in contact having a base, a contact pin and a second pin |
| 02/17/2011 | US20110039212 Circuitized substrate with internal resistor, method of making said circuitized substrate, and electrical assembly utilizing said circuitized substrate |
| 02/17/2011 | US20110039019 Solution and Process for Improving the Solderability of a Metal Surface |
| 02/17/2011 | US20110038133 Electrical component mounting assemblies |
| 02/17/2011 | US20110037716 Touch screen display apparatus |
| 02/17/2011 | US20110037528 Wave Guiding Structures for Crosstalk Reduction |
| 02/17/2011 | US20110037171 Electronic Structures Including Barrier Layers and/or Oxidation Barriers Defining Lips and Related Methods |
| 02/17/2011 | US20110036913 Electrochemical sensor |
| 02/17/2011 | US20110036626 Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board |
| 02/17/2011 | US20110036619 Flex-rigid wiring board and method for manufacturing the same |
| 02/17/2011 | US20110036618 Printed Circuit Board and Method for Manufacturing the Same, and Panel for Manufacturing the Printed Circuit Board |
| 02/17/2011 | US20110035939 Multilayer wiring board and manufacture method thereof |
| 02/17/2011 | US20110035938 Method of manufacturing a capacitor-embedded printed circuit board |
| 02/17/2011 | DE102009028499A1 Mixedly assembled printed circuit boards assembling and soldering method, involves inserting connection pins of through-hole-technique-components into solderable clamping devices and soldering connection pins |
| 02/17/2011 | DE102005010377B4 Waferbearbeitungs-Verfahren Wafer processing method |
| 02/16/2011 | EP2285197A1 Method for connecting an electronic component with a circuit board |
| 02/16/2011 | EP2285195A1 Socket, circuit board assembly, and apparatus having the same |
| 02/16/2011 | EP2285194A1 New process to form highly conductive feature from silver nanoparticles with reduced processing temperature |
| 02/16/2011 | EP2284882A1 Multilayer wiring board |
| 02/16/2011 | EP2284880A1 Package structure and package process |
| 02/16/2011 | EP2284611A1 Photosensitive resin composition, photosensitive element, resist pattern manufacturing method, and printed circuit board manufacturing method |
| 02/16/2011 | EP2284250A1 Formulations and Method for Post-CMP Cleaning |
| 02/16/2011 | EP2283698A1 Planar heating element for underfloor heating |
| 02/16/2011 | EP2283454A1 Printing process for integrating an rfid transponder into packages |
| 02/16/2011 | EP2283274A2 Illumination apparatus |
| 02/16/2011 | EP2144283B1 Method of transferring adhesive film |
| 02/16/2011 | EP1317769B1 Connection for conducting high frequency signal between a circuit and a discrete electrical component |
| 02/16/2011 | CN201750663U Soldering leg for heat sinks and soldering structure thereof |
| 02/16/2011 | CN201750634U Improved pressing in carrier structure provided with rigid-flexible circuit board |
| 02/16/2011 | CN201750633U Anti-floating high pressure plate |
| 02/16/2011 | CN201750632U Each-layer rivet hole positioning structure of multilayer circuit board |
| 02/16/2011 | CN201750631U Air exhaust device of PCB (printed circuit board) vertical hot-blast oven |
| 02/16/2011 | CN201750630U Structure enlarging windowing area of negative film in thick copperplate exposure |
| 02/16/2011 | CN201750629U Sheet producing device for leveling vertical hot wind on precise printed circuit board |
| 02/16/2011 | CN201750628U Solution tank for processing printed circuit board (PCB) |
| 02/16/2011 | CN201750627U Laminated stacked plate system and transfer machine thereof |
| 02/16/2011 | CN201746603U Improved structure for preventing plate falling on full-automatic upper plate and lower plate vertical plating production line |
| 02/16/2011 | CN201746602U PCB sheet clamp |
| 02/16/2011 | CN201744970U Film rod handle for detaching protecting film |
| 02/16/2011 | CN201744766U Lead free solder pot decoppering device |
| 02/16/2011 | CN201744693U Special drill point for flexible circuit board |
| 02/16/2011 | CN1929717B Lead-type electronic-part-mounted printed circuit board, method of soldering lead-type electronic part and air-conditioner |
| 02/16/2011 | CN101978800A Component-incorporating wiring board |
| 02/16/2011 | CN101978799A Printed wiring board and associated manufacturing methodology |
| 02/16/2011 | CN101978798A Re-releasable process film |
| 02/16/2011 | CN101978797A Pcb mounting method |
| 02/16/2011 | CN101978796A Imaging system and method for alignment |
| 02/16/2011 | CN101978001A Ink-jet ink composition for etching resist |
| 02/16/2011 | CN101977984A Epoxy resin composition, resin sheet, prepreg, multilayer printed wiring board and semiconductor device |
| 02/16/2011 | CN101977723A Beam processing apparatus, beam processing method, and beam processed substrate |
| 02/16/2011 | CN101977490A Plate receiving, conveying and sucking machine |
| 02/16/2011 | CN101977486A Method for manufacturing via stubs of circuit board |
| 02/16/2011 | CN101977485A Patching method for circuit board |
| 02/16/2011 | CN101977484A PCB (Printed Circuit Board) production line combining manual in process processing and paster processing |
| 02/16/2011 | CN101977483A Welding resistance method for industrial control panel |
| 02/16/2011 | CN101977482A Method for etching outer circuit of PCB product with high aspect ratio |
| 02/16/2011 | CN101977481A Method for removing semi-metalized hole flash by back drilling |
| 02/16/2011 | CN101977480A Manufacturing process of fine circuits of printed circuit board |
| 02/16/2011 | CN101977479A Electronic assembly and manufacturing method thereof |
| 02/16/2011 | CN101976659A Outer package-free crystal device and manufacturing method thereof |
| 02/16/2011 | CN101976590A Conductive paste and method for manufacturing multilayer printed wiring board using same |
| 02/16/2011 | CN101973158A Laminating and demolding method and device for semi-automatic solder paste printer |