| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 02/03/2011 | WO2011012993A2 Modular prototyping of a circuit for manufacturing |
| 02/03/2011 | WO2011012215A1 Arrangement for connecting electrical conductors to terminal connections of interconnected cells |
| 02/03/2011 | WO2011011880A1 A method of manufacturing substrates having asymmetric buildup layers |
| 02/03/2011 | WO2010136596A3 Method of manufacturing an electrical circuit on a substrate |
| 02/03/2011 | US20110029124 Program controlled dicing of a substrate using a pulsed laser beam |
| 02/03/2011 | US20110027945 Substrate for mounting device and method for producing the same, semiconductor module and method for producing the same, and portable apparatus provided with the same |
| 02/03/2011 | US20110027535 Anisotropic particle-arranged structure and method of manufacturing the same |
| 02/03/2011 | US20110025552 High-Frequency Module and Method of Manufacturing the Same, and Transmitter, Receiver, Transceiver, and Radar Apparatus Comprising the High-Frequency Module |
| 02/03/2011 | US20110025550 High-Frequency Module and Method of Manufacturing the Same, and Transmitter, Receiver, Transceiver, and Radar Apparatus Comprising the High-Frequency Module |
| 02/03/2011 | US20110024627 Proximity Sensor with Ceramic Housing and Light Barrier |
| 02/03/2011 | US20110024275 Low cost key actuators and other switching device actuators manufactured from conductive loaded resin-based materials |
| 02/03/2011 | US20110024180 Printed circuit board and method of fabricating the same |
| 02/03/2011 | US20110024177 Method for soldering electronic components of circuit board and circuit board structure thereof |
| 02/03/2011 | US20110024176 Printed circuit board and method of fabricating the same |
| 02/03/2011 | US20110024174 Capacitor mounting method and printed circuit board |
| 02/03/2011 | US20110024173 Ball grid array printed circuit board, package structure, and fabricating method thereof |
| 02/03/2011 | US20110024167 Multilayer Circuit Board |
| 02/03/2011 | US20110024165 Systems and methods for composite structures with embedded interconnects |
| 02/03/2011 | US20110024164 Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board |
| 02/03/2011 | US20110024163 Print Circuit Board With High Insulated Region, Method Of Manufacturing Thereof, And Print Circuit Board Assembly Thereof |
| 02/03/2011 | US20110024160 Multi-layer microwave corrugated printed circuit board and method |
| 02/03/2011 | US20110023606 Micromechanical acceleration sensor |
| 02/03/2011 | US20110023298 Method for manufacturing electroconductive material-filled throughhole substrate |
| 02/03/2011 | US20110023297 Multi-layered printed circuit board and method for fabricating the same |
| 02/03/2011 | DE10244365B4 Verteilte Halbleiterschaltung Distributed semiconductor circuit |
| 02/03/2011 | CA2769284A1 Arrangement for connecting electrical conductors to terminal connections of interconnected cells |
| 02/02/2011 | EP2280594A1 Printed wiring board and method for manufacturing the same |
| 02/02/2011 | EP2280593A1 Fluxometer system and method |
| 02/02/2011 | EP2280592A1 Construction of a contact area on a circuit board |
| 02/02/2011 | EP2280591A1 Mobile terminal having flexible printed circuit board |
| 02/02/2011 | EP2280446A1 Antenna coupling structure for a mobile terminal |
| 02/02/2011 | EP2280425A2 Method for producing electric contacts on a semiconductor element |
| 02/02/2011 | EP2279821A2 Fluid supply apparatus, fluid applying apparatus, and fluid supply method |
| 02/02/2011 | EP2279290A2 Electroplating composition and process for coating a semiconductor substrate using said composition |
| 02/02/2011 | CN201733524U Tool board for processing PCB (printed circuit board) |
| 02/02/2011 | CN201733523U Liquid medicine adding system for defect indicating device |
| 02/02/2011 | CN201733522U Circuit board location and support jig tool and circuit board processing device |
| 02/02/2011 | CN201733521U Bump mold with substitute block |
| 02/02/2011 | CN201733520U Convex point die for processing flexible circuit board |
| 02/02/2011 | CN201733519U Novel convex point mould with substitution blocks |
| 02/02/2011 | CN1962962B Plating tank |
| 02/02/2011 | CN101965760A Method of treating surface of copper and method of treating surface of printed wiring board |
| 02/02/2011 | CN101965759A Circuit board and method for manufacturing the same |
| 02/02/2011 | CN101965107A Welding fixture of optical component |
| 02/02/2011 | CN101965106A Manufacturing method for printed wiring board |
| 02/02/2011 | CN101965105A Printed circuit board lamination manufacturing process |
| 02/02/2011 | CN101965104A Circuit packaging device |
| 02/02/2011 | CN101965103A Printed circuit board encapsulating method |
| 02/02/2011 | CN101965102A 电路板模块 Circuit board module |
| 02/02/2011 | CN101965101A Module circuit board assembly, module circuit board and electronic production |
| 02/02/2011 | CN101965097A Printed circuit board and its manufacture method |
| 02/02/2011 | CN101964458A Flat cable structure and manufacturing method thereof |
| 02/02/2011 | CN101964249A Power induction structure |
| 02/02/2011 | CN101962776A Solder stripping agent and preparation method thereof |
| 02/02/2011 | CN101961937A Mold release film and process for producing flexible printed wiring board therewith |
| 02/02/2011 | CN101517724B Adhesive sheet sticking device and sticking method |
| 02/02/2011 | CN101489357B Component assembling method for flexible circuit board |
| 02/02/2011 | CN101466978B 照明器 Illuminator |
| 02/02/2011 | CN101402423B Method of connecting adhesive material tape and adhesive material tape connector |
| 02/02/2011 | CN101399171B Method of forming alignment mark |
| 02/02/2011 | CN101331812B Method of manufacturing printed wiring board |
| 02/02/2011 | CN101282636B Substrate operating system |
| 02/02/2011 | CN101252807B Circuit board and electronic equipment having the same, method of manufacturing same |
| 02/02/2011 | CN101233608B Process for producing junction structure |
| 02/02/2011 | CN101218538B Photosensitive resin composition, and photosensitive element, method for forming resist pattern, method for manufacturing printed wiring board and method for manufacturing partition wall for plasma di |
| 02/01/2011 | US7881072 System and method for processor power delivery and thermal management |
| 02/01/2011 | US7881071 Multilayer printed wiring board |
| 02/01/2011 | US7881069 Printed circuit board |
| 02/01/2011 | US7880305 Technology for fabrication of packaging interface substrate wafers with fully metallized vias through the substrate wafer |
| 02/01/2011 | US7880265 Packaged integrated circuit |
| 02/01/2011 | US7879956 interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; the circuit-connecting material comprising as essential components, a curing agent and a hydroxy resin with radical polymer |
| 02/01/2011 | US7879535 Pattern forming method, graft pattern material, conductive pattern forming method and conductive pattern material |
| 02/01/2011 | US7879445 Adhesive for bonding circuit members, circuit board and process for its production |
| 02/01/2011 | US7879171 Common carrier |
| 02/01/2011 | US7877871 Method of manufacturing an electronic circuit formed on a substrate |
| 02/01/2011 | US7877870 Method of bonding terminal |
| 02/01/2011 | US7877869 Lead body-to-connector transition zone |
| 02/01/2011 | US7877868 Method of fabricating circuit configuration member |
| 02/01/2011 | US7877867 Component fixing method |
| 02/01/2011 | US7877866 Flexible circuit electrode array and method of manufacturing the same |
| 02/01/2011 | CA2600894C A radio frequency circuit board topology |
| 02/01/2011 | CA2539280C High reliability multilayer circuit substrates and methods for their formation |
| 01/27/2011 | WO2011010889A2 Flexible printed circuit board and method for manufacturing the same |
| 01/27/2011 | WO2011010729A1 Substrate-bonding device and method |
| 01/27/2011 | WO2011010692A1 Method for connecting electrodes and connection composition used therefor |
| 01/27/2011 | WO2011010540A1 Resin composite electrolytic copper foil, copper-clad laminate, and printed wiring board |
| 01/27/2011 | WO2011010498A1 Wiring board and method for manufacturing same |
| 01/27/2011 | WO2011010461A1 Photocurable resin composition |
| 01/27/2011 | WO2011010457A1 Photocurable resin composition |
| 01/27/2011 | WO2011010393A1 Resonant elements designed vertically in a multilayer board and filters based on these elements |
| 01/27/2011 | WO2011009764A1 Etchant composition and etching process for titanium-aluminum complex metal layer |
| 01/27/2011 | WO2010115157A3 Spacer-connector and circuit board assembly |
| 01/27/2011 | US20110022207 Methods of and Apparatus for Electrochemically Fabricating Structures Via Interlaced Layers or Via Selective Etching and Filling of Voids |
| 01/27/2011 | US20110020970 etching or plating process and resist ink |
| 01/27/2011 | US20110019959 Printed circuit board for optical waveguides and method of manufacturing the same |
| 01/27/2011 | US20110019384 Printed circuit board assembly |
| 01/27/2011 | US20110019379 Printed wiring board, semiconductor device, and method for manufacturing printed wiring board |
| 01/27/2011 | US20110019377 Modular Integrated Circuit Chip Carrier |
| 01/27/2011 | US20110019370 Flexible circuit module |
| 01/27/2011 | US20110018136 Apparatus and method for forming electonic devices |