| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 01/20/2011 | US20110011829 Device Mounting Board |
| 01/20/2011 | US20110011636 Multilayer wiring board and method of manufacturing the same |
| 01/20/2011 | US20110011635 Method for Arranging a Component on a Circuit Board |
| 01/20/2011 | US20110011634 Circuit package with integrated direct-current (dc) blocking capacitor |
| 01/20/2011 | US20110011626 Printed circuit board and method of manufacturing the same |
| 01/20/2011 | US20110011179 Moister sensor |
| 01/20/2011 | US20110010932 Wiring board, semiconductor device having wiring board, and method of manufacturing wiring board |
| 01/20/2011 | DE202010015776U1 Vorrichtung zum Einlöten und Entlöten von Bauelementen Apparatus for soldering and desoldering of components |
| 01/20/2011 | DE10221876B4 Verfahren zum Herstellen eines Keramik-Kupfer-Verbundsubstrats A method for manufacturing a ceramic-copper composite substrate |
| 01/20/2011 | DE102010013895A1 Einrichtung zum Erwärmen von SMD-Bauteilen zum Reballen Means for heating of SMD components for reballing |
| 01/20/2011 | DE102009033650A1 Verfahren und Verbindung eines elektronischen Bauteils mit einer Leiterplatte And connection method of an electronic component to a circuit board |
| 01/20/2011 | DE102009027707A1 Verfahren zum Verbinden eines Lackdrahts mit einer Leiterplatte A method for connecting a wire to a circuit board paint |
| 01/20/2011 | DE102009027530A1 Leiterplatte Circuit board |
| 01/19/2011 | EP2276331A1 Cable set and method for manufacturing a cable set |
| 01/19/2011 | EP2275224A1 Lead-free solder alloy suppressed in occurrence of shrinkage cavity |
| 01/19/2011 | EP2274962A1 Wiring board and method for manufacturing the same |
| 01/19/2011 | EP2274798A1 A connector and electrical tracks assembly |
| 01/19/2011 | EP2274460A1 Adhesion promotion of metal to laminate with a multi-functional compound haftforderung von metall zu laminaten mit einer multifunktionellen |
| 01/19/2011 | EP2274162A1 Assemblies and methods for reducing warp and bow of a flexible substrate during semiconductor processing |
| 01/19/2011 | EP1852004B1 Recycling printed circuit boards |
| 01/19/2011 | EP1797749B1 Component provided with an assembly of hard conductive microtips and method for electrical connection of said component and a component provided with ductile conductive protrusions |
| 01/19/2011 | CN201718122U Lamination table used for laminating circuit boards |
| 01/19/2011 | CN201718121U PCB wave-soldering bracket |
| 01/19/2011 | CN201718120U Cushion gasket structure with secondary pressing effect |
| 01/19/2011 | CN201718119U Rolling wheel sheet, rolling wheel branch and static eliminator on PCB equipment |
| 01/19/2011 | CN201718118U Automatic loading and unloading system for insertion baskets on vertical PTH line in printed circuit board industry |
| 01/19/2011 | CN201718117U Dripping device |
| 01/19/2011 | CN201718116U Ink scraper device for circuit board |
| 01/19/2011 | CN201718114U Z-direction connecting structure of printed circuit board |
| 01/19/2011 | CN201717256U Passive device and circuit board embedded with same |
| 01/19/2011 | CN201717255U Passive device and circuit board embedded with same |
| 01/19/2011 | CN201717148U Micro-switch plugging operating head |
| 01/19/2011 | CN201717109U Ultrathin transformer |
| 01/19/2011 | CN201717085U Smd transformer |
| 01/19/2011 | CN201717084U Smd transformer |
| 01/19/2011 | CN201713594U Plating bath anode copper ball adding box |
| 01/19/2011 | CN201713562U Hot air leveling machine |
| 01/19/2011 | CN201711739U Insertion working head for drive rivet |
| 01/19/2011 | CN201711632U Wave peak solder backflow device |
| 01/19/2011 | CN201711256U Ultrasonic flux coating device |
| 01/19/2011 | CN1949420B Laminate electronic components and manufacturing method thereof |
| 01/19/2011 | CN1812689B Multilayer circuit board and manufacturing method thereof |
| 01/19/2011 | CN101953238A Device for sticking films, device for transferring/fixing small piece member and head device thereof |
| 01/19/2011 | CN101953026A Opic electroconductive film |
| 01/19/2011 | CN101952925A Patterning a thick film paste in surface features |
| 01/19/2011 | CN101952777A Method for producing cured resist using negative photosensitive resin laminate, negative photosensitive resin laminate, and use of negative photosensitive resin laminate |
| 01/19/2011 | CN101952484A Etching method |
| 01/19/2011 | CN101952196A Method of making a multilayer substrate with embedded metallization |
| 01/19/2011 | CN101952082A Flux creeping-up preventive composition for solder, electronic member for solder coated with the composition, method for soldering the member, and electrical appliance |
| 01/19/2011 | CN101952081A Method of regulating nickel concentration in lead-free solder containing nickel |
| 01/19/2011 | CN101951737A Manufacture method of multilayered circuit board |
| 01/19/2011 | CN101951736A Process for producing circuit board metallized semi-holes |
| 01/19/2011 | CN101951735A Coppering and porefilling process for circuit board |
| 01/19/2011 | CN101951734A Method for processing micro through hole of flexible circuit board |
| 01/19/2011 | CN101951733A Insulating layer, printed circuit board with electronic component and producing method thereof |
| 01/19/2011 | CN101951732A Improved printed circuit board (PCB) plating line |
| 01/19/2011 | CN101951731A Improved heating platform for glue curing |
| 01/19/2011 | CN101951730A Supporting board for single flexible circuit board |
| 01/19/2011 | CN101951729A Positioning tool of flexible circuit board |
| 01/19/2011 | CN101951728A Production method for replacing flexible circuit board with rigid circuit board |
| 01/19/2011 | CN101951727A Method for producing electroplated board edge of circuit board |
| 01/19/2011 | CN101951726A Resistor built-in printing circuit board and manufacturing process thereof |
| 01/19/2011 | CN101951725A Printed circuit board unit and electronic device |
| 01/19/2011 | CN101951724A Metallized polyimides film and flexible circuit board using the same |
| 01/19/2011 | CN101949051A Through hole plating sub-basket |
| 01/19/2011 | CN101949014A Etchant composition for and etching method of materials containing copper |
| 01/19/2011 | CN101947659A Method for transverse shaft-crossing drilling of drilling machine |
| 01/19/2011 | CN101640983B Processing method of printing circuit board blind hole |
| 01/19/2011 | CN101594750B Structure and manufacturing method of high-density substrate |
| 01/19/2011 | CN101505575B Flexible circuit based on PDMS biological compatibility |
| 01/19/2011 | CN101483971B Circuit board and manufacturing method thereof |
| 01/19/2011 | CN101479108B Printing device |
| 01/19/2011 | CN101448363B Double-sided wiring board, manufacturing method of the same, double-sided wiring board for mounting |
| 01/19/2011 | CN101441307B Apparatus for bonding camera module, equipment and method for assembling camera module |
| 01/19/2011 | CN101394713B Photoelectric circuit board and manufacturing method thereof |
| 01/19/2011 | CN101389191B Multi-layer circuit board |
| 01/19/2011 | CN101331247B Plating apparatus and plating method |
| 01/19/2011 | CN101300154B Electronic module and method for sealing an electronic module |
| 01/19/2011 | CN101262744B False sticker |
| 01/19/2011 | CN101104780B Masking tape for board |
| 01/19/2011 | CN101076883B Structure and method of making interconnect element, and multilayer wiring board including the interconnect element |
| 01/19/2011 | CN101056072B Staggered vertical comb drive fabrication method |
| 01/19/2011 | CN101005918B Flux for soldering |
| 01/18/2011 | US7873245 Optoelectric composite substrate and method of manufacturing the same |
| 01/18/2011 | US7872130 3'-N,N-dimethylamino-3,8'-dimethyl-8-(N-methylamino)-7'-oxo-10,5'-diphenyl-5',7'-dihydro-[2,2']biphenazinyl-10-ium chloride; copper plating bath for bright, ductile copper coating, contains as an additive a mixture of oligomeric phenazinium compound (containing two and three monomeric units) |
| 01/18/2011 | US7871859 Vertical surface mount assembly and methods |
| 01/18/2011 | US7871756 used for producing a permanent film, capable of forming a resin layer which is good in fluidity upon heat bonding after pattern, formation and also has good adhesion as well as bonding properties and/or sealing properties |
| 01/18/2011 | US7871698 Adhesive film, flexible metal-clad laminate, and processes for producing these |
| 01/18/2011 | US7870665 Method of manufacturing a conductor circuit, and a coil sheet and laminated coil |
| 01/18/2011 | US7870664 Method of making circuitized substrate with a resistor |
| 01/18/2011 | US7870663 Method for manufacturing multilayer wiring board |
| 01/13/2011 | WO2011005165A1 Catheter and method for manufacturing such a catheter |
| 01/13/2011 | WO2011004802A1 Method for producing formed circuit component |
| 01/13/2011 | WO2011004789A1 Wet etching system for copper-containing material, and patterning method |
| 01/13/2011 | WO2011004756A1 Thermosetting composition for protective film for wiring board |
| 01/13/2011 | WO2011004681A1 Electronic circuit device |
| 01/13/2011 | WO2011004559A1 Through-wiring board and method of manufacturing same |
| 01/13/2011 | WO2011004558A1 Screen printing device and screen printing method |
| 01/13/2011 | WO2011004556A1 Through-wiring board and method of manufacturing same |
| 01/13/2011 | WO2011004542A1 Electronic component unit and reinforcement adhesive |