| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 03/03/2011 | US20110050506 Antenna arrangement |
| 03/03/2011 | US20110049439 Electrically conductive paste, and electrical and electronic device comprising the same |
| 03/03/2011 | US20110049249 Wireless ic device and method of manufacturing the same |
| 03/03/2011 | US20110048790 Chip carriers with side terminals |
| 03/03/2011 | US20110048786 Printed circuit board having a bump and a method of manufacturing the same |
| 03/03/2011 | US20110048785 Wired circuit board and producing method thereof |
| 03/03/2011 | US20110048783 Embedded wiring board and a manufacturing method thereof |
| 03/03/2011 | US20110048780 Method of processing cavity of core substrate |
| 03/03/2011 | US20110048778 Circuit board, semiconductor package and method of manufacturing the same |
| 03/03/2011 | US20110048775 Printed wiring board and method for manufacturing the same |
| 03/03/2011 | US20110048773 Printed wiring board and method for manufacturing the same |
| 03/03/2011 | US20110048772 Conducting polymer ink |
| 03/03/2011 | US20110048575 Viscous material noncontact jetting system |
| 03/03/2011 | US20110047794 Method of mounting capacitor array |
| 03/03/2011 | DE102010033789A1 Multichipmodul und Verfahren zum Herstellen desselben Of the same multi-chip module and method of producing |
| 03/03/2011 | DE102009038674A1 Trägervorrichtung, Anordnung mit einer solchen Trägervorrichtung sowie Verfahren zur Strukturierung eines mindestens eine keramische Schicht umfassenden Schichtstapels Support apparatus, arrangement with such a support device and method for structuring a comprehensive least a ceramic layer layer stack |
| 03/03/2011 | DE102009030744B4 Vorschaltgerät für eine Löteinrichtung Ballast for a soldering device |
| 03/03/2011 | CA2763174A1 Wind turbine composite structures |
| 03/02/2011 | EP2291062A1 Method for producing connection boreholes with optimised clamping collars |
| 03/02/2011 | EP2290134A1 Method and production of at least one PCB track on a substrate |
| 03/02/2011 | EP2290132A1 Copper foil for printed circuit board and copper clad laminate plate for printed circuit board |
| 03/02/2011 | EP2289291A1 Electronic textile |
| 03/02/2011 | EP1660306B1 Method for the production of a three-dimensional multi-material component by means of ink-jet-type printing |
| 03/02/2011 | EP1464431B1 Soldering method with refiling with solder having an oxidation suppressing element |
| 03/02/2011 | EP1261485B1 Improvements relating to screen printing apparatus |
| 03/02/2011 | CN201754650U Circuit board carrying rack |
| 03/02/2011 | CN201754649U Auxiliary fixture for flexible circuit board production |
| 03/02/2011 | CN201754648U Two-dimension positioning adjustment device |
| 03/02/2011 | CN201753370U Cathode hanging fixture used for electroplating of circuit board |
| 03/02/2011 | CN201753367U Arranging structure for spray pipes of electroplating injection device of circuit board |
| 03/02/2011 | CN101983544A Flex-rigid wiring board and method for manufacturing the same |
| 03/02/2011 | CN101983425A Multilayer circuit board, insulating sheet, and semiconductor package using multilayer circuit board |
| 03/02/2011 | CN101983131A Stencils with removable backings for forming micron-sized features on surfaces and methods of making and using the same |
| 03/02/2011 | CN101983126A Two-layered laminate having metal foil cladded on its one surface, method for production of the laminate, single-sided printed wiring board, and method for production of the wiring board |
| 03/02/2011 | CN101982999A 柔性线路板加热台 Flexible circuit boards heating units |
| 03/02/2011 | CN101982515A Film-like circuit connecting material and connection structure for circuit member |
| 03/02/2011 | CN101982288A Organic copper solderability preservative having selective film forming function and use method thereof |
| 03/02/2011 | CN101600296B Polyimide copper clad lamination containing thioether structure and preparation method thereof |
| 03/02/2011 | CN101588677B Manufacture method of flexible printed circuit board |
| 03/02/2011 | CN101547567B Method for producing conductive circuit |
| 03/02/2011 | CN101448366B Anti-welding processing method of printed circuit board |
| 03/02/2011 | CN101437367B Method for preparing printed circuit board |
| 03/02/2011 | CN101294294B Processing method for printed circuit board before plating |
| 03/02/2011 | CN101064264B Conductive ball arraying apparatus |
| 03/01/2011 | US7897894 Laser machining apparatus for sheet-like workpiece |
| 03/01/2011 | US7897893 Method for drilling holes in a substrate, in particular an electrical circuit substrate, by means of a laser beam |
| 03/01/2011 | US7897878 Compliant penetrating packaging interconnect |
| 03/01/2011 | US7897234 Potting material for electronic components |
| 03/01/2011 | US7897199 Method for plating flexible printed circuit board |
| 03/01/2011 | US7896483 Palladium complexes for printing circuits |
| 03/01/2011 | US7895741 Method of producing a wired circuit board |
| 03/01/2011 | US7895740 Methods of making analyte sensors |
| 02/24/2011 | WO2011022492A1 Adding symmetrical filling material in an integrated circuit layout |
| 02/24/2011 | WO2011021749A1 Formation method of wire patterns |
| 02/24/2011 | WO2011021622A1 Method for forming pattern thin film |
| 02/24/2011 | WO2011021567A1 Electrical conduction pattern inspection apparatus and inspection method |
| 02/24/2011 | WO2011021484A1 Glass ceramic composition, ceramic green sheet, and multilayered ceramic substrate |
| 02/24/2011 | WO2011021370A1 Photocurable resin composition |
| 02/24/2011 | WO2011020685A1 Dielectric protective layer for a self-organizing monolayer (sam) |
| 02/24/2011 | WO2011020563A1 A method of producing an electrically conducting via in a substrate |
| 02/24/2011 | WO2010147313A3 Method for producing for a laminated ceramic base plate |
| 02/24/2011 | WO2010121674A3 Lighting electronic structure |
| 02/24/2011 | WO2010111048A3 Printed circuit board via drilling stage assembly |
| 02/24/2011 | US20110044015 Multichip module and method for manufacturing the same |
| 02/24/2011 | US20110044009 Semiconductor device |
| 02/24/2011 | US20110043105 Controlling an electronic device using chiplets |
| 02/24/2011 | US20110042348 Imprint method, imprint apparatus, and process for producing chip |
| 02/24/2011 | US20110042131 Ceramic substrate and manufacturing method thereof |
| 02/24/2011 | US20110042130 Multilayered wiring substrate and manufacturing method thereof |
| 02/24/2011 | US20110042124 Multilayer wiring substrate having cavity portion |
| 02/24/2011 | US20110041332 Connection component provided with inserts comprising compensating blocks |
| 02/24/2011 | US20110041330 Methods of manufacturing printed circuit boards with stacked micro vias |
| 02/24/2011 | US20110041329 Room temperature metal direct bonding |
| 02/24/2011 | DE112009000886T5 Vorrichtung zum Montieren von elektronischen Bauelementen und Vorrichtung zum Auftragen einer Versuchsbeschichtung aus einem viskosen Material An apparatus for mounting electronic components and apparatus for applying a test coating of a viscous material |
| 02/24/2011 | DE102010036812A1 Mehrchipmodul und Verfahren zu seiner Herstellung A multi-chip module and method for its preparation |
| 02/24/2011 | DE102009036938A1 Oberflächenspule Surface coil |
| 02/24/2011 | DE102009032219A1 Verfahren zum Herstellen einer integrierten Schaltung und resultierender Folienchip A method of fabricating an integrated circuit chip and resulting film |
| 02/24/2011 | DE102009028349A1 Verfahren zur Herstellung von Anschlussbohrungen mit optimierten Klemmkragen A process for the production of connection holes with optimized clamp collar |
| 02/23/2011 | EP2288244A1 Wiring circuit substrate |
| 02/23/2011 | EP2288243A1 Method for producing an electrical connection between circuit boards |
| 02/23/2011 | EP2288242A1 Multi-layer microwave corrugated printed circuit board and method |
| 02/23/2011 | EP2288241A1 Electric attachment assembly, method for its manufacture and usage |
| 02/23/2011 | EP2288240A2 Plasma treatment of organic solderability preservative coatings during printed circuit board assembly. |
| 02/23/2011 | EP2286468A1 Surface mount circuit board indicator |
| 02/23/2011 | EP2285574A1 Inkjet printing of nanoparticulate functional inks |
| 02/23/2011 | EP1941788B1 A device for the high-speed drilling of boards for printed circuits and the like |
| 02/23/2011 | EP1835796B9 Interposer bonding device |
| 02/23/2011 | CN201752162U Water-cooling device of continuous crimping machine |
| 02/23/2011 | CN201752161U Board parting machine |
| 02/23/2011 | CN201752159U 电路板 Circuit board |
| 02/23/2011 | CN201751072U Board pushing device for selective wave soldering |
| 02/23/2011 | CN201751071U Hot air leveling device |
| 02/23/2011 | CN101982028A Method of manufacturing wiring board, method of manufacturing optoelectric composite member, and method of manufacturing optoelectric composite board |
| 02/23/2011 | CN101982027A Electronic circuit board and power line communication device using the same |
| 02/23/2011 | CN101982026A Method for producing rigid-flex circuit board, and rigid-flex circuit board |
| 02/23/2011 | CN101982025A Method for the production of an electronic assembly |
| 02/23/2011 | CN101982024A Method of producing circuit board by additive method, and circuit board and multilayer circuit board obtained by the method |
| 02/23/2011 | CN101981230A Copper foil for printed circuit board and copper clad laminate plate for printed circuit board |
| 02/23/2011 | CN101980870A Method for manufacturing laminated circuit board |
| 02/23/2011 | CN101980862A Resin sheet with copper foil, multilayer printed wiring board, method for manufacturing multilayer printed wiring board and semiconductor device |