Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
01/2011
01/27/2011US20110017841 Jetting device and method at a jetting device
01/27/2011US20110017704 Method of electrically connecting a microelectronic component
01/27/2011US20110017703 Selective planarization method and devices fabricated on planarized structures
01/27/2011US20110017593 Highly sensitive biosensor, biochip comprising the same and method for manufacturing the same
01/27/2011US20110017500 Printed wiring board, electronic device and manufacturing method of the printed wiring board
01/27/2011US20110017495 Method for preparing a patterned electric circuit
01/27/2011US20110016981 Pressure measurement module
01/27/2011US20110016709 Manufacturing method for printed wiring board
01/27/2011US20110016708 Method for assembling components on a circuit board and related assembling system
01/27/2011US20110016707 Bonding machine incorporating dual-track transfer mechanism
01/27/2011DE4431847C5 Substrat mit bondfähiger Beschichtung Substrate with bondable coating
01/27/2011DE4225961C5 Vorrichtung zur Galvanisierung, insbesondere Verkupferung, flacher platten- oder bogenförmiger Gegenstände Apparatus for electroplating, in particular copper plating, flat plate or sheet-like objects
01/26/2011EP2278868A1 Seal structure
01/26/2011EP2278866A1 Flex-rigid wiring board and method of manufacturing the same
01/26/2011EP2278865A1 Wiring circuit substrate
01/26/2011EP2278864A1 Substrate, structure for mounting surface mounting component, and electronic device
01/26/2011EP2278396A1 Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for manufacturing printed wiring board
01/26/2011EP2277242A1 Contacting of multipoint connectors by means of intermediate circuit boards
01/26/2011EP2277179A1 Magnetically controlled polymer nanocomposite material and methods for applying and curing same, and nanomagnetic composite for rf applications
01/26/2011EP2276601A1 Reflow solder furnace and method for reflow soldering
01/26/2011EP1334810B1 Circuit board production method and circuit board production data
01/26/2011EP0907308B1 Methods for mounting terminals on a circuit board and circuit boards fitted with terminals
01/26/2011CN201726606U Cut-off rim charge removal device in production of copper-clad laminate
01/26/2011CN201726605U Metal substrate planing device for high-density interconnected circuit board
01/26/2011CN201726604U Superposition volume for solidification
01/26/2011CN201726603U Guide plate for releasing film through developing and etching
01/26/2011CN201726602U Counterpoint work fixture used for exposing flexible circuit board line
01/26/2011CN201726601U Circuit board engraving drilling machine with image-pickup positioning function
01/26/2011CN201726600U Tooling structure for horizontal guide of flexible circuit board
01/26/2011CN201726599U Full-automatic circuit board making machine
01/26/2011CN201721960U Two-line-in-one production device
01/26/2011CN201721106U Anti-skidding device for molding of copper-clad plates
01/26/2011CN201720602U Thermal press head
01/26/2011CN201719902U Impregnating liquid circulating and filtering device for manufacturing copper foil-covered laminated board
01/26/2011CN1964165B Dc brushless motor
01/26/2011CN1732567B Semiconductor device power interconnect striping
01/26/2011CN1661475B Photocuring resinoid compositio and printed circuit board using same
01/26/2011CN1530469B High efficient copper foil and producing method thereof
01/26/2011CN101960935A Process for producing multilayer printed wiring board
01/26/2011CN101960934A Multilayer printed wiring board
01/26/2011CN101960933A Mounted structure and motor
01/26/2011CN101960932A Solder connecting method, electronic device and method for manufacturing same
01/26/2011CN101960931A Flow soldering apparatus and flow soldering method
01/26/2011CN101960930A Method for manufacturing electronic component module
01/26/2011CN101960054A Aqueous, acid bath and method for the electrolytic deposition of copper
01/26/2011CN101959384A Surface mounting elastic sheet with supporting section and blocking adsorption section
01/26/2011CN101959376A Method for manufacturing multilayer flexible printed wiring board and multilayer circuit matrix material
01/26/2011CN101959375A Full-automatic exposing machine for inner circuit processing
01/26/2011CN101959374A Method for manufacturing multilayer printed circuit board
01/26/2011CN101959373A Method for improving blind hole alignment of printed circuit board
01/26/2011CN101959372A Super-thick copper circuit board solder resisting processing method
01/26/2011CN101959371A Manufacture method for ensuing integrated manufacture structure and dimension of printed circuit board
01/26/2011CN101959370A Method for preventing marking position numbers of devices in wrong positions in PCB
01/26/2011CN101959369A Method and system for burying and plugging hole on circuit board
01/26/2011CN101959368A Soft PCB (Printed Circuit Board) bending device with insulating film
01/26/2011CN101959366A Printed circuit board and method of manufacturing the same
01/26/2011CN101959330A Device for heating printed circuit board
01/26/2011CN101958292A Printed circuit board, encapsulation piece and manufacture methods thereof
01/26/2011CN101958258A Ball filling device and method
01/26/2011CN101954500A Device and method for processing counterbore of circuit board
01/26/2011CN101954402A Reinforcement component punching device and a reinforcement component sticking system using the same
01/26/2011CN101626665B Photocuring water-cooling process and fabricating method of single-sided flexible printed circuit board
01/26/2011CN101534608B Manufacturing method of flexible circuit board
01/26/2011CN101346038B Multi-layer substrate and manufacturing method thereof
01/26/2011CN101312115B Thin film pattern layer preparation method
01/26/2011CN101291564B Manufacturing process of resistor plate
01/26/2011CN101250386B Adhesive for electrode connection and connecting method using it
01/26/2011CN101048041B Method for connecting flexible printed circuit board and flexible circuit component and correlation structure
01/25/2011US7877159 Method and apparatus for managing production history information of pipe or tube and method for producing pipe or tube therewith
01/25/2011US7876088 Contacting component, method of producing the same, and test tool having the contacting component
01/25/2011US7875807 Elastic conductive resin, and electronic device including elastic conductive bumps made of the elastic conductive resin
01/25/2011US7875319 forming a plurality of shot drops by ejecting droplets from nozzles of a drawing apparatus to a plurality of pixel areas on a substrate; fills the corner part of the pixel areas with droplets and arranges the droplets uniformly in color tone in each of the pixel areas; for display apparatus
01/25/2011US7874474 Self-assembly of elements using microfluidic traps
01/25/2011US7874068 Production method for electronic chip component
01/25/2011US7874067 Manufacturing method for single chip COB USB devices with optional embedded LED
01/25/2011US7874066 Method of manufacturing a device-incorporated substrate
01/25/2011US7874065 Process for making a multilayer circuit board
01/20/2011WO2011008459A2 Structured material substrates for flexible, stretchable electronics
01/20/2011WO2011007763A1 Conductive particles, anisotropic conductive film, assembly, and connection method
01/20/2011WO2011007660A1 Signal line and circuit board
01/20/2011WO2011007570A1 Electronic module and method for manufacturing same
01/20/2011WO2011007566A1 Photocurable resin composition
01/20/2011WO2011007519A1 Module component and mehtod for manufacturing same
01/20/2011WO2011007502A1 Screen printing device and screen printing method
01/20/2011WO2011007215A1 Pressure foot device for a printed circuit boards drilling head
01/20/2011WO2011007214A1 Pressure foot device for a drilling head for printed circuit boards
01/20/2011WO2011007213A1 Drilling head for printed circuit boards
01/20/2011WO2011006730A1 Method for connecting an enamel-insulated wire to a printed circuit board
01/20/2011WO2011006725A1 Bendable luminous modules and method for producing bendable luminous modules
01/20/2011WO2011006641A1 Method for generating photonically treated printed structures on surfaces, apparatus, and use thereof
01/20/2011WO2011006482A1 Device for heating smd components for reballing
01/20/2011WO2011006432A1 Method of plugging holes of circuit board and system thereof
01/20/2011WO2010114272A3 Low temperature fireable paste composition for forming an electrode or wiring
01/20/2011WO2010097230A3 Method for producing a metal structure on a substrate
01/20/2011US20110014727 Thin film probe sheet and semiconductor chip inspection system
01/20/2011US20110014360 Increasing Exposure Tool Alignment Signal Strength for a Ferroelectric Capacitor Layer
01/20/2011US20110013865 Method of manufacturing wiring board, method of manufacturing optoelectric composite member, and method of manufacturing optoelectric composite board
01/20/2011US20110013349 Electronic component module and method of manufacturing the electronic component module
01/20/2011US20110013340 Capacitor and method of manufacturing the same
01/20/2011US20110012791 Left handed body, wave guide device and antenna using this body, manufacturing method for this body