| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 02/16/2011 | CN101973146A Process for producing prepreg with carrier, prepreg with carrier, process for producing thin-type double sided board, thin-type double sided board, and process for producing multilayered printed wirin |
| 02/16/2011 | CN101668391B Circuit board assembly and manufacturing method thereof |
| 02/16/2011 | CN101662888B Preparation method for PCB plate with step trough |
| 02/16/2011 | CN101616543B Printed substrate and electronic device |
| 02/16/2011 | CN101606444B Print circuit board and electronic device using the same |
| 02/16/2011 | CN101594743B Method for manufacturing outer graphics of electronic circuit board by encapsulation method |
| 02/16/2011 | CN101578010B Method for preparing high phase ratio electric leakage resistant tracking index leadless compatible CEM-3 copper-clad laminate |
| 02/16/2011 | CN101460018B Printed circuit board, manufacturing method and radio-frequency apparatus thereof |
| 02/16/2011 | CN101378632B Production method for wiring and vias |
| 02/16/2011 | CN101378629B Method for processing resistance welding milling point |
| 02/16/2011 | CN101188903B Multilayer printing circuit board |
| 02/15/2011 | US7890203 Wiring forming system and wiring forming method for forming wiring on wiring board |
| 02/15/2011 | US7888789 Transfer material used for producing a wiring substrate |
| 02/15/2011 | US7887911 Electromagnetic noise suppressor, article with electromagnetic noise suppressing function and their manufacturing methods |
| 02/15/2011 | US7887874 Fully automated paste dispense system for dispensing small dots and lines |
| 02/15/2011 | US7887712 Laser machining system and method |
| 02/15/2011 | US7887693 containing improved additive system for use at elevated temperatures comprising a suppressor including a high molecular weight polymer, a brightener comprising a divalent sulfur compound, and a leveler comprising a heterocyclic nitrogen compound; for plating through holes in printed circuits |
| 02/15/2011 | US7886438 Process for producing multilayer printed wiring board |
| 02/15/2011 | US7886436 Thin film capacitor-embedded printed circuit board and method of manufacturing the same |
| 02/15/2011 | US7886435 High performance chip carrier substrate |
| 02/15/2011 | US7886434 Method for making a micromachined microwave signal control device |
| 02/15/2011 | US7886433 Method of manufacturing a component-embedded PCB |
| 02/15/2011 | US7886432 Electric components connecting method |
| 02/15/2011 | US7886431 Power distribution system for integrated circuits |
| 02/15/2011 | US7886430 Method of installing circuit board component |
| 02/15/2011 | US7886429 Method for producing a measuring transducer |
| 02/10/2011 | WO2011016555A1 Semiconductor device and method for manufacturing same |
| 02/10/2011 | WO2011016394A1 Multilayered wiring board and method for manufacturing multilayered wiring board |
| 02/10/2011 | WO2011016185A1 Screen printing device and screen printing method |
| 02/10/2011 | WO2011015432A1 Sensor element comprising interlayer connection hole |
| 02/10/2011 | WO2011015275A1 Electrical component of a motor vehicle |
| 02/10/2011 | US20110034977 Implantable electrode array assembly including a carrier for supporting the electrodes and control modules for regulating operation of the electrodes embedded in the carrier, and method of making same |
| 02/10/2011 | US20110034965 Cermet-containing bushing for an implantable medical device |
| 02/10/2011 | US20110031041 Circular single-layer touch sensors |
| 02/10/2011 | US20110031003 Circuit materials with improved bond, method of manufacture thereof, and articles formed therefrom |
| 02/10/2011 | US20110031002 Printed wiring board having metal layers producing eutectic reaction |
| 02/10/2011 | US20110030999 Metal circuit wiring having organic resin for adhesive layers and method of manufacturing the same |
| 02/10/2011 | US20110030212 Method for manufacturing terminal structure and method for manufacturing electronic device |
| 02/10/2011 | US20110030209 Method for fabricating thin touch sensor panels |
| 02/10/2011 | US20110030208 Apparatus and method for mounting electronic parts |
| 02/10/2011 | US20110030207 Multilayer printed wiring board and manufacturing method thereof |
| 02/10/2011 | DE10323903B4 Verfahren zur Herstellung einer Mehrschicht-Schaltkreiskarte A process for producing a multilayer circuit board |
| 02/10/2011 | DE102009036025A1 Elektrische Anschlussanordnung, Verfahren zu deren Herstellung sowie deren Verwendung Electrical connection device, to processes for preparing them and their use |
| 02/09/2011 | EP2282622A1 Resin composition for forming the adhesive layers of a multi-layer flexible printed circuit board |
| 02/09/2011 | EP2282621A1 In-process orientation of particles in a direct-write ink to control electrical characteristics of an electrical component being fabricated |
| 02/09/2011 | EP2282620A1 Paired low-characteristic impedance power source line and ground line structure |
| 02/09/2011 | EP2282374A1 Circuit material |
| 02/09/2011 | EP2282337A2 Matrix type display apparatus, method of production thereof, and thermo-compression bonding head |
| 02/09/2011 | EP2282304A1 Electronic package, display device, and electronic device |
| 02/09/2011 | EP2281866A1 Aqueous stripping and cleaning compositon |
| 02/09/2011 | EP2281020A1 Photo-curing process for metallic inks |
| 02/09/2011 | EP1842939B1 Copper electrolysis solution containing compound having specific skeleton as additive, and electrolytic copper foil produced therefrom |
| 02/09/2011 | EP1405552B1 Method for manufacturing ceramic multilayer circuit board |
| 02/09/2011 | CN201742683U Full-automatic paster component inserter |
| 02/09/2011 | CN201742644U Fixing device of printed circuit board |
| 02/09/2011 | CN201742643U Printed circuit board jointed board and matched work fixture |
| 02/09/2011 | CN201742642U Universal positioning base of FPCB (flexible printed circuit board) |
| 02/09/2011 | CN201742639U Circuit board positioning device |
| 02/09/2011 | CN201737493U Horizontal PCB slab production equipment |
| 02/09/2011 | CN201736141U Circuit board fixing support |
| 02/09/2011 | CN201735922U Maintenance platform used to maintain AQFN mobile phone main board |
| 02/09/2011 | CN101971719A Method for manufacturing multi-piece substrate, and multi-piece substrate |
| 02/09/2011 | CN101971362A Positioning device to position one or more electronic circuit boards, in particular for photovoltaic cells, in a metal-deposition unit |
| 02/09/2011 | CN101971097A Photosensitive resin composition, photosensitive element, resist pattern forming method and method for manufacturing printed circuit board |
| 02/09/2011 | CN101969748A Method for enhancing weldability of direct-insert pin |
| 02/09/2011 | CN101969747A Hinge clamp positioning method for printed board processing |
| 02/09/2011 | CN101969746A Method for removing electroplating copper locally in hollowed-out area of printed circuit board |
| 02/09/2011 | CN101969745A Manufacturing method of flexible printed circuit board post-procedures |
| 02/09/2011 | CN101969744A Conveying method and device of sheet treatment process |
| 02/09/2011 | CN101969743A Flexible circuit board production process |
| 02/09/2011 | CN101969742A Printed wiring board, air conditioner, and method of soldering printed wiring board |
| 02/09/2011 | CN101969740A Printed wiring board, electronic device and manufacturing method of the printed wiring board |
| 02/09/2011 | CN101969739A Multilayer printing circuit board |
| 02/09/2011 | CN101969738A Coupon board and manufacturing method of printed circuit board |
| 02/09/2011 | CN101967634A Brown oxide treating agent for printed circuit board |
| 02/09/2011 | CN101967628A Pore wall charge regulating agent for circuit board |
| 02/09/2011 | CN101588679B Method for manufacturing micropores for electric conduction among copper foil of high-density multilayer circuit boards |
| 02/09/2011 | CN101507372B Printed wiring board, method for manufacturing printed wiring board, and electric device |
| 02/09/2011 | CN101409985B Method of producing substrate |
| 02/09/2011 | CN101409983B Method of producing substrate |
| 02/09/2011 | CN101404856B Method for plug-in mounting press key lamp and printed circuit board |
| 02/09/2011 | CN101352954B Mask for screen printing and screen printing method using the same |
| 02/09/2011 | CN101345228B Substrate for mounting device, manufacturing method thereof, semiconductor module and portable equipment |
| 02/09/2011 | CN101287332B Circuit board and method of processing the same |
| 02/09/2011 | CN101212166B Motor module |
| 02/09/2011 | CN101207975B Welding fixture of circuit board |
| 02/09/2011 | CN101160194B Pin, fluxing medium impressing device and method for impressing fluxing medium using the device |
| 02/08/2011 | US7885723 Setting device, component mounting system, program and calculating method |
| 02/08/2011 | US7885081 Component incorporating module |
| 02/08/2011 | US7883783 Electrodeposited copper foil with carrier foil on which a resin layer for forming insulating layer is formed, copper-clad laminate, printed wiring board, method for manufacturing multilayer copper-clad laminate, and method for manufacturing printed wiring board |
| 02/08/2011 | US7883614 If electroplating is grown with a conductor layer providing the surface of an opening portion and attached to one side of a single-layer plate as electric supplying film (electrode), a conductor portion can be formed without an electroless plating layer being used as an electrode; accuracy |
| 02/08/2011 | US7882626 Method of manufacturing wiring board having a semiconductor thereon |
| 02/08/2011 | US7882625 Transfer mask in micro ball mounter |
| 02/08/2011 | CA2525620C Embedded rf vertical interconnect for flexible conformal antenna |
| 02/03/2011 | WO2011014272A1 Systems and methods for composite structures with embedded interconnects |
| 02/03/2011 | WO2011013922A2 Surface treating agent composition, method for preparing same, copper foil for a printed circuit board, and flexible copper clad laminate |
| 02/03/2011 | WO2011013664A1 Photosensitive resin composition, photosensitive resin laminate, and method for forming resist pattern |
| 02/03/2011 | WO2011013547A1 Negative photosensitive resin composition, polyimide resin film using same, and flexible printed circuit board |
| 02/03/2011 | WO2011013525A1 Plasma processing device and printed wiring board manufacturing method |
| 02/03/2011 | WO2011013508A1 Electronic component |