H05K 3 - Apparatus or processes for manufacturing printed circuits

Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
10/2011
10/12/2011	CN102215637A Manufacturing method of semiconductor chip-embedded wiring substrate
10/12/2011	CN102215636A Circuit board wet processing device
10/12/2011	CN102215635A Copper foil for processing copper clad laminate, copper clad laminate and printed wiring board equipped with copper clad laminate
10/12/2011	CN102215633A Circuit board and manufacturing method thereof
10/12/2011	CN102215630A Flexible printed board and method of manufacturing same
10/12/2011	CN102215629A Printed circuit board, manufacturing method thereof as well as computer
10/12/2011	CN102215627A Multilayer circuit board
10/12/2011	CN102214539A Process for producing substrate provided with metal pattern and substrate provided with metal laminate
10/12/2011	CN102212853A Surface treatment coarsening process for improving peel strength of copper foil
10/12/2011	CN102212304A Flexible circuit conductive composition, preparation method and using method thereof
10/12/2011	CN102211258A Soldering apparatus
10/12/2011	CN102211237A Soldering apparatus
10/12/2011	CN101815408B Fully automatic circuit board manufacturing machine
10/12/2011	CN101808467B Lamination lay-up system and transfer machine thereof
10/12/2011	CN101772269B PCB (Printed Circuit Board) processing method
10/12/2011	CN101751489B Automatic drawing method and drawing system of cutting graticule of circuit board master slice
10/12/2011	CN101742820B Productive technology of flexible printed circuit board
10/12/2011	CN101677068B Copper core layer multilayer packaging substrate manufacturing method
10/12/2011	CN101677066B Build-up circuit board manufacturing method
10/12/2011	CN101553094B A method for manufacturing a circuit board provided with an embedded typed metal conduction column
10/12/2011	CN101542705B Electronic component mounting structure and method for manufacturing the same
10/12/2011	CN101460017B Thru-hole electroplating method for printed circuit board
10/12/2011	CN101431866B Method for producing flexible circuit board by rinsing technique
10/12/2011	CN101419949B Circuit apparatus and method of manufacturing the same
10/12/2011	CN101408688B Wiring circuit board, manufacturing method for the wiring circuit board, and circuit module
10/12/2011	CN101107891B Multilayer printed wiring board
10/11/2011	US8035974 Integrated circuit package support system
10/11/2011	US8035886 Electronically addressable microencapsulated ink and display thereof
10/11/2011	US8035214 Conductive connecting pin for package substance
10/11/2011	US8034658 Electronic module with a conductive-pattern layer and a method of manufacturing same
10/11/2011	US8034531 Photosensitive resin composition comprising a halogen-free colorant
10/11/2011	US8034412 Treatment of items
10/11/2011	US8033218 Printing device, production unit, and production method of electronic parts
10/11/2011	US8033014 Method of making a molded interconnect device
10/11/2011	US8033013 Method of making rigid-flexible printed circuit board having a peelable mask
10/11/2011	US8033012 Method for fabricating a semiconductor test probe card space transformer
10/07/2011	DE202010006945U1 Druckschablone Stencil
10/06/2011	WO2011123169A1 Fluorinated silver paste for forming electrical connections in highly dielectric films, and related products and methods
10/06/2011	WO2011122737A1 Ink for printing a mobile phone antenna pattern, method for manufacturing a synthetic resin part for a mobile phone on which an antenna pattern is printed using the ink, and synthetic resin part for a mobile phone on which an antenna pattern is printed
10/06/2011	WO2011122723A1 Method for manufacturing a double-sided printed circuit board
10/06/2011	WO2011122645A1 Copper foil for printed wiring board with excellent etching properties and layered body using same
10/06/2011	WO2011122643A1 Copper foil for printed wiring board and layered body using same
10/06/2011	WO2011122532A1 Composite metal layer provided with supporting body metal foil, wiring board using the composite metal layer, method for manufacturing the wiring board, and method for manufacturing semiconductor package using the wiring board
10/06/2011	WO2011122408A1 Multilayer ceramic substrate and method for producing same
10/06/2011	WO2011122406A1 Metal base substrate and manufacturing method thereof
10/06/2011	WO2011122246A1 Circuit board and manufacturing method therefor
10/06/2011	WO2011122245A1 Circuit board and manufacturing method therefor
10/06/2011	WO2011122244A1 Wiring board and manufacturing process for same
10/06/2011	WO2011122228A1 Substrate with built-in semiconductor
10/06/2011	WO2011122028A1 Photosensitive resin composition
10/06/2011	WO2011122027A1 Photo-curable thermosetting resin composition
10/06/2011	WO2011122025A1 Photocurable resin composition
10/06/2011	WO2011122023A1 Mould release film
10/06/2011	WO2011121993A1 Component assembly
10/06/2011	WO2011121725A1 Electronic device and electronic system
10/06/2011	WO2011120509A1 Device and method for spraying a surface of a substrate
10/06/2011	WO2011120397A1 Monolayer flexible printed circuit board and method for realizing it
10/06/2011	US20110242960 Light emitting device and method for manufacturing light emitting device
10/06/2011	US20110242779 method for making contactless portable devices with dielectric bridge and portable devices
10/06/2011	US20110242778 Electrical Connections for Anodized Thin Film Structures
10/06/2011	US20110242746 Dilatant enclosure systems and methods
10/06/2011	US20110242725 Capacitor arrangement and method for producing a capacitor arrangement
10/06/2011	US20110241546 RF Screen Assembly for Microwave Powered UV Lamps
10/06/2011	US20110240357 Wiring board and method for manufacturing the same
10/06/2011	US20110240356 Wiring board and method for manufacturing the same
10/06/2011	US20110240355 Printed circuit board unit, electronic device and method of fabricating printed circuit board
10/06/2011	US20110240354 Wiring board and method for manufacturing wiring board
10/06/2011	US20110240352 Printed circuit board and method of fabricating printed circuit board
10/06/2011	US20110240351 Wiring board and method for manufacturing the same
10/06/2011	US20110240348 Backdrilling of multilayer printed circuit boards
10/06/2011	US20110240347 Controlled-impedance electronic board vias, method of forming the same, and unitized pcb incorporating the same
10/06/2011	US20110239459 Method for manufacturing wafer scale heat slug system
10/06/2011	US20110239458 Thermo-compression bonded electrical interconnect structure and method
10/06/2011	US20110239457 Circuit modules and method of managing the same
10/06/2011	US20110239456 In system reflow of low temperature eutectic bond balls
10/06/2011	DE102010016288A1 Elektronische Baueinheit und Weltraumfahrzeug damit Electronic assembly and spacecraft so that
10/06/2011	DE102010013909A1 Vorrichtung und Verfahren zum Besprühen einer Oberfläche eines Substrates Apparatus and method for spraying a surface of a substrate
10/06/2011	DE102010013348A1 Method for manufacturing printing stencil with substrate side and squeegee side from stencil body using ablation laser, involves introducing recess into stencil body of substrate side, and representing print pattern by through hole
10/05/2011	EP2373138A1 Point flow soldering apparatus
10/05/2011	EP2373137A1 Printed circuit board unit, electronic device and method of fabricating printed circuit board
10/05/2011	EP2373136A1 Electronic device, power converter, and method for manufacturing electronic device
10/05/2011	EP2373135A1 Printed Circuit Board and Method of Fabricating Printed Circuit Board
10/05/2011	EP2373134A1 Rolled copper foil or electrolytic copper foil for electronic circuit, and method for forming electronic circuit using the rolled copper foil or electrolytic copper foil
10/05/2011	EP2373133A1 Rolled copper foil or electrolytic copper foil for electronic circuit, and method for forming electronic circuit using the rolled copper foil or electrolytic copper foil
10/05/2011	EP2373132A1 Method for forming electronic circuit
10/05/2011	EP2372793A1 LED package and LED package mounting structure
10/05/2011	EP2371536A1 Copper foil with resin
10/05/2011	EP1568723B1 Photo- and thermo-setting resin composition and printed wiring boards made by using the same
10/05/2011	CN202005073U Carrier plate jig capable of reducing tin soldering loss
10/05/2011	CN202005072U Improved alignment equipment for flexible cable fixture
10/05/2011	CN202005071U Chip mounter
10/05/2011	CN202005070U Plate putting table surface and plate putting table
10/05/2011	CN202005068U Wire device with at least one embedded flexible wire foil and embedding device thereof
10/05/2011	CN202005059U Positioning mark structure used for measuring harmomegathus of six-layer HDI (High Density Inverter) circuit board
10/05/2011	CN202005056U Anti-static device of dust sticking machine
10/05/2011	CN202000013U Floating target for plating bath of pattern plating equipment of printed circuit board
10/05/2011	CN102210199A Electric circuit apparatus
10/05/2011	CN102210198A Multi-piece board manufacturing method
10/05/2011	CN102210197A Multi-piece substrate and method for manufacturing the same
10/05/2011	CN102210022A Solid state drive or other storage apparatus that includes a plurality of encapsulated semiconductor chips

1 ... 178 179 180 181 182 183 184 185 186 187 188 189 190 191 192 193 194 195 196 197 198 ... 1185