Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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10/19/2011 | CN102220593A Copper surface cleaning device for outer-layer dry film process of circuit board |
10/19/2011 | CN102220575A Silver precipitating surface treatment equipment for circuit board |
10/19/2011 | CN101873765B Automatic solution adding system |
10/19/2011 | CN101784164B Making method of groove type printed circuit board |
10/19/2011 | CN101290898B Mask manufacturing method of base board using the mask |
10/19/2011 | CN101026931B Right-angled signal line making method and its circuit board |
10/18/2011 | US8039948 Device mounting board and semiconductor apparatus using the same |
10/18/2011 | US8039757 Electronic part mounting substrate and method for producing same |
10/18/2011 | US8039755 Method for manufacturing a printed circuit board element as well as a printed circuit board element |
10/18/2011 | US8039320 Optimized circuit design layout for high performance ball grid array packages |
10/18/2011 | US8038051 Method for production of electronic circuit board |
10/18/2011 | US8037604 Method of manufacturing ink jet recording head |
10/18/2011 | US8037596 Method for manufacturing a wiring board |
10/18/2011 | CA2502717C Mixture of oligomeric phenazinium compounds and acid bath for electrolytically depositing a copper deposit |
10/13/2011 | WO2011127328A2 Electronic assemblies and methods of forming electronic assemblies |
10/13/2011 | WO2011127041A1 Selective patterning for low cost through vias |
10/13/2011 | WO2011126925A2 Debond interconnect structures |
10/13/2011 | WO2011126766A1 A pre-lamination core and method for making a pre-lamination core for electronic cards and tags |
10/13/2011 | WO2011126706A2 Printable materials and methods of manufacture thereof |
10/13/2011 | WO2011126646A2 Improved backdrilling of multilayer printed circuit boards |
10/13/2011 | WO2011126108A1 Method of forming microstructures, laser irradiation device, and substrate |
10/13/2011 | WO2011125874A1 Mounting board and method for manufacturing a mounting board |
10/13/2011 | WO2011125820A1 Solder resist composition and printed circuit board |
10/13/2011 | WO2011125752A1 Method of forming microstructures, laser irradiation device, and substrate |
10/13/2011 | WO2011125741A1 Membrane wiring board |
10/13/2011 | WO2011125669A1 Soldering device and cover support/sealing structure |
10/13/2011 | WO2011125668A1 Soldering device and moveable partitioning member structure |
10/13/2011 | WO2011125604A1 Curable resin composition, dry film using same, and printed wiring board |
10/13/2011 | WO2011125506A1 Stress buffer layer and method for producing same |
10/13/2011 | WO2011125380A1 Wiring substrate incorporating semiconductor element |
10/13/2011 | WO2011125354A1 Substrate with built-in functional element |
10/13/2011 | WO2011125037A2 Process for producing electric circuits on a given surface |
10/13/2011 | WO2011079918A3 Conductor structural element and method for producing a conductor structural element |
10/13/2011 | WO2011070015A3 Circuit module and method for producing such a circuit module |
10/13/2011 | US20110250459 Epoxy resin composition, prepreg, laminate board, and multi-layer board |
10/13/2011 | US20110249533 Glass substrate polishing method, package manufacturing method, piezoelectric vibrator, oscillator, electronic device and radio timepiece |
10/13/2011 | US20110249416 Circuit module |
10/13/2011 | US20110249340 Process for producing substrate provided with metal pattern and substrate provided with metal laminate |
10/13/2011 | US20110249106 Image pickup apparatus, endoscope and manufacturing method for image pickup apparatus |
10/13/2011 | US20110247941 Method for Electrochemical Fabrication |
10/13/2011 | US20110247874 Adhesive for bonding circuit members, circuit board and process for its production |
10/13/2011 | US20110247873 Adhesive for bonding circuit members, circuit board and process for its production |
10/13/2011 | US20110247870 Circuit connecting material, film-form circuit connecting material using the same, circuit member connecting structure and method of manufacturing the same |
10/13/2011 | US20110247867 Adhesive for bonding circuit members, circuit board and process for its production |
10/13/2011 | US20110247865 Method for producing multilayer wiring substrate and multilayer wiring substrate |
10/13/2011 | US20110247863 Flexible printed board and method of manufacturing same |
10/13/2011 | US20110247862 Flexible Printed Circuit Cable With Multi-Layer Interconnection |
10/13/2011 | US20110247860 Method of producing circuit board, and circuit board obtained using the manufacturing method |
10/13/2011 | US20110247858 Printed Circuit Board and Method Of Manufacturing The Same |
10/13/2011 | US20110247757 Circuit connection material, film-form circuit connecting material using the same, circuit member connecting structure, and method of manufacturing the same |
10/13/2011 | US20110247212 Wiring board and method of manufacturing wiring board |
10/13/2011 | US20110247211 Circuit board with embedded component and method of manufacturing same |
10/13/2011 | US20110247210 Process for the wafer-scale fabrication of electronic modules for surface mounting |
10/13/2011 | US20110247209 Method of making contact probe |
10/13/2011 | US20110247208 Multilayered printed wiring board |
10/13/2011 | US20110247207 Method for manufacturing multilayer flexible printed circuit board |
10/13/2011 | DE102010003678A1 Method for manufacturing control module for transmission control of motor car, involves providing recess in printed circuit board, and pressing functional printed circuit board module into recess |
10/13/2011 | CA2795335A1 Two-component, polyaspartic coating compositions |
10/13/2011 | CA2795294A1 A pre-lamination core and method for making a pre-lamination core for electronic cards and tags |
10/13/2011 | CA2777350A1 Process for producing electric circuits on a given surface |
10/12/2011 | EP2375879A1 Flexible substrate and electronic device |
10/12/2011 | EP2375878A2 Light emitting device module |
10/12/2011 | EP2374612A1 Surface metal film material, process for producing surface metal film material, process for producing metal pattern material, and metal pattern material |
10/12/2011 | EP2374567A1 Soldering apparatus with calculation unit for obtaining information of its consumed electric energy |
10/12/2011 | EP2374566A2 Soldering apparatus |
10/12/2011 | EP2374338A1 Electrical circuit assembly, control device and method for producing an electrical circuit assembly |
10/12/2011 | EP2374337A1 Method for electric circuit deposition |
10/12/2011 | EP2374336A1 Method for generation of electrically conducting surface structures, apparatus therefor and use |
10/12/2011 | EP2374335A1 Flexible electronic product and method for manufacturing the same |
10/12/2011 | EP2374174A2 Apparatus and method for preventing splatter for continuous printing |
10/12/2011 | EP2373590A1 Method and system for applying materials on a substrate |
10/12/2011 | EP2373451A1 Device for ejecting droplets of a fluid having a high temperature |
10/12/2011 | EP2152831B1 Improved structural adhesive materials |
10/12/2011 | EP2061290B1 Ceramic substrate manufacturing method and ceramic substrate |
10/12/2011 | EP2053030B1 Process for production of formed ceramic bodies |
10/12/2011 | EP2013821B1 An electronic inlay module for electronic cards and tags, electronic card and methods for manufacturing such electronic inlay modules and cards |
10/12/2011 | EP1997115B1 Ceramic component element and method for manufacturing the same |
10/12/2011 | EP1639872B1 Integrated electromechanical arrangement and method of production |
10/12/2011 | EP1552731B1 Jetting device and method at a jetting device |
10/12/2011 | EP1145607B1 Production of photoresist coatings |
10/12/2011 | EP0952762B1 Printed wiring board and method for manufacturing the same |
10/12/2011 | CN202009543U Base plate of plug hole |
10/12/2011 | CN202009542U Tin-blocking jig |
10/12/2011 | CN202006821U Board placement vehicle for electroplating production of printed circuit board |
10/12/2011 | CN202006331U Heating and surface mounting integrated hot air head |
10/12/2011 | CN202006295U Beveling machine of printed circuit board |
10/12/2011 | CN1913044B Thick film conductor composition, and its use in ltcc circuit and device |
10/12/2011 | CN1883237B Lighting device of discharge lamp, illumination apparatus and illumination system |
10/12/2011 | CN102217431A Circuit board having an electrodeposited coating on a conductive core within a via and method of making same |
10/12/2011 | CN102217430A Illumination device comprising two printed circuit boards |
10/12/2011 | CN102217009A Method for producing substrate having patterned conductive polymer film and substrate having patterned conductive polymer film |
10/12/2011 | CN102216078A Method for producing laminate, and laminate |
10/12/2011 | CN102216075A Protective film for electronic component, manufacturing method therefor, and use thereof |
10/12/2011 | CN102216026A Solder material comprising a reactive filler material, carrier element or component comprising said type of solder material and use of a fluxing agent |
10/12/2011 | CN102216017A Method and apparatus for reflow soldering |
10/12/2011 | CN102215642A Manufacturing method for rigid flexible printed circuit board (R-F PCB) |
10/12/2011 | CN102215641A Manufacturing process of high-density printed board with holes in pads |
10/12/2011 | CN102215640A Manufacturing method for circuit board |
10/12/2011 | CN102215639A Semiconductor chip built-in wiring board and manufacturing method thereof |
10/12/2011 | CN102215638A Method for welding pin through-hole element in surface mounting technology process |