H05K 3 - Apparatus or processes for manufacturing printed circuits

Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
10/2011
10/26/2011	CN202017050U Electroless plating copper jar preventing deposition of shot copper
10/26/2011	CN202015984U Edge grinding machine of printed circuit board
10/26/2011	CN202015547U Filter system
10/26/2011	CN1836257B Inspection system for and method of inspecting deposits printed on workpieces
10/26/2011	CN102227959A Wiring board and method for manufacturing same
10/26/2011	CN102227957A Printed wiring board, method for manufacturing same, and printed wiring board semi-finished-product-linked object
10/26/2011	CN102227760A Acf attachment device and display device manufacturing method
10/26/2011	CN102227312A Device for cleaning screen printing mask, screen printing machine, and method for cleaning screen printing mask
10/26/2011	CN102227158A Stitching clamp of FPC golden finger
10/26/2011	CN102227157A Hairbrush cleaning machine of through type
10/26/2011	CN102227156A High reflection mirror MCPCB (printed circuit board) and preparation method thereof
10/26/2011	CN101949051B Through hole plating sub-basket
10/26/2011	CN101854778B Manufacturing process for plugging conductive holes of circuit board with resin
10/26/2011	CN101827494B Wiring board and method for manufacturing the same
10/26/2011	CN101742821B Application method of circuit board bearing device
10/26/2011	CN101662883B Circuit board including aligned nanostructures and manufacture method
10/26/2011	CN101548405B Uv-photopolymerizable composition for producing organic conductive layers, patterns or prints
10/26/2011	CN101472401B Reflow furnace
10/26/2011	CN101449633B Process for producing copper wiring polyimide film, and copper wiring polyimide film
10/26/2011	CN101420820B Double side flexible copper coated board and manufacturing method thereof
10/26/2011	CN101252817B Design producing method of multi-layer printed circuit board
10/26/2011	CN101150009B Plated terminations and method of forming using electrolytic plating
10/26/2011	CN101145630B Method of manufacturing metal film pattern forming body
10/25/2011	US8044501 Contact structure, display device and electronic device
10/25/2011	US8044301 Printed circuit board provided with heat circulating medium and method for manufacturing the same
10/25/2011	US8043709 Circuit connecting material, film-like circuit connecting material using the same, circuit member connecting structure, and method of producing the same
10/25/2011	US8042727 Heater, reflow apparatus, and solder bump forming method and apparatus
10/25/2011	US8042267 Method for producing microsystems
10/25/2011	US8042266 Mounting apparatus and method to control mounting apparatus
10/25/2011	US8042265 Method for manufacturing multilayer flexible printed circuit board
10/25/2011	CA2538338C Warming apparatus with heater produced by pcb
10/23/2011	CA2737926A1 Molded printed circuit board
10/20/2011	WO2011130622A1 Method for recycling of obsolete printed circuit boards
10/20/2011	WO2011129299A1 Printed wiring board and method of manufacturing thereof
10/20/2011	WO2011129186A1 Photosensitive resin composition, photoresist film using same, method for forming resist pattern, and method for manufacturing printed wiring board
10/20/2011	WO2011129161A1 Module substrate, production method for module substrate, and terminal connection board
10/20/2011	WO2011129133A1 Connection substrate
10/20/2011	WO2011129130A1 Board and method for manufacturing board
10/20/2011	WO2011129127A1 Multi-layer flexible printed circuit board and method of manufacturing thereof
10/20/2011	WO2011127867A2 Multi-layer circuit board and manufacturing method thereof
10/20/2011	WO2011127503A1 Method for integrating an electronic component into a printed circuit board, and printed circuit board comprising an electronic component integrated therein
10/20/2011	WO2011087591A3 Multiple surface finishes for microelectronic package substrates
10/20/2011	US20110256702 Thin film transistor and display device, and method for manufacturing thereof
10/20/2011	US20110256363 Surface metal film material, method of producing surface metal film material, method of producing metal pattern material, and metal pattern material
10/20/2011	US20110256355 Low-k dielectric functional imprinting materials
10/20/2011	US20110256308 Algorithmic processing to create features
10/20/2011	US20110255280 Multiple LED Bulb With Thermal Management Features
10/20/2011	US20110255227 Protection panel provided with touch input function for display window of electronic device, and manufacturing method therefor
10/20/2011	US20110254648 Movable transformer embedded into an opening of a pcb and a method of installing the same
10/20/2011	US20110254171 Integrated Method for High-Density Interconnection of Electronic Components through Stretchable Interconnects
10/20/2011	US20110253439 Circuit substrate and manufacturing method thereof
10/20/2011	US20110253432 Method and Apparatus for Providing Hermetic Electrical Feedthrough
10/20/2011	US20110253431 Printed circuit substrate and method of manufacturing the same
10/20/2011	US20110253430 Micro pin hybrid interconnect array and method of manufacturing same
10/20/2011	US20110253429 Apparatus with a Multi-Layer Coating and Method of Forming the Same
10/20/2011	US20110253426 Curable composition
10/20/2011	US20110253423 Printed circuit board with fins and method for manufacturing same
10/20/2011	US20110253310 Methods and apparatus for an induction coil arrangement in a plasma processing system
10/20/2011	US20110253306 Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board
10/20/2011	US20110252641 Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board
10/20/2011	US20110252639 Printed wiring board with a built-in resistive element
10/20/2011	US20110252638 Multilayer printed wiring board and method of manufacturing the same
10/20/2011	US20110252637 Structure and method of making interconnect element, and multilayer wiring board including the interconnect element
10/20/2011	US20110252636 Method of manufacturing variable wavelength interference filter and variable wavelength interference filter
10/20/2011	DE102010027932A1 Verbundbauteil und Verfahren zum Herstellen eines Verbundbauteils Composite component and method of manufacturing a composite component
10/20/2011	DE102010015659A1 Transferverfahren zur Herstellung von Leiterstrukturen mittels Nanotinten Transfer method for the production of conductor structures by means nanoinks
10/20/2011	DE102010015419A1 Component e.g. electrolytic capacitor mounted in printed circuit board, has plates with press contacts, which are provided at front side and back side of main portion respectively
10/19/2011	EP2378846A1 Decorative product surface with circuit board function
10/19/2011	EP2377956A1 Device for copper precipitation in lead-free solder, granulation and separation of (cux) 6sn5 compounds and recovery of tin
10/19/2011	EP2377835A1 Green sheet
10/19/2011	EP2377376A1 Method to form solder deposits on substrates
10/19/2011	EP2377375A1 Method and apparatus for laser machining relatively narrow and relatively wide structures
10/19/2011	EP2376678A2 Solution and process for increasing the solderability and corrosion resistance of a metal or metal alloy surface
10/19/2011	EP2376434A1 Functional material for printed electronic components
10/19/2011	EP2200838B1 Method for providing a patterned metal layer having high conductivity
10/19/2011	EP2091307B1 Circuit board connection structure and circuit board
10/19/2011	EP2043142B1 Mounting method using thermocompression head
10/19/2011	EP2033780B1 Printing device and printing method
10/19/2011	EP2012570B1 Jet solder tank
10/19/2011	CN202014413U Multi-layer ceramics substrates
10/19/2011	CN1713967B Chemical-solution supplying apparatus
10/19/2011	CN1613932B Non-sticky water-based conformal coating material
10/19/2011	CN102224771A Printed wiring board and method for manufacturing same
10/19/2011	CN102224770A Method for manufacturing circuit board, and circuit board obtained using the manufacturing method
10/19/2011	CN102224769A Multi-piece substrate and method for manufacturing same
10/19/2011	CN102224270A Lead wire for solar cell, manufacturing method and storage method thereof, and solar cell
10/19/2011	CN102223770A Brazing filler metal turbulent flow wave crest generator
10/19/2011	CN102223769A Anti-floating and anti-tilt tool in circuit board wave soldering process
10/19/2011	CN102223768A Multiple-photoelectric thin board spliced yin and yang jig
10/19/2011	CN102223767A Production process for high heat-conduction circuit board
10/19/2011	CN102223766A Printed circuit board (PCB) positioning device and production method thereof
10/19/2011	CN102223765A Substrate processing apparatus and method
10/19/2011	CN102223764A Manufacturing method of flexible circuit boards
10/19/2011	CN102223763A Manufacturing method of connecting sheet circuit board
10/19/2011	CN102223762A High-precision jacquard glass fiber fabric
10/19/2011	CN102223757A Wiring board and method for manufacturing wiring board
10/19/2011	CN102223756A Method for producing an electrically conductive connection between a contact and a counter contact
10/19/2011	CN102223753A Circuit board and production method thereof
10/19/2011	CN102223752A Multi-layer flexible circuit board and manufacturing method thereof
10/19/2011	CN102222649A Adhesive composition,circuit connecting material, connection structure of circuit connectors and semiconductor devices

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