Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
04/2012
04/26/2012US20120097432 Electrode array
04/26/2012US20120097431 Lightweight circuit board with conductive constraining cores
04/26/2012US20120097430 Packaging substrate and method of fabricating the same
04/26/2012US20120097429 Package substrate and fabrication method thereof
04/26/2012US20120097428 Signal line path and manufacturing method therefor
04/26/2012US20120097326 Method for manufacturing rigid-flexible printed circuit board
04/26/2012US20120096711 Wiring board and method for manufacturing the same
04/26/2012US20120096710 Conductive substrate structure with conductive channels formed by using a two-sided cut approach and a method for manufacturing the same
04/26/2012DE112006001008B4 Leiterplattenverbinder PCB connector
04/26/2012DE102011116584A1 Elektrisches bauteil zur oberflächenbestückung Electrical component for surface mount
04/26/2012DE102010042685A1 Method for assembling printed circuit board with heavy components in inductive conductivity sensor, involves determining dimensions of solder surfaces depending on weight of components that are connected to solder surfaces
04/26/2012DE102007017529B4 Modul für eine elektronische Steuervorrichtung mit vereinfachtem Aufbau, Verfahren zur Herstellung sowie Verwendung eines solchen Moduls Module for an electronic control device having a simplified structure, methods of making and use of such a module
04/26/2012CA2814138A1 Moisture-proof insulating material
04/25/2012EP2445328A2 Method and apparatus for placing substrate support components
04/25/2012EP2445324A1 Electrode connection structure, conductive adhesive used therefor, and electronic device
04/25/2012EP2445323A1 Electrode connection method, electrode connection structure, conductive adhesive used therefor, and electronic device
04/25/2012EP2445322A1 Connection method, connection structure, and electronic device
04/25/2012EP2445321A1 Conductive circuits for a touch panel and the manufacturing method thereof
04/25/2012EP2444844A2 Pattern transfer method and apparatus therefor
04/25/2012EP2444530A1 Copper foil and a method for producing same
04/25/2012EP2444527A2 Tin plating solution
04/25/2012EP2311301B1 Method of forming a patterned substrate
04/25/2012EP2051820B1 Process for improving the adhesion of polymeric materials to metal surfaces
04/25/2012EP1925192B1 Laminated substrate for mounting electronic parts
04/25/2012CN202206733U 抵挡定位式扣板机构 Location type pinch mechanism to resist
04/25/2012CN202206731U Pcb轨道宽度调节机构 Pcb track width adjustment mechanism
04/25/2012CN202206663U 一种送料器及具有该送料器的贴片机 One kind of feeder and the feeder has Mounter
04/25/2012CN202206662U 印制电路板皂化剂清洗装置 Printed circuit board cleaning device Saponifier
04/25/2012CN202206661U 印制电路板的清洗装置 Printed circuit board cleaning apparatus
04/25/2012CN202206660U 用于制备印刷电路板的工作面板、工作平台和工作系统 For the preparation of printed circuit boards operating panel, the working platform and the operation of the system
04/25/2012CN1805652B Soft printing circuit board, multi-layer soft printing circuit board and portable telephone terminal
04/25/2012CN1659810B Direct-connect signaling system
04/25/2012CN102428767A 用于安装在基板表面的导电性接触端子 For mounting on the surface of the conductive substrate contact terminals
04/25/2012CN102428407A Photocurable Thermosetting Resin Composition, Dry Film And Cured Product Thereof, And Printed Wiring Board Using Those Materials
04/25/2012CN102428406A 感光性树脂组合物 The photosensitive resin composition
04/25/2012CN102428241A 具有用于插入电导体线路的外部缺口的锁壳体件 A housing having a locking member for insertion into an external electrical conductor line gaps
04/25/2012CN102428118A Liquid coverlays for flexible printed circuit boards
04/25/2012CN102427685A 一种hdi板的制作流程 One kind hdi board production process
04/25/2012CN102427684A 一种高密度互连印制电路板的制造方法 A method of manufacturing a high density interconnect printed circuit board
04/25/2012CN102427683A 薄板的pth生产工艺及其工装 Sheet pth production processes and tooling
04/25/2012CN102427682A 金手指电路板制作方法 Goldfinger circuit board production method
04/25/2012CN102427681A 金手指电路板制作方法 Goldfinger circuit board production method
04/25/2012CN102427680A 一种单面板金手指的制造工艺 A single-panel manufacturing process Goldfinger
04/25/2012CN102427679A 具有嵌入式凸块互连结构的柔性印刷电路板及其制作方法 Flexible printed circuit board and its production methods with embedded bump interconnection structure
04/25/2012CN102427678A Pcb板制作方法 Pcb board production methods
04/25/2012CN102427677A 万能塞孔底板 Universal plug hole plate
04/25/2012CN102427676A 一种散热型刚挠结合板及其制作方法 A heat sink type of rigid-flex board and its manufacturing method
04/25/2012CN102427675A 一种pin针拆解机 One kind of pin needle dismantling machine
04/25/2012CN102427674A Surface mounting device
04/25/2012CN102427673A 盲孔pcb板的加工方法 Blind hole pcb board processing method
04/25/2012CN102427672A 选择性沉金板的加工方法 Selective Immersion Gold board processing method
04/25/2012CN102427671A Local thick copper plating process of dense hole
04/25/2012CN102427670A 一种印刷电路板的减薄铜层方法 A printed circuit board copper layer thinning method
04/25/2012CN102427669A 一种双面印制电路板的制作方法 A method of making a double-sided printed circuit board
04/25/2012CN102427668A 在电路板上加工直径为5.0mm以上大孔的工艺 Processing the circuit board hole having a diameter of 5.0mm and larger craft
04/25/2012CN102427667A 半孔板的加工工艺 Semi-well plate processing
04/25/2012CN102427666A 一种高频微波电路板基材的制作方法 A method of making a high-frequency microwave circuit board substrates
04/25/2012CN102427665A 立体的双面铝基板制作工艺 Three-dimensional double-sided aluminum plate production process
04/25/2012CN102427664A 一种线路板软板以及硬板结合的制作方法 A circuit board FPC and the production method combining hard board
04/25/2012CN102427663A 高速pcb设计信号阻抗的控制方法 The method of speed control signal impedance of pcb design
04/25/2012CN102427661A 一种印制板组件和印制板组件组装方法 One kind of printed circuit board assemblies and PCB assembly method of assembling
04/25/2012CN102427660A 一种fpc生产方法及fpc装置 One kind of fpc fpc production methods and apparatus
04/25/2012CN102424965A 金属的表面处理剂 A metal surface treatment agent
04/25/2012CN102424964A Browning conditioning fluid containing sulfydryl compound
04/25/2012CN102036486B 一种假双面板制作方法 A prosthetic double panel production methods
04/25/2012CN101959369B Method and system for burying and plugging hole on circuit board
04/25/2012CN101945540B 挠性电路板手指折叠粘合方法及专用工具 Flexible circuit board fingers folded bonding method and special tools
04/25/2012CN101911853B 立体布线板 Stereo wiring board
04/25/2012CN101795534B 一种线路板钻孔垫板 A circuit board drilling pads
04/25/2012CN101647327B Multilayered circuit board and semiconductor device
04/25/2012CN101608053B 热固化性树脂组合物 Heat-curable resin composition
04/25/2012CN101553089B 镂空双面柔性印制线路板的生产工艺 Pierced sided flexible printed circuit board production process
04/25/2012CN101540303B 抗磨损和晶须的涂覆系统和方法 Abrasion resistant coating systems and methods and whiskers
04/25/2012CN101335374B 电子标签天线过桥的连接方法 Connection method of electronic tag antenna bridge
04/24/2012US8164909 Al/AlN joint material, base plate for power module, power module, and manufacturing method of Al/AlN joint material
04/24/2012US8164186 BGA semiconductor device having a dummy bump
04/24/2012US8164175 Stackable semiconductor device assemblies
04/24/2012US8163647 Method for growing carbon nanotubes, and electronic device having structure of ohmic connection to carbon element cylindrical structure body and production method thereof
04/24/2012US8163400 Plated article having metal thin film formed by electroless plating, and manufacturing method thereof
04/24/2012US8163397 Method and apparatus for providing hermetic electrical feedthrough
04/24/2012US8163329 Method for mounting a component
04/24/2012US8162128 Component mounting apparatus, mounting-component producing method, and conveyor apparatus
04/24/2012US8161633 Method of fabricating non-planar circuit board
04/19/2012WO2012050279A1 Microphone device
04/19/2012WO2012049898A1 Module with built-in component, electronic device comprising same, and method for manufacturing module with built-in component
04/19/2012WO2012049895A1 Module with built-in component, electronic device comprising same, and method for manufacturing module with built-in component
04/19/2012WO2012049822A1 Hybrid substrate, production method therefor, and semiconductor integrated circuit package
04/19/2012WO2012049352A1 Method and arrangement for attaching a chip to a printed conductive surface
04/19/2012WO2012048771A1 Process machine, in particular for treating and/or inspecting substrates
04/19/2012WO2012048720A1 Device and method for the spray treatment of printed circuit boards or conductor sheets
04/19/2012WO2012048718A1 Electronic device having a hidden input key and method of manufacturing an electronic device
04/19/2012WO2012048596A1 Crimping device for fixing structure on printed circuit board
04/19/2012WO2012048357A1 Method and system for providing a plate-shaped object that in particular contains a plurality of circuit board elements
04/19/2012WO2012003280A3 Bumpless build-up layer package design with an interposer
04/19/2012WO2011133317A3 One part epoxy resin including a low profile additive
04/19/2012WO2011051370A3 Light signal transmitter and light receiver for an optical sensor
04/19/2012US20120092842 Encapsulated circuit device for substrates having an absorption layer, and method for the manufacture thereof
04/19/2012US20120092350 Wraparound assembly for combination touch, handwriting and fingerprint sensor
04/19/2012US20120092279 Touch sensor with force-actuated switched capacitor
04/19/2012US20120092273 Trace border routing