| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 01/19/1988 | US4719810 Drive mechanism for electrical component placement head |
| 01/19/1988 | US4719694 Installation for automatic assembly and testing of electronic card modules |
| 01/19/1988 | CA1231595A1 Apparatus and process for treating printed circuit boards |
| 01/14/1988 | WO1988000428A1 Flexible copper-clad circuit board |
| 01/14/1988 | WO1988000135A1 Potted electrical/mechanical devices, and dual cure potting method |
| 01/14/1988 | WO1988000097A1 Radiation curable temporary solder mask |
| 01/14/1988 | DE3623031A1 Mounting device for electronics printed circuit boards in microelectronics |
| 01/13/1988 | EP0252735A2 yethod of high resolution electrostatic transfer of a high density image to a nonporous and nonabsorbent conductive substrate |
| 01/13/1988 | EP0252519A1 Aluminum nitride circuit substrate |
| 01/13/1988 | EP0252518A1 Circuit substrate |
| 01/13/1988 | EP0252451A2 Substrate of hybrid ic, method of forming a circuit pattern and apparatus of forming the same |
| 01/13/1988 | EP0252410A1 The use of pyrrol containing microcapsules |
| 01/13/1988 | EP0252399A2 Method of making printed circuit boards with copper surfaces |
| 01/13/1988 | EP0252233A1 Process for improving the adhesion of non-polar photoresists to polar substrates |
| 01/13/1988 | EP0252197A1 A squeegee arrangement for silk-screen printers |
| 01/13/1988 | EP0252139A1 A process and apparatus for electroplating copper foil. |
| 01/13/1988 | EP0252115A1 Compressive pedestal for microminiature connections. |
| 01/13/1988 | CN87104005A Passive electric componet |
| 01/12/1988 | US4719495 Exposure development device for long base member |
| 01/12/1988 | US4719317 Film-type electrical element and connection wire combination and method of connection |
| 01/12/1988 | US4719145 Catalytic process and systems |
| 01/12/1988 | US4719134 Manganese-copper alloy |
| 01/12/1988 | US4718993 Carbon black |
| 01/12/1988 | US4718990 Controlling film thickness |
| 01/12/1988 | US4718972 Method of removing seed particles from circuit board substrate surface |
| 01/12/1988 | US4718863 Jumper cable having clips for solder connections |
| 01/12/1988 | CA1231464A1 Method and apparatus of forming thick film circuits |
| 01/07/1988 | EP0251923A2 On-line filtration of potassium permanganate solutions |
| 01/07/1988 | EP0251869A1 Connector for a flat connection |
| 01/07/1988 | EP0251500A1 Apparatus and methods for inspection of electrical materials and components |
| 01/07/1988 | EP0251490A2 Metal-polymer adhesion |
| 01/07/1988 | EP0251388A1 A multi-spindle drilling machine |
| 01/07/1988 | EP0251257A2 Method and device for reflow-soldering and reflow-desoldering of printed circuit boards |
| 01/07/1988 | EP0251191A2 Raised relief circuit board with soldered connections having nomenclature applied thereto |
| 01/07/1988 | EP0251187A2 Method for purifying novolak resins useful as material for coating on a semiconductor substrate |
| 01/07/1988 | EP0250867A1 Seeding process for electroless metal deposition |
| 01/07/1988 | EP0250842A2 Imaging process for forming ceramic electronic circuits |
| 01/07/1988 | EP0250736A2 Assembly for handling flexible film substrates |
| 01/07/1988 | EP0250620A1 Method and device for electrically testing printed circuits |
| 01/07/1988 | EP0250516A1 Housing for contact elements |
| 01/07/1988 | EP0250450A1 Lead finishing for a surface mount package |
| 01/07/1988 | DE3347991C2 Method and device for the continuous production of multilayer circuits |
| 01/06/1988 | CN86104394A Apparatus for positioning circuit components at predetermined positions and method therefor |
| 01/05/1988 | USH416 High capacitance flexible circuit |
| 01/05/1988 | US4717989 Heat sink, EMI shield and controller module assembly for a portable radio transceiver |
| 01/05/1988 | US4717740 Printed circuit board |
| 01/05/1988 | US4717690 Overglaze inks |
| 01/05/1988 | US4717643 Polymerized mixture of polypropylene glycol monomethacrylate, methacrylic acid, specific (meth) acrylates and isocyanatoethyl methacrylate as the binder; circuit boards |
| 01/05/1988 | US4717639 Process for preparation of a stencil or resist image |
| 01/05/1988 | US4717591 Copper lines, protective coatings, cobalt-phosphorus, dielectrics |
| 01/05/1988 | US4717587 Disintegration of metallo-organic composition ina glow discharge zone of a plasma reactor |
| 01/05/1988 | US4717460 Alkanesulfonic acid, surfactant, aromatic aldehyde, acetaldehyde, and soluble divalent salt |
| 01/05/1988 | US4717439 Process for the treatment of copper oxide in the preparation of printed circuit boards |
| 01/05/1988 | US4717438 Method of making tags |
| 01/05/1988 | US4717345 Solderless connector technique and apparatus |
| 01/05/1988 | US4717064 Wave solder finger shield apparatus |
| 01/05/1988 | US4716790 Continuously variable transmission control system responsive to passenger compartment noise or vibration |
| 01/05/1988 | CA1231001A1 Rotary screen printing methods and apparatus |
| 12/30/1987 | WO1987007998A1 Shielding device |
| 12/30/1987 | WO1987007981A1 Method for manufacture of printed circuit boards |
| 12/30/1987 | WO1987007980A1 Method for manufacture of printed circuit boards |
| 12/30/1987 | WO1987007918A1 Method for manufacture of printed circuit boards |
| 12/30/1987 | WO1987007917A1 Process for stripping tin or tin-lead alloy from copper |
| 12/29/1987 | US4716500 Probe cable assembly |
| 12/29/1987 | US4716443 Photographic image precision reproportioning system |
| 12/29/1987 | US4716442 Exposure device and exposure control method |
| 12/29/1987 | US4716259 Both-side flexible printed circuit board |
| 12/29/1987 | US4716095 Pretreatment with acid |
| 12/29/1987 | US4716049 Compressive pedestal for microminiature connections |
| 12/29/1987 | US4715941 Oxygen plasma etching of silicon-containing substance |
| 12/29/1987 | US4715940 Metallic strips with connecting bridges |
| 12/29/1987 | US4715928 Flexible printed circuits and methods of fabricating and forming plated thru-holes therein |
| 12/29/1987 | US4715900 Cleaning printed circuits |
| 12/29/1987 | US4715894 Use of immersion tin and tin alloys as a bonding medium for multilayer circuits |
| 12/29/1987 | US4715278 Squeegee arrangement for silkscreen printers |
| 12/29/1987 | US4715117 Sintered substrate with holes which dielectric and plated |
| 12/29/1987 | US4715116 Depositing copper on polished surface, heat pressurized bonding to dielectric, cooling and detaching copper from press plate |
| 12/29/1987 | US4715108 Machine tool capable of changing worn cutting tools, such as small diameter drills, with new ones |
| 12/23/1987 | EP0250366A2 Method of production of metallic structures |
| 12/23/1987 | EP0250252A1 Forming contacts on diamonds |
| 12/23/1987 | EP0250195A2 Double matte finish copper foil |
| 12/23/1987 | EP0250045A1 Method of mounting refined contact surfaces on a substrate and substrate provided with such contact surfaces |
| 12/23/1987 | EP0250006A1 Printed polymer circuit board method and apparatus |
| 12/23/1987 | EP0249834A2 Production of fine structures for the establishment of contacts on semi-conductors |
| 12/23/1987 | EP0249755A2 Hybrid integrated circuit apparatus |
| 12/23/1987 | EP0249744A1 Process for making polyimide-metal laminates |
| 12/23/1987 | EP0249688A2 Printed circuit board |
| 12/23/1987 | DE3620762A1 Electrical component of chip construction |
| 12/23/1987 | CN87103854A Photopolymerizable compositon containing carboxy benzotriazole |
| 12/23/1987 | CN87102318A Manufacturing method of flexible composite foil-coating material for printed circuits |
| 12/23/1987 | CN85107097A Pcb with socket of tv kinescope |
| 12/22/1987 | US4714726 Bismaleimide, silver powder, electron donor solvent |
| 12/22/1987 | US4714653 Metallizable substrate composites and printed circuits produced therefrom |
| 12/22/1987 | US4714646 Electrophoretic insulation of metal circuit board core |
| 12/22/1987 | US4714631 Water-soluble film, solubility accelerator, insoluble particles |
| 12/22/1987 | US4714517 Copper cleaning and passivating for tape automated bonding |
| 12/22/1987 | US4714516 Method to produce via holes in polymer dielectrics for multiple electronic circuit chip packaging |
| 12/22/1987 | US4714504 Advancing through nip of heated application rolls |
| 12/22/1987 | US4714435 Connection for flexible apparatus |
| 12/22/1987 | CA1230526A1 Mold release sheet and method of manufacture |