Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
06/1988
06/27/1988EP0145725A4 Method of and apparatus for real-time high-speed inspection of objects for identifying or recognizing known and unknown portions thereof, including defects and the like.
06/22/1988EP0272129A2 Method for production of ceramic circuit board
06/22/1988EP0271837A2 Process for conditioning a dielectric substrate for plating thereon
06/22/1988EP0271692A2 A miniature hearing aid having a multilayer circuit arrangement
06/22/1988EP0271562A1 Method for manufacture of printed circuit boards
06/22/1988EP0271559A1 Method for manufacture of printed circuit boards
06/21/1988US4752887 Routing method for use in wiring design
06/21/1988US4752756 Electrical system with at least one electric load unit being disconnectably arranged on a surface
06/21/1988US4752555 Conductor, resistor and insulating resin layers; second conductor formed by plating insulator, etching
06/21/1988US4752553 High resolution solder mask photopolymers for screen coating over circuit traces
06/21/1988US4752529 Metal interlayers in films by counter-current diffusion
06/21/1988US4752501 From decomposed tin carboxylate, masking with photoresist
06/21/1988US4752499 Fine powder of cured h eat resistant resin
06/21/1988US4752498 Method and apparatus for production of three-dimensional objects by photosolidification
06/21/1988US4752371 To be galvanized in a bath
06/21/1988US4752346 Apparatus and method for separating adherent films
06/21/1988US4752254 Electrical junction system
06/21/1988US4752244 Zero insertion force edge clip interconnect pin
06/21/1988US4752118 Electric circuits having repairable circuit lines and method of making the same
06/21/1988US4752027 Method and apparatus for solder bumping of printed circuit boards
06/21/1988CA1238443A1 Conformal coating systems
06/21/1988CA1238295A1 Method of coating ceramics and quartz crucibles with material electrically transformed into a vapor phase
06/21/1988CA1238292A1 Producing aircraft windows with electroplated masked strike coat
06/21/1988CA1238256A1 Solvent blend for removing flux residues
06/15/1988EP0271466A2 Selective catalytic activation of polymeric films
06/15/1988EP0271231A2 Locking clip
06/15/1988EP0271164A2 Tool for manufacturing a circuit pattern of an electrical circuit board by cutting of a copper plate and the circuit pattern of an electric circuit board which is suitable for work with the tool
06/15/1988EP0271163A2 Manufacturing method of electrical circuit boards
06/15/1988EP0270945A2 Photopolymerizable composition having superior adhesion, articles and processes
06/15/1988EP0270925A2 Method for temporarily sealing holes in printed circuit boards
06/15/1988EP0270820A2 Preparing the leads of a surface-mountable component
06/15/1988EP0270752A1 Substrates for integrated circuit packages
06/15/1988EP0270672A1 Flexible copper-clad circuit board
06/15/1988EP0270658A1 Process for stripping tin or tin-lead alloy from copper
06/15/1988EP0174949B1 Method and apparatus for laminating flexible printed circuits
06/14/1988US4751612 Construction for attaching a component to a substrate
06/14/1988US4751563 Microminiaturized electrical interconnection device and its method of fabrication
06/14/1988US4751492 Variable resistor
06/14/1988US4751349 Thin film integrated circuit
06/14/1988US4751199 High degree of compliance, withstanding mechanical stress by absorption
06/14/1988US4751172 Process for forming metal images
06/14/1988US4751146 Printed circuit boards
06/14/1988US4751136 Metal foil laminated to porous dielectric through water-impermeable film
06/14/1988US4751126 A method of making a circuit board and a circuit board produced thereby
06/14/1988US4751110 Radiation attenuation shielding
06/14/1988US4751106 Pretreatment by oxidation, neutralization, conditioning and etching before electroless plating
06/14/1988US4751105 Method for producing circuit boards
06/14/1988US4750976 Easily removable black metal coatings
06/14/1988US4750889 Through-board electrical component header having integral solder mask
06/14/1988US4750264 Method for fabricating an electronic circuit
06/14/1988US4750262 Method of fabricating a printed circuitry substrate
06/14/1988CA1238134A1 Conformal coating systems
06/09/1988DE3641427A1 Relay having an adapter plate for board mounting
06/09/1988DE3641353A1 Device for making contact with connections
06/09/1988DE3640441A1 Mask for photolithographically producing a structure
06/08/1988EP0270241A2 Multilayer ceramics from silicate esters
06/08/1988EP0270229A2 Platinum and rhodium catalysis of low temperature formation multilayer ceramics
06/08/1988EP0270185A2 Broadband multiple field with interconnections on a conductor plate with multiple layers in microstrip technique
06/08/1988EP0270066A2 Metal core printed circuit board as substrat for high frequency and microwave circuits
06/08/1988EP0269910A2 Laminator
06/08/1988EP0269679A1 Electrical circuit interconnection
06/08/1988EP0252941A4 Fabrication of electrical conductor by augmentation replacement process.
06/08/1988EP0040190B1 Method for metalizing holes in insulating material
06/08/1988CN87106380A Outer lead tape automated bonding system
06/07/1988US4750089 Circuit board with a chip carrier and mounting structure connected to the chip carrier
06/07/1988US4749631 Protective coatings for electronic devices
06/07/1988US4749626 Whisker resistant tin coatings and baths and methods for making such coatings
06/07/1988US4749621 Electronic components comprising polyimide-filled isolation structures
06/07/1988US4749449 Metallization utilizing a catalyst which is removed or deactivated from undesired surface areas
06/07/1988US4749421 Method for manufacturing monolithic ceramic electronic components
06/07/1988US4749368 Contact strip terminal
06/07/1988US4749120 Method of connecting a semiconductor device to a wiring board
06/07/1988US4748841 Method of producing an electric contact pin for printed circuit boards, and die for carrying out the method
06/07/1988US4748773 Biased grinding assembly
06/07/1988US4748742 Method for temporarily sealing holes in printed circuit boards
06/07/1988US4748740 Automatic component mounting machine
06/07/1988CA1237819A1 Multilayer circuit arrangement and method of manufacturing such multilayer circuit arrangement and its electric connections
06/07/1988CA1237817A1 Flexible cable assembly
06/07/1988CA1237561A1 Metallisable substrates for printed circuits, and their preparation
06/07/1988CA1237558A1 Composition and process for conditioning the surface of plastic substrates prior to metal plating
06/02/1988WO1988003962A1 Process for the chemical treatment of ceramic parts and subsequent metallization
06/02/1988WO1988003919A1 Tungsten paste for co-sintering with pure alumina and method for producing same
06/02/1988WO1988003868A1 Ceramic/organic multilayer interconnection board
06/02/1988WO1988003846A1 An improved photo-selective plating method
06/02/1988WO1988003356A3 Method and apparatus for producing a stamped substrate
06/01/1988EP0269567A2 Potentially adhesive electrically conductive composition
06/01/1988EP0269522A1 Electrical connection device, particularly for liquid-crystal displays
06/01/1988EP0269505A1 Method of manufacturing a modular connector
06/01/1988EP0269430A2 Electrical connector
06/01/1988EP0269403A2 Soldered cable transition connector
06/01/1988EP0269208A1 A process for the treatment of copper foil
06/01/1988EP0269085A2 Apparatus and method for temporarily sealing holes in printed circuit boards
06/01/1988EP0269063A2 Mullite ceramic multi-layered substrate and process for producing the same
06/01/1988EP0268971A2 Electrical interconnect support system with low dielectric constant
06/01/1988EP0268953A2 Electrical assembly
06/01/1988EP0268935A1 Vertically pluggable single-in-line circuit module
06/01/1988EP0268890A1 Pin contact
06/01/1988EP0268821A1 Method for conditioning of a substrate to be electrolessly plated
06/01/1988EP0268790A2 Process for electrochemically modifying support materials of aluminum or aluminum alloys, which have been grained in a multi-stage process and use of these materials in the manufacture of offset-printing plates
06/01/1988EP0268781A1 Additive metallic electrically conductive structure