Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
09/1988
09/13/1988US4771261 Method for achieving the electrical and mechanical interconnection of two bodies, particularly the diaphragm and the support of a thick-film pressure sensor, and devices made by this method
09/13/1988US4771236 Multilayered printed circuit board type resistor isolated tray for stress testing integrated circuits and method of making same
09/13/1988US4771159 Embedding copper powder in solder matrix for spacing
09/13/1988US4770921 Reducted noise levels; dielectrics, uniform voltage conductive pattern
09/13/1988US4770900 Process and laminate for the manufacture of through-hole plated electric printed-circuit boards
09/13/1988US4770899 Method of coating copper conductors on polyimide with a corrosion resistant metal, and module produced thereby
09/13/1988US4770897 Multilayer interconnection system for multichip high performance semiconductor packaging
09/13/1988US4770737 Film peeling apparatus
09/13/1988US4770641 Conductive gel interconnection apparatus
09/13/1988US4770599 Pick-up head for handling electric components
09/07/1988WO1988006825A1 Serpentine columnar scanning method
09/07/1988WO1988006803A1 Method for electrically isolating large area electrode bodies
09/07/1988WO1988006647A1 Production of copper-clad dielectric material
09/07/1988WO1988006494A1 Method and apparatus for production of three-dimensional objects by photosolidification
09/07/1988EP0281520A2 Separation element for trimming the width of a falling curtain
09/07/1988EP0281351A1 Printing
09/07/1988EP0281312A2 Textured polyimide film
09/07/1988EP0281278A2 Electroconductive coatings
09/07/1988EP0281031A2 Compressible temporary support for transfer layer
09/07/1988EP0280919A2 Method and apparatus for alligning a substrate for printed circuits in relation to a printing device of an engine for working printed circuit boards
09/07/1988EP0280918A2 Process for metal plating of substrates
09/07/1988EP0280822A1 Sample with coated holes and method for its preparation
09/07/1988EP0280700A1 Circuit package attachment apparatus and method.
09/06/1988US4769741 Electrical module and method for the manufacture thereof
09/06/1988US4769525 Circuit package attachment apparatus and method
09/06/1988US4769309 Electroplating to produce multilayer, interconnecting, fine line circuit boards; increasing dimensional integrity and circuit stability
09/06/1988US4769270 Substrate for a printed circuit board
09/06/1988US4769269 Dilelectric sandwiched between conductive layers forming non-circular hole; copper foils; printed circuits
09/06/1988US4769083 Method for removing excess solder from printed circuit boards
09/06/1988US4768286 Printed circuit packaging for high vibration and temperature environments
09/06/1988CA1241745A1 Magnetic bubble memory module
09/01/1988DE3805598A1 Planarer, insbesondere elektrolumineszierender anzeigenaufbau Planar, in particular electroluminescent display assembly
09/01/1988DE3705592A1 Device for the thin coating (lacquering) of disc-shaped substrates for electronic applications, for example circuit boards, Compact Discs, etc.
09/01/1988DE3705250A1 Method of fabricating an electrolessly deposited, solderable metal layer
09/01/1988DE3705106A1 Process for the production of prepregs
09/01/1988DE3705081A1 Method for measuring the solderability of through-plated holes in printed circuit boards, and a device for carrying out the method
08/1988
08/31/1988EP0280508A2 Through-board electrical component header having integral solder mask
08/31/1988EP0280502A1 Metal coated laminate products from textured polyimide film
08/31/1988EP0280449A2 Surface mount electrical connector
08/31/1988EP0280078A2 Apparatus for cleaning or for chemically treating articles
08/31/1988EP0280073A2 Circuit substrate with resistor elements
08/31/1988EP0280022A1 Process and apparatus for soldering printed-circuit boards
08/31/1988EP0279979A1 Conductive adhesive
08/31/1988EP0279881A1 Method and connection device for joining a multipole terminal and a printed-circuit board together
08/31/1988CN88100726A Focused convection reflow soldering method and apparatus
08/30/1988US4768154 Computer aided printed circuit board wiring
08/30/1988US4768004 Electrical circuit interconnect system
08/30/1988US4767936 Electronic device of element row type and wiring method of its electrode pattern
08/30/1988US4767896 Stamped circuitry assembly
08/30/1988US4767892 Printed-wiring board
08/30/1988US4767674 Metal cored board and method for manufacturing same
08/30/1988US4767665 Article formed by electroless plating
08/30/1988US4767662 Copper etching process and product
08/30/1988US4767661 Using liquid etchant
08/30/1988US4767643 Acrycated epoxy resins
08/30/1988US4767561 Azeotrope or azeotrope-like composition of trichlorotrifluoroethane, methanol and 1,2-dichloroethylene
08/30/1988US4767489 Computer aided printer-etcher
08/30/1988US4767471 Delayed reflow alloy mix solder paste
08/30/1988US4767344 Solder mounting of electrical contacts
08/30/1988US4767343 Electrical connection pin for surface-mountable electrical coils
08/30/1988US4767298 Heat staking apparatus
08/30/1988US4767189 Terminal connection structure for a liquid crystal display device
08/30/1988US4767146 Holding tongs
08/30/1988US4767104 Non-precious metal furnace with inert gas firing
08/30/1988CA1241452A1 Reduction atmosphere workpiece joining
08/30/1988CA1241402A1 Electrical contact pin for printed circuit board
08/30/1988CA1241237A1 Continuous solder processing system
08/30/1988CA1241236A1 Continuous solder system
08/25/1988WO1988006395A1 Process for manufacturing plastic pin grid arrays and the product produced thereby
08/25/1988WO1988006064A1 Electronic device fabrication by selective doping of a non-conductive polymer
08/24/1988EP0279769A2 Electrical substrate material, multilayer circuit and integrated circuit chip carrier package comprising said material
08/24/1988EP0279683A2 Semiconductor device and method of its manufacture
08/24/1988EP0279604A2 Focused convection reflow soldering method and apparatus
08/24/1988EP0279504A2 Surface treating method for polyacetal resin molded articles
08/24/1988EP0279432A2 Method of the production of a currentlessly deposited solderable metal layer
08/24/1988EP0279188A2 Enhanced plasma etching
08/24/1988EP0279147A2 Silk-screen printing apparatus with optical reading device for detecting the registration marks of a printing support on a printing plane
08/24/1988EP0279030A2 Solderable layer system
08/24/1988EP0279011A1 Multi-stage heater, in particular for soldering printed circuits
08/24/1988CN88100905A Soldering apparatus
08/23/1988US4766520 Injection molded circuit housing
08/23/1988US4766426 Display panel assembly having a plurality of film carrier tapes on each of which a semiconductor divice is mounted
08/23/1988US4766371 Test board for semiconductor packages
08/23/1988US4766325 Method for testing for faulty plated-through bores circuit boards
08/23/1988US4766268 Board for printed circuits and processes for manufacturing such printed boards
08/23/1988US4766027 Method for making a ceramic multilayer structure having internal copper conductors
08/23/1988US4766017 Process for the adhesive metallization of ceramic materials
08/23/1988US4766009 Locally irradiated area contacted with confined plating or etching solution
08/23/1988US4765860 Improved adhesive bonding strength between low-temperature plasma surface-exposed polymer and metal foil
08/23/1988US4765784 Electronic depth control for drill
08/23/1988US4765528 Plating process for an electronic part
08/23/1988EP0231363A4 Electrical circuit fabrication apparatus and method.
08/23/1988CA1241127A1 Electric circuits having repairable circuit lines and method of making the same
08/18/1988DE3703727A1 Device for mounting a component on a printed circuit board
08/17/1988EP0278870A1 Device for the mass punching of printed-circuit boards
08/17/1988EP0278741A2 Electronic component parts and method for manufacturing the same
08/17/1988EP0278517A2 Laminator
08/17/1988EP0278485A2 Process for making a digitalization board
08/17/1988EP0278484A2 Process for making a digitalization board
08/17/1988EP0278457A2 Method of coating adhesive for mounting parts onto a printed substrate and apparatus therefor
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