| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 10/11/1988 | CA1242916A1 Multilayer dry-film nagative-acting photoresist |
| 10/11/1988 | CA1242861A1 Method for embedding electrical and electronic circuitry |
| 10/06/1988 | WO1988007808A1 Mounting arrangement for a chip carrier |
| 10/06/1988 | DE3710223A1 Conductor track arrangement for an insulating plate of glass |
| 10/05/1988 | EP0285430A2 Amorphous-polypropylene-based hot melt adhesive |
| 10/05/1988 | EP0285273A2 Method of activating surface of shaped body formed of synthetic organic polymer |
| 10/05/1988 | EP0285266A2 Metal treatment |
| 10/05/1988 | EP0285127A2 Circuit substrate comprising nitride type ceramics, method for preparing it, and metallizing composition for use in it |
| 10/05/1988 | EP0285051A2 Method for bonding integrated circuit chips |
| 10/05/1988 | EP0284939A2 Finished laminates for high frequency circuits |
| 10/05/1988 | EP0284855A1 Contact device and process for connecting a conducting foil |
| 10/05/1988 | EP0284845A1 Electrical connections for the rear of printed circuits |
| 10/05/1988 | EP0284844A1 Electrical connections for the rear of printed circuits |
| 10/05/1988 | EP0284843A1 Electrical connections for the rear of printed circuits |
| 10/05/1988 | EP0284757A1 Circuit board |
| 10/05/1988 | EP0284626A1 Process for metallizing non-conductive substrates. |
| 10/05/1988 | CN87214958U New type roofing clutch gold veneer sheet for printing curcuit |
| 10/05/1988 | CN87106835A Lamination of photopolymerizable film onto substrate employing intermediate photosensitive liquid layer |
| 10/04/1988 | USRE32759 Backup material for small bore drilling |
| 10/04/1988 | US4775917 Thermal compensated circuit board interconnect apparatus and method of forming the same |
| 10/04/1988 | US4775776 Multi stage heater |
| 10/04/1988 | US4775775 Programmable electrical heater |
| 10/04/1988 | US4775611 Additive printed circuit boards with flat surface and indented primary wiring conductors |
| 10/04/1988 | US4775573 Multilayer PC board using polymer thick films |
| 10/04/1988 | US4775557 Swelling, etching, electroless deposition |
| 10/04/1988 | US4775503 Process for the manufacture of an interconnecting substrate for electronic components |
| 10/04/1988 | US4775449 Treatment of a polyimide surface to improve the adhesion of metal deposited thereon |
| 10/04/1988 | US4775444 Applying chromic acid solution to copper circuit pattern coated with adhesion promoter |
| 10/04/1988 | US4775439 Method of making high metal content circuit patterns on plastic boards |
| 10/04/1988 | US4775435 Method of manufacturing a liquid level probe |
| 10/04/1988 | US4775336 Contact insertion feature |
| 10/04/1988 | US4774763 Electrical contact with compliant mounting section |
| 10/04/1988 | US4774760 Method of making a multipad solder preform |
| 10/04/1988 | CA1242811A1 Device for the mounting of hybrid circuit substrates of printed circuit boards |
| 10/04/1988 | CA1242810A1 Surface mounted circuits including hybrid circuits, having cvd interconnects, and method of preparing the circuits |
| 09/29/1988 | DE3709222A1 Printed circuit board |
| 09/29/1988 | DE3708529A1 Cleansing module |
| 09/28/1988 | EP0284403A1 Tinning system for surface mount components |
| 09/28/1988 | EP0284151A2 Interface device for electrical connections in washing and drying machines the device having rigid plane elements and flexible printed circuits |
| 09/28/1988 | EP0283914A2 Aromatic polysulfone resin composition having excellent plating characteristics |
| 09/28/1988 | EP0283771A1 Process for producing an adhesive metal coating on plastics |
| 09/28/1988 | EP0283741A2 Thin film coating method |
| 09/28/1988 | EP0283546A1 Method for producing micromechanical components of any form from plane parallel polymer plates or via holes therein |
| 09/28/1988 | EP0283498A1 Method to produce via holes in polymer dielectrics for multiple electronic circuit chip packaging |
| 09/28/1988 | EP0283481A1 Trimming passive components buried in multilayer structures. |
| 09/28/1988 | EP0243478A4 Mass soldering system. |
| 09/28/1988 | CN87106074A Method and device for separating laminated sheets with metal coating into single plate |
| 09/27/1988 | US4774634 Shock and vibration resistant |
| 09/27/1988 | US4774633 Method for assembling an integrated circuit with raised contacts on a substrate, device thereby produced and an electronic microcircuit card incorporating said device |
| 09/27/1988 | US4774462 For printed circuit board |
| 09/27/1988 | US4774279 Primers for multilayer boards, polyvinyl acetals, phenolic resin copolymers |
| 09/27/1988 | US4774157 Patterned metal interlayer in a matrix |
| 09/27/1988 | US4774127 Flexible printed circuit |
| 09/27/1988 | US4774126 Solderable thermoplastic structure |
| 09/27/1988 | US4774122 Resinous product provided with surface coatable with metal layer bonded through an array of microdendrites and metal-clad resinous product thereof |
| 09/27/1988 | US4774029 Conductive polymers and method of preparation thereof |
| 09/27/1988 | US4773983 Electrolytic apparatus and process |
| 09/27/1988 | US4773583 Soldering device |
| 09/27/1988 | US4773582 Improved seal for desolderer tool |
| 09/22/1988 | WO1988007317A1 Solder paste replacement method and article |
| 09/22/1988 | WO1988007095A1 Electroplating apparatus |
| 09/22/1988 | WO1988006952A1 Biased grinding assembly |
| 09/22/1988 | DE3708393A1 Seal |
| 09/22/1988 | DE3708235A1 Method of fabricating conductor tracks on substrate material composed of aluminium nitride, AlN |
| 09/21/1988 | EP0283367A1 Tin soldering apparatus with an automatic wave shield for printed-circuit boards |
| 09/21/1988 | EP0283033A2 Ceramic substrate and preparation of the same |
| 09/21/1988 | EP0282646A1 Ferrite core coil with more than two coil tags for reflow soldering on a printed-circuit board |
| 09/21/1988 | EP0282638A2 Printing ink for solder resist in printed circuit board |
| 09/21/1988 | EP0282625A2 Method for producing rigid-type multilayer printed wiring board |
| 09/21/1988 | EP0282487A1 Means for use in manufacturing circuit cards and method for manufacturing the means. |
| 09/20/1988 | US4772762 Printed board |
| 09/20/1988 | US4772761 Sealed electrical components and method of making same |
| 09/20/1988 | US4772523 Gold layers next to solder layers give malleability; capacitive pressure sensors |
| 09/20/1988 | US4772496 Molded product having printed circuit board |
| 09/20/1988 | US4772488 Thick film dielectrics |
| 09/20/1988 | US4772371 Elongated subdivided cell for high-speed deposition on continuous metal strip |
| 09/20/1988 | US4772365 Method for etching materials |
| 09/20/1988 | US4772353 Apparatus for cutting photoresist webs into photoresist sheets of defined size and exact, fold-free lamination of these with flexible and rigid bases |
| 09/20/1988 | US4772349 Etching machines for manufacturing printed circuit boards |
| 09/20/1988 | US4772100 Liquid crystal display device having circuit boards extending along segment and column electrode directions |
| 09/20/1988 | US4771932 Method for soldering and desoldering electronic components |
| 09/20/1988 | US4771929 Focused convection reflow soldering method and apparatus |
| 09/20/1988 | US4771922 Automatic jumper wire feeder |
| 09/20/1988 | US4771537 Method of joining metallic components |
| 09/20/1988 | CA1242295A1 Polymer permanent flux and solder-through conformal coating |
| 09/20/1988 | CA1242253A1 Compliant lead clip |
| 09/15/1988 | DE3809268C1 Soldering apparatus for soldering in the vapour phase |
| 09/15/1988 | DE3806057A1 Dielectric paint for an integrated multilayer circuit |
| 09/15/1988 | DE3707012A1 Arrangement for connecting electrical components to contact surfaces of a contact pattern on a circuit carrier, especially for an electronic data input keyboard |
| 09/15/1988 | DE3705462A1 Method and device for simultaneously making contact with components which can be set down and have a different temperature load capacity |
| 09/14/1988 | EP0282285A2 A method of metallization for a nitride ceramic member |
| 09/14/1988 | EP0282094A2 Plasma treatment with organic vapos to promote a metal adhesion of polypropylene film |
| 09/14/1988 | EP0282078A2 Process for making an electrical-circuit board comprising a metal core and basic material for the same |
| 09/14/1988 | EP0281926A1 Plug-in mounting |
| 09/14/1988 | EP0281900A2 Removable holder and method for mounting a flexible film semiconductor chip carrier on a circuitized substrate |
| 09/14/1988 | EP0281899A2 Method and apparatus for mounting a flexible film semiconductor chip carrier on a circuitized substrate |
| 09/14/1988 | EP0281807A2 Additive technique for multilayer wirings |
| 09/14/1988 | EP0281704A2 Method and apparatus for preparing conductive screened through holes employing metalli-plated polymer thick films |
| 09/14/1988 | CN87205746U Plater for repairing printing circuit |
| 09/13/1988 | US4771366 Ceramic card assembly having enhanced power distribution and cooling |