| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 06/01/1988 | EP0268643A1 Electrical circuit interconnection |
| 06/01/1988 | EP0186667B1 Mounting semi-conductor chips |
| 06/01/1988 | EP0109402B1 Catalyst solutions for activating non-conductive substrates and electroless plating process |
| 06/01/1988 | DE3640760A1 Arrangement having electrical conductor tracks, and a method for producing the arrangement |
| 06/01/1988 | CN87106837A Lamination of photopolymerizable film onto a substrate employing an intermediate nonphotosensitive liquid layer |
| 06/01/1988 | CN87105669A Strippable common strip |
| 06/01/1988 | CN87101846A Copper base thick-film conductor and fabrication technique thereof |
| 05/31/1988 | US4748293 Flexible cable and method of manufacturing thereof |
| 05/31/1988 | US4748104 Selective metallization process and additive method for manufactured printed circuit boards |
| 05/31/1988 | US4748086 Formation of copper electrode on ceramic oxide |
| 05/31/1988 | US4748068 Synthetic resin unit |
| 05/31/1988 | US4748056 Process and composition for sensitizing articles for metallization |
| 05/31/1988 | US4747968 Low temperature cure having single component conductive adhesive |
| 05/31/1988 | US4747909 Method for manufacturing a perpendicular sidewalled metal layer on a substrate |
| 05/31/1988 | US4747533 Bonding method and apparatus |
| 05/31/1988 | US4747211 Subjecting the bore in substrate to force of vacuum applied through a vacuum diffusion barrier |
| 05/31/1988 | US4747209 Contact alignment tool |
| 05/31/1988 | CA1237536A1 Disc transfer mechanism for electrical component assembly machine |
| 05/31/1988 | CA1237535A1 Process for producing multilayer ceramic circuit board with copper |
| 05/31/1988 | CA1237533A1 Deformable integrated circuit chip carrier |
| 05/26/1988 | DE3639642A1 Verfahren zur chemischen behandlung von keramikkoerpern mit nachfolgender metallisierung Method for the chemical treatment of keramikkoerpern with subsequent metallization |
| 05/26/1988 | DE3639604A1 Method for producing solder-reinforced conductor tracks |
| 05/26/1988 | DE3639443A1 Printed circuit board and method for its production |
| 05/26/1988 | DE3638585A1 Continuous-flow drier for printed circuit boards |
| 05/25/1988 | EP0268453A1 Elongate flexible electrical contact |
| 05/25/1988 | EP0268412A1 Flexible jumper with anisotropically conductive adhesive |
| 05/25/1988 | CN85107549B Diffusion isolation layer for maskless cladding process |
| 05/24/1988 | US4747019 Feedthrough capacitor arrangement |
| 05/24/1988 | US4747017 Surface mountable integrated circuit package equipped with sockets |
| 05/24/1988 | US4746561 Polyimide-containing cover layer for a printed circuit element |
| 05/24/1988 | US4746536 Polyarylene sulfide printed circuits |
| 05/24/1988 | US4746399 Printed circuits, electrodepositing a resin, etching |
| 05/24/1988 | US4746375 Carbiding |
| 05/24/1988 | US4746300 Mounting panel for removable elements |
| 05/24/1988 | US4746198 Device for an electrically conductive connection between a liquid crystal cell and circuit board |
| 05/24/1988 | US4745684 Solder thickness measurement method and apparatus |
| 05/24/1988 | US4745682 Method of connecting coil |
| 05/24/1988 | CA1237176A1 Flexible tape having bridges of electrically conductive particles extending across the pressure sensitive adhesive layer |
| 05/24/1988 | CA1237092A1 Metallisation process for electrically insulating comformable films made from thermally stable plastics, and articles thus made |
| 05/19/1988 | WO1988003743A1 Method and apparatus for manufacturing printed circuit boards |
| 05/19/1988 | WO1988003668A1 Selective metallization process, additive method for manufacturing printed circuit boards, and composition for use therein |
| 05/19/1988 | WO1988003477A1 Sheet material coated with pressure-sensitive adhesive |
| 05/19/1988 | WO1988003443A1 Process for preparing multilayer printed circuit boards |
| 05/19/1988 | DE3738249A1 Electrical switching element for drives |
| 05/18/1988 | EP0267813A1 Multiple-beam photoplotter with drum |
| 05/18/1988 | EP0267807A2 Improved photosensitive laminate |
| 05/18/1988 | EP0267602A2 Method for producing high density multilayered glass-ceramic structures with metallic based conductors |
| 05/18/1988 | EP0267452A2 Method for the removal of resin contaminants from the drill holes of circuits boards |
| 05/18/1988 | EP0267437A2 Means and process for the removal of photo-resists |
| 05/18/1988 | EP0267392A1 The chemical synthesis of conducting polypyrrole |
| 05/18/1988 | EP0267359A2 Mask for depositing paste material |
| 05/18/1988 | CN87106576A Laser scribing system and method |
| 05/17/1988 | US4745381 Microwave connector assembly capable of being readily connected to microwave circuit components |
| 05/17/1988 | US4745296 Process for optically testing circuit boards to detect incorrect circuit patterns |
| 05/17/1988 | US4745295 Attitude detecting arrangement for detecting the length and thickness of a part using horizontally and vertically disposed line sensors |
| 05/17/1988 | US4745004 Multilayer, solders, acids, washing, rinsing |
| 05/17/1988 | US4744850 Method for bonding an LSI chip on a wiring base |
| 05/17/1988 | US4744847 Film trimming of laminated photosensitive layer |
| 05/17/1988 | US4744799 Combined sequencer and insertion machine |
| 05/17/1988 | US4744141 Apparatus for automatically inserting leads on electrical and/or electronic components into corresponding holes in a substrate |
| 05/17/1988 | US4744140 Alignment and insertion tool for connectors |
| 05/17/1988 | CA1236930A1 Method for use in brazing an interconnect pin to a metallization pattern situated on a brittle dielectric |
| 05/17/1988 | CA1236927A1 Method and apparatus for pattern forming |
| 05/17/1988 | CA1236926A1 Method and structure for effecting engineering changes in a multiple device module package |
| 05/11/1988 | EP0266877A2 Metallized substrates and process for their production |
| 05/11/1988 | EP0266535A1 Electron beam contactless testing system with grid bias switching |
| 05/11/1988 | EP0266466A2 Method of imaging resist patterns of high resolution of the surface of a conductor and a liquid toner for use in that method |
| 05/11/1988 | EP0266412A1 Surface mountable diode. |
| 05/11/1988 | EP0266397A1 High speed precision drilling system. |
| 05/11/1988 | DE3637190A1 Device and method for mounting components on electronic circuit boards |
| 05/11/1988 | DE3636817A1 Printed circuit board which is populated with components for soldering in a soldering bath |
| 05/11/1988 | CN87106448A Electron device and its manufacturing method |
| 05/10/1988 | US4743710 Coaxial interconnection boards |
| 05/10/1988 | US4743489 For mounting plurality of electronic circuit elements |
| 05/10/1988 | US4743465 Waste drawing, pastes, plugging prevention |
| 05/10/1988 | US4743463 Method for forming patterns on a substrate or support |
| 05/10/1988 | US4743325 Continuous lamination on to web; cutting in same direction and speed as movement of covering material |
| 05/10/1988 | US4743081 Contact element |
| 05/10/1988 | US4742615 Routing method and apparatus for cutting printed circuit boards |
| 05/10/1988 | EP0252977A4 Ultra high density pad array chip carrier. |
| 05/10/1988 | CA1236384A1 Dissolution of metals utilizing tungsten-diol combinations |
| 05/05/1988 | WO1988003356A2 Method and apparatus for producing a stamped substrate |
| 05/05/1988 | WO1988003181A1 Method of consistently producing copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures |
| 05/04/1988 | EP0265895A2 Method for electrolessly depositing high quality copper |
| 05/04/1988 | EP0265872A2 Simultaneously etching personality and select |
| 05/04/1988 | EP0265765A2 Method for promoting the adhesion of polymeric materials to metals |
| 05/04/1988 | EP0265631A1 Use of tapered head pin design to improve the stress distribution in the braze joint |
| 05/04/1988 | EP0265629A2 Printed circuit card fabrication process with nickel overplate |
| 05/04/1988 | EP0265613A2 Method for repair of opens in thin film lines on a substrate |
| 05/04/1988 | EP0265507A1 Flat multi-conductor power cable with two insulating layers |
| 05/03/1988 | US4742431 Flexible circuit board |
| 05/03/1988 | US4742325 Thin-film circuit and method of making the same |
| 05/03/1988 | US4742267 Polyimide film with conductive tracks |
| 05/03/1988 | US4742221 Optical coordinate position input device |
| 05/03/1988 | US4742183 Methods and techniques for fabricating foldable printed circuit boards |
| 05/03/1988 | US4741987 Photopolymerizable composition including benzotriazole carboxylic acid |
| 05/03/1988 | US4741798 For printed circuit boards |
| 05/03/1988 | US4741784 Composition and method for removing conformal coatings |
| 05/03/1988 | US4741472 Method of soldering an integrated circuit and printed circuit board |
| 05/03/1988 | US4741100 Pin retention method and apparatus |