| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 05/03/1988 | US4741090 Centering device for inserting pins in a multipin housing |
| 05/03/1988 | CA1236221A1 Method of manufacturing printed circuit boards |
| 05/03/1988 | CA1236187A1 Backplane-daughter board connector |
| 05/03/1988 | CA1236130A1 Jig apparatus for arraying and supporting works to be soldered |
| 04/27/1988 | EP0265406A2 Silkscreen printer |
| 04/27/1988 | EP0265387A2 Method of forming images |
| 04/27/1988 | EP0265367A1 Variable width ic bond pad arrangement |
| 04/27/1988 | EP0265340A2 Multilayer ceramic copper circuit board |
| 04/27/1988 | EP0265212A1 Electroconductive particles and electroconductive adhesive containing said particles |
| 04/27/1988 | EP0265161A2 Resinous product provided with surface coatable with metal layer bonded through an array of microdendrites and metal-clad resinous product thereof |
| 04/27/1988 | EP0265110A1 Transparent electrode |
| 04/27/1988 | EP0265077A2 An anisotropic adhesive for bonding electrical components |
| 04/27/1988 | EP0264939A1 Solder flux, solder paste, and soldering using solder paste |
| 04/27/1988 | EP0264840A2 Method and device for mounting electrical components on a printed-circuit board |
| 04/27/1988 | EP0264816A2 Dry lubricant drilling of thru-holes in printing circuit boards |
| 04/27/1988 | EP0264780A2 Hybrid integrated circuit device capable of being inserted into socket |
| 04/27/1988 | EP0264680A2 Laminator |
| 04/27/1988 | EP0264648A1 Method of producing a film carrier |
| 04/27/1988 | EP0264617A1 Multilayer circuit board and method of manufacture therefor |
| 04/27/1988 | EP0264569A1 Method for reducing edge curl on green sheets |
| 04/27/1988 | EP0264482A1 Method for contactless testing of integrated circuit packaging boards under atmospheric conditions |
| 04/27/1988 | EP0264481A1 Testing method for integrated circuit packaging boards using a laser in vacuum |
| 04/27/1988 | CN87107023A Method for producing multiplayer printed-wiring foard containing metal core |
| 04/27/1988 | CN87106069A Method of treating surface of molded polyacetal resin product |
| 04/27/1988 | CN86107052A Stamping ink of high fastness with addition of epoxy resin |
| 04/26/1988 | US4740830 Low temperature single step curing polyimide adhesive |
| 04/26/1988 | US4740657 Anisotropic-electroconductive adhesive composition, method for connecting circuits using the same, and connected circuit structure thus obtained |
| 04/26/1988 | US4740532 Unsaturated thiolene prepolymer, crosslinking diluent monomer, plasticizer |
| 04/26/1988 | US4740414 Ceramic/organic multilayer interconnection board |
| 04/26/1988 | US4740252 Solder paste for electronic parts |
| 04/26/1988 | US4740247 Cleaning with terpenes and surfactant mixtures |
| 04/26/1988 | US4740165 Electronic assembly including integrated circuit package and liquid crystal display panel |
| 04/26/1988 | US4740162 Lamp socket assembly |
| 04/26/1988 | US4739919 Masking of circuit boards for wave soldering |
| 04/26/1988 | US4739917 Low temperature solder coated on mounds or high temperature solder |
| 04/26/1988 | US4739780 Printed circuit board chemical in line processing system |
| 04/26/1988 | US4739550 Contact alignment tool |
| 04/26/1988 | CA1235831A1 Positive-working radiation-sensitive mixture |
| 04/26/1988 | CA1235823A1 Mass soldering method and apparatus comprising solder reflow |
| 04/26/1988 | CA1235711A1 Method for producing multilayer ceramic circuit board |
| 04/26/1988 | CA1235632A1 Modifications of the properties of metals |
| 04/21/1988 | WO1988002978A1 Multi-layer printed circuit board and a method of fabricating the same |
| 04/21/1988 | WO1988002928A1 Via filling of green ceramic tape |
| 04/21/1988 | DE3634214A1 Drive motor for an apparatus |
| 04/20/1988 | EP0264322A1 Process for mounting electronic components on a printed circuit board |
| 04/20/1988 | EP0264243A2 Method and system for multi-layer printed circuit board pre-drill processing |
| 04/20/1988 | EP0264134A2 Zirconium as an adhesion material in a multi-layer wiring substrate |
| 04/20/1988 | EP0264105A2 Method of producing multilayer printed-wiring board containing metal core |
| 04/20/1988 | EP0264088A2 Controlled atmosphere firing process |
| 04/20/1988 | EP0264057A2 Automatic focusing system for observing means for inspecting an object |
| 04/20/1988 | EP0263944A1 A method of squeegeeing solder paste onto and into a printed circuit board |
| 04/20/1988 | EP0263943A1 A method of soldering leaded and surface-mountable components to a printed circuit board |
| 04/19/1988 | US4739453 Shielding apparatus for a printed circuit board |
| 04/19/1988 | US4739449 Circuit package with thermal expansion relief chimney |
| 04/19/1988 | US4739448 Microwave multiport multilayered integrated circuit chip carrier |
| 04/19/1988 | US4739139 Miniature switch for mounting on printed circuit boards |
| 04/19/1988 | US4739125 Electric component part having lead terminals |
| 04/19/1988 | US4738900 Heat resistant dielectric layer of a polymer of an aromatic dimaleimide and an aromatic dicyanamide |
| 04/19/1988 | US4738890 Resin-impregnated base and method of manufacturing same |
| 04/19/1988 | US4738869 Photoselective electroless plating method employing UV-absorbing substrates |
| 04/19/1988 | US4738746 Etching in engraved grooves; peeling excess material |
| 04/19/1988 | US4738627 For securement to a contact pad on a circuit-bearing board |
| 04/19/1988 | CA1235545A1 Epoxy resin composition |
| 04/19/1988 | CA1235529A1 Multi-zone thermal process system utilizing nonfocused infrared panel emitters |
| 04/14/1988 | DE3731969A1 Fuse link for direct fitting to printed circuit boards |
| 04/14/1988 | DE3633418A1 Device for the electrical and mechanical connection of a conductor foil to a carrier |
| 04/13/1988 | EP0263631A2 Terminated electrical component and method |
| 04/13/1988 | EP0263277A2 A flexible electrical connection and method of making same |
| 04/13/1988 | EP0263273A2 Process of laminating |
| 04/13/1988 | EP0263222A1 Method of forming solder terminals for a pinless ceramic module |
| 04/13/1988 | EP0263221A1 Method of forming solder bumps on metal contact pads of a substrate |
| 04/12/1988 | US4737888 Receptacle assembly and mounting bracket for circuit board connections |
| 04/12/1988 | US4737747 Printed circuit resistive element |
| 04/12/1988 | US4737446 Method for making multilayer circuits using embedded catalyst receptors |
| 04/12/1988 | US4737416 Electroless plating, heat treatment in weakly oxidizing atmosphere |
| 04/12/1988 | US4737383 In vacuum |
| 04/12/1988 | US4737208 Method of fabricating multilayer structures with nonplanar surfaces |
| 04/12/1988 | US4737115 Solderable lead |
| 04/12/1988 | US4737113 Jack assembly having a unitary housing |
| 04/12/1988 | US4737112 Anisotropically conductive composite medium |
| 04/12/1988 | US4736704 Apparatus for applying solder masking to a circuit board |
| 04/12/1988 | US4736520 Process for assembling integrated circuit packages |
| 04/12/1988 | CA1235200A1 Printed circuit board terminal device |
| 04/12/1988 | CA1235199A1 Lead member and method for fixing thereof |
| 04/07/1988 | WO1988002592A1 Electrically conductive structure with applied metallization |
| 04/07/1988 | WO1988002550A1 Method to produce via holes in polymer dielectrics for multiple electronic circuit chip packaging |
| 04/07/1988 | WO1988002412A1 Process for metallizing non-conductive substrates |
| 04/07/1988 | WO1987005547A3 Solder delivery systems |
| 04/07/1988 | DE3733002A1 Electroconductive pattern metallised additively |
| 04/07/1988 | DE3633565A1 Method for fitting integrated circuits onto a substrate consisting of insulating material |
| 04/06/1988 | EP0262848A2 Method of fabricating multilayer structures with nonplanar surfaces |
| 04/06/1988 | EP0262635A2 Hot press |
| 04/06/1988 | EP0262580A2 Method of electrically bonding two objects |
| 04/06/1988 | EP0262549A1 LED retainer |
| 04/06/1988 | EP0262284A1 Connection apparatus for integrated circuit |
| 04/06/1988 | CN87104893A Printed circuit board unit |
| 04/05/1988 | US4736277 Metal printed circuit panels including mesas for coupling circuitry thereon to signal ground |
| 04/05/1988 | US4736273 Power semiconductor device for surface mounting |
| 04/05/1988 | US4736266 Printed circuit board and a circuit assembly for a radio apparatus |
| 04/05/1988 | US4736190 Sheet membrane keyboard and electronic apparatus using same |