| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 12/17/1987 | WO1987007654A1 Printed circuit board fine line plating |
| 12/17/1987 | DE3619986A1 Guillotine for cutting populated (fitted) printed circuit boards |
| 12/17/1987 | DE3615308A1 Deformation of connecting wires of air-cored coils |
| 12/16/1987 | EP0249441A2 Fixed connector for making electrical connections to surface-mount type printed board |
| 12/16/1987 | EP0249425A2 Treating laminates |
| 12/16/1987 | EP0249277A2 Passive electrical component |
| 12/16/1987 | EP0249168A2 Solder leveling method and apparatus |
| 12/16/1987 | EP0119262B1 Solder stripping solution |
| 12/16/1987 | CN87104031A Ceramic multilayer circuit board and semiconductor module |
| 12/15/1987 | US4713773 Method for distributing wire load in a multilayer package and the resulting product |
| 12/15/1987 | US4713730 Microwave plug-in signal amplifying module solderment apparatus |
| 12/15/1987 | US4713518 Electronic device manufacturing methods |
| 12/15/1987 | US4713494 Copper-nickel diffusion layer for improved adhesivity of electroconductive layers |
| 12/15/1987 | US4713298 Printed circuit boards having improved adhesion between solder mask and metal |
| 12/15/1987 | US4713284 Flame sprayed, copper foil, woven fabric prepreg |
| 12/15/1987 | US4713144 Composition and method for stripping films from printed circuit boards |
| 12/15/1987 | US4712963 Apparatus for soldering printed circuit boards |
| 12/15/1987 | US4712850 Terminal strip with attached support and method of manufacture |
| 12/15/1987 | US4712721 Solder delivery systems |
| 12/15/1987 | US4712297 Depositing a conductive material by electrolysis at predetermined positions |
| 12/15/1987 | CA1230426A1 Vibratory wave soldering of printed wiring boards |
| 12/10/1987 | DE3718546A1 Fastening device for a signal lamp |
| 12/10/1987 | DE3619342A1 Internal coating, internal alloying, internal filling of through-holes using a laser |
| 12/10/1987 | DE3618541A1 Circuit board, especially for key-operated dialling blocks |
| 12/09/1987 | EP0248683A2 Composition and process for the electrolytic coating of circuit boards without an electroless metal coating |
| 12/09/1987 | EP0248566A2 Process for controlling solder joint geometry when surface mounting a leadless integrated circuit package on a substrate |
| 12/09/1987 | EP0248521A2 Electrical contactors |
| 12/09/1987 | EP0248513A2 Method for routing |
| 12/09/1987 | EP0248314A2 Soldering of electronic components |
| 12/09/1987 | EP0248310A2 Method of making metal-polymer laminates |
| 12/09/1987 | EP0248248A2 Method for making a substantially planar construction of resin impregnated fabric |
| 12/09/1987 | EP0248029A1 Method for selectively removing adhesives from polyimide substrates. |
| 12/08/1987 | USRE32555 Solder stripping solution |
| 12/08/1987 | US4712161 Hybrid and multi-layer circuitry |
| 12/08/1987 | US4711835 Process for photolithographing a thick layer of paste deposited on a substrate |
| 12/08/1987 | US4711822 Metal core printed circuit boards |
| 12/08/1987 | US4711791 Method of making a flexible microcircuit |
| 12/08/1987 | US4711548 Assembly structure of printed circuit boards for camera |
| 12/08/1987 | US4711026 Method of making wires scribed circuit boards |
| 12/08/1987 | CA1230183A1 Pre-patterned device substrate device-attach adhesive transfer system |
| 12/08/1987 | CA1230182A1 Multilayer printed circuit board structure |
| 12/03/1987 | WO1987007471A1 Electrical circuit interconnection |
| 12/03/1987 | WO1987007470A1 Electrical circuit interconnection |
| 12/03/1987 | WO1987007196A2 Solder leveller |
| 12/03/1987 | WO1987007195A2 Solder leveller |
| 12/03/1987 | DE3639594C1 Brush machine |
| 12/03/1987 | DE3618129A1 Soldering system (installation) |
| 12/03/1987 | DE3618123A1 Multiple connection using SMD technology |
| 12/02/1987 | EP0247893A2 Flat display panel |
| 12/02/1987 | EP0247617A2 Multilayer ceramic substrate with circuit patterns |
| 12/02/1987 | EP0247575A2 Multilayer printed wiring board and method for producing the same |
| 12/02/1987 | EP0247568A2 Epoxy resin composition |
| 12/02/1987 | EP0247549A2 Photopolymerizable composition containing carboxy benzotriazole |
| 12/02/1987 | EP0247308A2 Method for automated optical inspection of printed circuits |
| 12/02/1987 | EP0247141A1 System for testing and repairing printed circuit boards. |
| 12/01/1987 | US4710961 Miniature hearing aid having a bindable multi-layered amplifier arrangement |
| 12/01/1987 | US4710895 Magnetic bubble memory module with protected terminals |
| 12/01/1987 | US4710854 Hybrid multilayer wiring board |
| 12/01/1987 | US4710852 Spring retainer for encapsulated semiconductor device |
| 12/01/1987 | US4710592 Multilayer wiring substrate with engineering change pads |
| 12/01/1987 | US4710448 Method of fabricating ultra-thin flex cables |
| 12/01/1987 | US4710419 In-mold process for fabrication of molded plastic printed circuit boards |
| 12/01/1987 | US4710403 Metallized polymers |
| 12/01/1987 | US4710401 Oxidizing ink reacts with pyrroles to form polymers |
| 12/01/1987 | US4710399 Method and mechanism to deposit solder paste upon substrates |
| 12/01/1987 | US4710395 Method and apparatus for through hole substrate printing |
| 12/01/1987 | US4710262 Photopolymerizable composition containing carboxy benzotriazole |
| 12/01/1987 | US4710253 Method for manufacturing a circuit board |
| 12/01/1987 | US4709849 Solder preform and methods employing the same |
| 12/01/1987 | US4709468 Method for producing an integrated circuit product having a polyimide film interconnection structure |
| 11/30/1987 | EP0233201A4 Method for manufacture of printed circuit boards. |
| 11/26/1987 | DE3617570A1 Device for operating a plurality of adjacent switches |
| 11/25/1987 | EP0246692A2 Surface-mounted electrical power resistor |
| 11/25/1987 | EP0246671A2 Coreless-brushless motor |
| 11/25/1987 | EP0246670A2 Method of forming interconnect sections of a coreless-brushless motor |
| 11/25/1987 | EP0246574A2 Power semiconductor device |
| 11/25/1987 | EP0246489A2 Assembly for the connection of electric and/or electronic components by soldering |
| 11/25/1987 | EP0246467A2 Photosensitive resin composition and use thereof |
| 11/25/1987 | EP0246447A2 Organic solder dam for a semiconductor device |
| 11/25/1987 | EP0246434A2 Process for treating reinforced polymer composite |
| 11/24/1987 | US4709302 Alignment apparatus for electronic device package |
| 11/24/1987 | US4709253 Surface mountable diode |
| 11/24/1987 | US4709221 Sheet coil |
| 11/24/1987 | US4708645 Machines for heating articles or products by condensing vapors on them |
| 11/24/1987 | US4708545 Method for drilling reference holes in multi-layer printed wiring board assembly |
| 11/24/1987 | US4708281 Apparatus and method for applying solder flux to a printed circuit board |
| 11/24/1987 | CA1229594A1 Photosensitive compositions of matter which are capable of undergoing condensation or addition reactions and may or may not be crosslinkable, reaction products which can be prepared therefrom and their use |
| 11/23/1987 | EP0227820A4 Treatment for copper foil. |
| 11/19/1987 | WO1987007037A1 Display device for information on lc-displays |
| 11/19/1987 | EP0246088A2 ROM mount for paging receiver and others |
| 11/19/1987 | EP0245770A2 Multilayer ceramic substrate with circuit patterns and his method for making |
| 11/19/1987 | EP0245713A1 Solder pads for use on printed circuit boards |
| 11/19/1987 | EP0245697A2 Multilayered thin film metallurgy for brazing input/output pins to a ceramic substrate |
| 11/19/1987 | EP0245677A2 A method of soldering |
| 11/19/1987 | EP0245559A2 Two component curable epoxy resin composition having a long pot life |
| 11/19/1987 | EP0245500A1 Apparatus and method for rapidly removing organic materials from films by heating in an electric field |
| 11/19/1987 | EP0245491A1 Substrate for direct mounting of integrated circuit modules |
| 11/19/1987 | EP0245434A1 Device for aligning a photomask onto a printed wiring board. |
| 11/19/1987 | EP0245387A1 Process and device for transporting printed circuit boards through drying installations |
| 11/19/1987 | EP0245305A1 Copper oxide treatment in printed circuit board |