| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) | 
|---|
| 09/22/1987 | US4695678 Electronic device carrier  | 
| 09/22/1987 | US4695527 Radiation-polymerizable composition and process for the application of markings to a printed circuit board  | 
| 09/22/1987 | US4695515 Metal cored board and method for manufacturing same  | 
| 09/22/1987 | US4695489 Electroless nickel plating composition and method  | 
| 09/22/1987 | US4695482 Method and apparatus for coating of circuit boards  | 
| 09/22/1987 | US4695404 Hyperconductive filled polymers  | 
| 09/22/1987 | US4695348 Copper etching process and product  | 
| 09/22/1987 | US4695258 Connector assembly for electrically connecting flexible and rigid printed circuits  | 
| 09/22/1987 | US4694573 Method of forming electrically conductive circuit  | 
| 09/22/1987 | US4694572 Printed polymer circuit board method  | 
| 09/22/1987 | CA1227258A1 Dual-in-line connector assembly  | 
| 09/17/1987 | DE3616897C1 Soldered connection maker for electrical and/or electronic components  | 
| 09/17/1987 | DE3608410A1 Production of fine structures for semiconductor contacts  | 
| 09/16/1987 | EP0237371A1 Manufacturing process for electrical connexions between thin conducting strips, conductive strips provided with connexion means manufactured by this process, and such a device  | 
| 09/16/1987 | EP0237185A1 Use of a photosensitive cathode for deposition of metal structures within organic polymeric films  | 
| 09/16/1987 | EP0237176A2 Connector with fine-pitched conductive passages  | 
| 09/16/1987 | EP0237151A1 Infrared process and apparatus for infrared soldering components on circuit boards  | 
| 09/16/1987 | EP0237114A2 Process for making an electrically conductive adhesive connection  | 
| 09/16/1987 | EP0237083A2 An electric device with an operation indicating lamp  | 
| 09/16/1987 | EP0236950A2 Adhesion promotion in photoresist lamination and processing  | 
| 09/16/1987 | EP0236926A1 Method of solder leveling in a circuitized substrate  | 
| 09/16/1987 | EP0236875A2 Process for determining the activity of a palladium-tin catalyst  | 
| 09/16/1987 | EP0236830A2 Base plate for electrical current circuits  | 
| 09/16/1987 | EP0236766A1 Programmable magnetic repulsion punching apparatus  | 
| 09/16/1987 | EP0236730A2 Film peeling apparatus with a sliding press element  | 
| 09/16/1987 | EP0236718A1 Electroless plating with bi-level control of dissolved oxygen  | 
| 09/16/1987 | EP0236493A1 Microelectronic package.  | 
| 09/16/1987 | EP0236483A1 Method for creating a design in relief in a hard smooth substrate and apparatus for use in the method  | 
| 09/16/1987 | EP0236410A1 Manufacture of a hybrid electronic or optical device  | 
| 09/16/1987 | EP0236404A1 Manufacture of electrical circuits.  | 
| 09/16/1987 | EP0236399A1 Press-autoclave, for example for laminating printed circuits  | 
| 09/16/1987 | CN86107586A Direct mounting of integrated circuit modules  | 
| 09/15/1987 | US4694265 Device for filtering a high-frequency conductor susceptible to electromagnetic interference of a high-frequency space  | 
| 09/15/1987 | US4694138 Applying polymer and metal to substrate, then heating to decompose polymer and weld metal  | 
| 09/15/1987 | US4694123 Backplane power connector system  | 
| 09/15/1987 | US4694121 Printed circuit board  | 
| 09/15/1987 | US4694120 Framework for components  | 
| 09/15/1987 | US4693959 Including an amino resin of melamine or hydantoin, formaldehyde and a toluenesulfonamide in the photosensitive layer  | 
| 09/15/1987 | US4693907 Process or non-electrolytic copper plating for printed circuit board  | 
| 09/15/1987 | US4693780 Electrical isolation and leveling of patterned surfaces  | 
| 09/15/1987 | US4693778 Applying and bonding insulated conductors in precise pattern  | 
| 09/15/1987 | US4693530 Shielded elastomeric electric connector  | 
| 09/15/1987 | US4693529 Elastomeric mother-daughter board electrical connector  | 
| 09/15/1987 | US4693409 Method for directly bonding ceramic and metal members and laminated body of the same  | 
| 09/15/1987 | US4693408 Apparatus for bonding connector terminals to circuit boards  | 
| 09/15/1987 | US4693209 Apparatus for dispensing solder paste  | 
| 09/15/1987 | US4693179 Temperature controlled rotary screen printing apparatus  | 
| 09/15/1987 | EP0231258A4 Surface mount compatible connector system with mechanical integrity.  | 
| 09/15/1987 | CA1226996A1 Fire-retardant photopolymers  | 
| 09/15/1987 | CA1226964A1 Wiring system employing wire mat  | 
| 09/15/1987 | CA1226963A1 Method and apparatus for cross-sectional analysis of printed circuit boards  | 
| 09/15/1987 | CA1226847A1 Metallization of ceramics  | 
| 09/15/1987 | CA1226846A1 Method for electroplating non-metallic surfaces  | 
| 09/11/1987 | WO1987005338A1 Palladium-base electroless plating solution  | 
| 09/11/1987 | WO1987005264A1 Device for forming thin film  | 
| 09/10/1987 | DE3607225A1 Electrical chip-type component and method for producing it  | 
| 09/09/1987 | EP0236125A2 Electrical connector with pin retention feature  | 
| 09/09/1987 | EP0236001A2 Method and apparatus for performing automated circuit board quality inspection  | 
| 09/09/1987 | EP0235925A2 Surface-mountable package for encapsulated tap-automated-bonded integrated circuit modules  | 
| 09/09/1987 | EP0235701A2 Process for providing a landless through-hole connection  | 
| 09/09/1987 | EP0235625A2 Repair of strip conductor on electrical circuit board  | 
| 09/09/1987 | EP0235582A2 Bonded press pad  | 
| 09/09/1987 | EP0235503A2 hermetic high frequency surface mount microelectronic package  | 
| 09/09/1987 | EP0235427A2 Multilayer ceramic bar printing and assembling apparatus  | 
| 09/09/1987 | EP0235270A1 Grinding guide and method for controlling the automatic grinding of objects  | 
| 09/09/1987 | EP0235269A1 Automatic grinding machine  | 
| 09/09/1987 | EP0101503B1 Method for high-speed production of metal-clad articles  | 
| 09/09/1987 | CN87101625A Soldering method of printed circuit board  | 
| 09/09/1987 | CN86106351A Anisotropically conductive polymeric matrix  | 
| 09/08/1987 | US4692843 Multilayer printed wiring board  | 
| 09/08/1987 | US4692387 Sintering of metal interlayers within organic polymeric films  | 
| 09/08/1987 | US4692360 Metal interlayers in films by counter-current diffusion  | 
| 09/08/1987 | US4692351 Method and apparatus for drawing a thick film circuit  | 
| 09/08/1987 | US4692225 Encapsulation  | 
| 09/08/1987 | US4692222 Printed circuit boards, agitation  | 
| 09/08/1987 | US4692221 In-situ dendritic treatment of electrodeposited foil  | 
| 09/08/1987 | US4691972 Solderless connection apparatus  | 
| 09/08/1987 | US4691971 Connector with compliant retainer  | 
| 09/08/1987 | US4691426 Repair of strip conductor on electrical circuit board  | 
| 09/08/1987 | CA1226679A1 Chip mounting device and chip carrier mounting device  | 
| 09/08/1987 | CA1226428A1 Method for the machining of composite materials  | 
| 09/03/1987 | DE3703549A1 Elongated racks and accessories for detachably mounting printed circuit boards to be electroplated, and associated printed circuit boards  | 
| 09/03/1987 | DE3600768A1 Component which is protected against polarity reversal  | 
| 09/02/1987 | EP0235025A1 Semiconductor component and encapsulation method therefor  | 
| 09/02/1987 | EP0234904A2 Systems for sensing and forming objects such as leads of electronic components  | 
| 09/02/1987 | EP0234896A2 Improved micro-electronics devices and methods of manufacturing same  | 
| 09/02/1987 | EP0234838A2 Surface mount network and method of making  | 
| 09/02/1987 | EP0234553A2 Process of laminating fotofoils on circuit boards  | 
| 09/02/1987 | EP0234487A2 Thin film circuit and method for manufacturing the same  | 
| 09/02/1987 | EP0234347A1 Electrically conductive composition and use thereof  | 
| 09/02/1987 | EP0234338A1 Thick-film multilayer dielectric composition for firing in air and nitrogen  | 
| 09/02/1987 | EP0234235A1 Contact spill  | 
| 09/02/1987 | EP0234121A2 Improvements in or relating to printing  | 
| 09/02/1987 | EP0233884A1 Device for surface mounting of components.  | 
| 09/02/1987 | EP0223830A4 Solder-bearing leads.  | 
| 09/02/1987 | EP0222878A4 Aqueous alkaline developable, uv curable urethane acrylate compounds and compositions useful for forming solder mask coatings.  | 
| 09/01/1987 | US4691339 Address code arrangements  | 
| 09/01/1987 | US4691225 Semiconductor device and a method of producing the same  | 
| 09/01/1987 | US4691091 Direct writing of conductive patterns  | 
| 09/01/1987 | US4691078 Aluminum circuit to be disconnected and method of cutting the same  |