Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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05/12/1987 | US4664945 Method of forming thick film circuits |
05/12/1987 | US4664942 Packless cementation |
05/12/1987 | US4664309 Chip mounting device |
05/12/1987 | US4664308 Mass soldering system providing an oscillating air blast |
05/12/1987 | US4663840 Method of interconnecting conductors of different layers of a multilayer printed circuit board |
05/12/1987 | US4663826 Laser radiation |
05/12/1987 | US4663815 A method and apparatus for surface mount compatible connector system with mechanical integrity |
05/07/1987 | WO1987002860A1 Surface mountable integrated circuit packages having solder bearing leads |
05/07/1987 | WO1987002857A1 Mass soldering system |
05/07/1987 | WO1987002856A1 Copper oxide treatment in printed circuit board |
05/07/1987 | WO1987002790A1 Device for aligning a photomask onto a printed wiring board |
05/07/1987 | WO1987002784A1 System for testing and repairing printed circuit boards |
05/07/1987 | WO1987002620A1 Flexible printed circuit board and process for its production |
05/07/1987 | DE3635647A1 Plasma reactor for etching printed circuit boards or the like |
05/07/1987 | DE3625183A1 Method for forming an image |
05/07/1987 | DE3539183A1 Photolithographic mask |
05/06/1987 | EP0220646A2 Separation device for plates |
05/06/1987 | EP0220541A1 Process for metallizing transparent conducting strips |
05/06/1987 | EP0220508A2 A multi-layer circuit board having a large heat dissipation |
05/06/1987 | EP0220503A2 Method and structure for effecting engineering changes in a multiple device module package |
05/06/1987 | EP0220230A1 Circuit panel without soldered connections and method of fabricating the same |
05/06/1987 | CN85107672A Equal distribution density process |
05/05/1987 | US4663695 Holding device for mounting an electronic component on a printed circuit board |
05/05/1987 | US4663497 High density printed wiring board |
05/05/1987 | US4663237 Method for embedding electrical and electronic circuitry |
05/05/1987 | US4663208 Printed circuit board and method of manufacturing same |
05/05/1987 | US4663199 Wet metallization of acrylic resin articles |
05/05/1987 | US4663192 Production of transparent electrode substrate |
05/05/1987 | US4663186 Screenable paste for use as a barrier layer on a substrate during maskless cladding |
05/05/1987 | US4663079 Copper-type conductive coating composition |
05/05/1987 | US4662999 Plating bath and method for electroplating tin and/or lead |
05/05/1987 | US4662976 For producing printed circuit boards |
05/05/1987 | US4662975 Apparatus for determining the etch rate of nonconductive materials |
05/05/1987 | US4662973 Continuous process for preparing reinforced resin laminates |
05/05/1987 | US4662963 Method of manufacturing high density encapsulated wire circuit board |
05/05/1987 | US4662944 Process and composition for sensitizing articles for metallization |
05/05/1987 | CA1221472A1 Device for applying a fixing medium to electronic components, more particularly to chip-type components |
05/05/1987 | CA1221470A1 Adaptor for changing the pitch of a contact array used with a printed circuit board testing apparatus |
04/30/1987 | DE3537829A1 Method for producing artwork, particularly for fabricating printed circuits |
04/29/1987 | EP0220121A2 A method for the preparation of a screen mesh for screen printing |
04/29/1987 | EP0219873A2 Mask for patterning electrode structures in thin film EL devices |
04/29/1987 | EP0219817A2 Shielded interconnection boards and method for making same |
04/29/1987 | EP0219815A2 Coaxial interconnection boards and process for making same |
04/29/1987 | EP0219697A2 Laser induced halogen gas etching of metal substrates |
04/29/1987 | EP0219659A1 Method for making an adhesion contact |
04/29/1987 | EP0219517A1 Thermoplastic soldering material, process and device. |
04/29/1987 | CN86107577A Process and apparatus for the production of prepegs and metal-laminated base material for circuit boards |
04/29/1987 | CN86106484A Double band press of producing laminated plastic with spreading copper |
04/29/1987 | CN85204457U Electrothermal element |
04/28/1987 | US4661887 Surface mountable integrated circuit packages having solder bearing leads |
04/28/1987 | US4661881 Overload protector for a telephone set |
04/28/1987 | US4661654 Printed circuit board |
04/28/1987 | US4661431 Method of imaging resist patterns of high resolution on the surface of a conductor |
04/28/1987 | US4661417 Acid resistance; printed circuits; adhesive strength |
04/28/1987 | US4661375 Method for increasing the height of solder bumps |
04/28/1987 | US4661372 UV-induced copper-catalyzed electroless deposition onto styrene-derivative polymer surface |
04/28/1987 | US4661192 Low cost integrated circuit bonding process |
04/28/1987 | US4661181 Method of assembly of at least two components of ceramic material each having at least one flat surface |
04/23/1987 | DE3635154A1 Device having a semiconductor component mounted on a substrate |
04/23/1987 | DE3537386A1 Component for surface mounting in a hybrid circuit |
04/23/1987 | DE3535773C1 Method for producing rigid-flexible multilayer circuits |
04/22/1987 | EP0219394A1 Method of manufacturing electrical circuit boards |
04/22/1987 | EP0219254A1 Joined ceramic-metal composite |
04/22/1987 | EP0219198A1 Surface-roughened film and sheet, and process for production and use thereof |
04/22/1987 | EP0219122A2 Metallized ceramic substrate and method of manufacturing the same |
04/22/1987 | EP0218860A2 Continuous solder paste dispenser |
04/22/1987 | EP0218832A1 Surface-mounted component and method of affixing a surface-mounted component |
04/22/1987 | CN86106553A Electric component part having lead terminals |
04/21/1987 | US4660127 Fail-safe lead configuration for polar SMD components |
04/21/1987 | US4659938 System for generating hole diameter information of printed board and the like |
04/21/1987 | US4659872 Flexible flat multiconductor cable |
04/21/1987 | US4659592 Process for the production of laminated materials |
04/21/1987 | US4659587 Electroless plating process and process for producing multilayer wiring board |
04/21/1987 | US4659585 Vapor deposition of silicon nitride |
04/21/1987 | US4659425 Continuous process for the manufacture of printed circuit boards |
04/21/1987 | US4659419 Uninterrupted cutting and sticking of continuous web |
04/21/1987 | US4659399 Containing aluminum, noncracking |
04/21/1987 | US4659378 Thin layer alloy of cobalt, iron, and germanium |
04/21/1987 | US4659157 Stamped circuitry assembly |
04/21/1987 | US4659156 Coaxial connector with circuit board mounting features |
04/21/1987 | US4659155 Backplane-daughter board connector |
04/21/1987 | US4659004 Device for attaching modular electronic components to or removing them from an insulative device |
04/21/1987 | US4659003 Heating device for generating a wave of solder in a wave soldering machine |
04/21/1987 | US4659002 Apparatus for replacement of through-hole mounted PCB components |
04/21/1987 | US4658494 Apparatus for drilling printed circuit boards |
04/21/1987 | CA1220873A1 Molded circuit board and manufacturing method therefor |
04/16/1987 | DE3536431A1 Soldering of surface mounted devices (SMDs) |
04/16/1987 | DE3536304A1 Process for tinning printed circuit boards and a device for carrying out this method |
04/15/1987 | EP0218022A2 Mounting structure for a surface-mounted-type component, and method of mounting a component of this type on a printed-circuit board |
04/15/1987 | EP0217886A1 Process for the closing up of drill holes provided for in a printed circuit board |
04/14/1987 | US4658332 Compliant layer printed circuit board |
04/14/1987 | US4658330 Mounting a hybrid circuit to a circuit board |
04/14/1987 | US4658327 Decoupling capacitor for surface mounted chip carrier |
04/14/1987 | US4658104 Printed wiring board |
04/14/1987 | US4658091 Inductor housing |
04/14/1987 | US4657842 Photosensitive compositions of matter comprising epoxide compounds and functional anthraquinones |
04/14/1987 | US4657839 Photoprinting process and apparatus for exposing paste-consistency photopolymers |
04/14/1987 | US4657833 Photosensitive cathode for deposition of metal structures within organic polymeric films |
04/14/1987 | US4657825 Electronic component using a silicon carbide substrate and a method of making it |
04/14/1987 | US4657778 Electroless deposition of a copper seed layer, resist layer, copper electroplated, screen printed then air fired dielectric |