Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
05/1987
05/12/1987US4664945 Method of forming thick film circuits
05/12/1987US4664942 Packless cementation
05/12/1987US4664309 Chip mounting device
05/12/1987US4664308 Mass soldering system providing an oscillating air blast
05/12/1987US4663840 Method of interconnecting conductors of different layers of a multilayer printed circuit board
05/12/1987US4663826 Laser radiation
05/12/1987US4663815 A method and apparatus for surface mount compatible connector system with mechanical integrity
05/07/1987WO1987002860A1 Surface mountable integrated circuit packages having solder bearing leads
05/07/1987WO1987002857A1 Mass soldering system
05/07/1987WO1987002856A1 Copper oxide treatment in printed circuit board
05/07/1987WO1987002790A1 Device for aligning a photomask onto a printed wiring board
05/07/1987WO1987002784A1 System for testing and repairing printed circuit boards
05/07/1987WO1987002620A1 Flexible printed circuit board and process for its production
05/07/1987DE3635647A1 Plasma reactor for etching printed circuit boards or the like
05/07/1987DE3625183A1 Method for forming an image
05/07/1987DE3539183A1 Photolithographic mask
05/06/1987EP0220646A2 Separation device for plates
05/06/1987EP0220541A1 Process for metallizing transparent conducting strips
05/06/1987EP0220508A2 A multi-layer circuit board having a large heat dissipation
05/06/1987EP0220503A2 Method and structure for effecting engineering changes in a multiple device module package
05/06/1987EP0220230A1 Circuit panel without soldered connections and method of fabricating the same
05/06/1987CN85107672A Equal distribution density process
05/05/1987US4663695 Holding device for mounting an electronic component on a printed circuit board
05/05/1987US4663497 High density printed wiring board
05/05/1987US4663237 Method for embedding electrical and electronic circuitry
05/05/1987US4663208 Printed circuit board and method of manufacturing same
05/05/1987US4663199 Wet metallization of acrylic resin articles
05/05/1987US4663192 Production of transparent electrode substrate
05/05/1987US4663186 Screenable paste for use as a barrier layer on a substrate during maskless cladding
05/05/1987US4663079 Copper-type conductive coating composition
05/05/1987US4662999 Plating bath and method for electroplating tin and/or lead
05/05/1987US4662976 For producing printed circuit boards
05/05/1987US4662975 Apparatus for determining the etch rate of nonconductive materials
05/05/1987US4662973 Continuous process for preparing reinforced resin laminates
05/05/1987US4662963 Method of manufacturing high density encapsulated wire circuit board
05/05/1987US4662944 Process and composition for sensitizing articles for metallization
05/05/1987CA1221472A1 Device for applying a fixing medium to electronic components, more particularly to chip-type components
05/05/1987CA1221470A1 Adaptor for changing the pitch of a contact array used with a printed circuit board testing apparatus
04/1987
04/30/1987DE3537829A1 Method for producing artwork, particularly for fabricating printed circuits
04/29/1987EP0220121A2 A method for the preparation of a screen mesh for screen printing
04/29/1987EP0219873A2 Mask for patterning electrode structures in thin film EL devices
04/29/1987EP0219817A2 Shielded interconnection boards and method for making same
04/29/1987EP0219815A2 Coaxial interconnection boards and process for making same
04/29/1987EP0219697A2 Laser induced halogen gas etching of metal substrates
04/29/1987EP0219659A1 Method for making an adhesion contact
04/29/1987EP0219517A1 Thermoplastic soldering material, process and device.
04/29/1987CN86107577A Process and apparatus for the production of prepegs and metal-laminated base material for circuit boards
04/29/1987CN86106484A Double band press of producing laminated plastic with spreading copper
04/29/1987CN85204457U Electrothermal element
04/28/1987US4661887 Surface mountable integrated circuit packages having solder bearing leads
04/28/1987US4661881 Overload protector for a telephone set
04/28/1987US4661654 Printed circuit board
04/28/1987US4661431 Method of imaging resist patterns of high resolution on the surface of a conductor
04/28/1987US4661417 Acid resistance; printed circuits; adhesive strength
04/28/1987US4661375 Method for increasing the height of solder bumps
04/28/1987US4661372 UV-induced copper-catalyzed electroless deposition onto styrene-derivative polymer surface
04/28/1987US4661192 Low cost integrated circuit bonding process
04/28/1987US4661181 Method of assembly of at least two components of ceramic material each having at least one flat surface
04/23/1987DE3635154A1 Device having a semiconductor component mounted on a substrate
04/23/1987DE3537386A1 Component for surface mounting in a hybrid circuit
04/23/1987DE3535773C1 Method for producing rigid-flexible multilayer circuits
04/22/1987EP0219394A1 Method of manufacturing electrical circuit boards
04/22/1987EP0219254A1 Joined ceramic-metal composite
04/22/1987EP0219198A1 Surface-roughened film and sheet, and process for production and use thereof
04/22/1987EP0219122A2 Metallized ceramic substrate and method of manufacturing the same
04/22/1987EP0218860A2 Continuous solder paste dispenser
04/22/1987EP0218832A1 Surface-mounted component and method of affixing a surface-mounted component
04/22/1987CN86106553A Electric component part having lead terminals
04/21/1987US4660127 Fail-safe lead configuration for polar SMD components
04/21/1987US4659938 System for generating hole diameter information of printed board and the like
04/21/1987US4659872 Flexible flat multiconductor cable
04/21/1987US4659592 Process for the production of laminated materials
04/21/1987US4659587 Electroless plating process and process for producing multilayer wiring board
04/21/1987US4659585 Vapor deposition of silicon nitride
04/21/1987US4659425 Continuous process for the manufacture of printed circuit boards
04/21/1987US4659419 Uninterrupted cutting and sticking of continuous web
04/21/1987US4659399 Containing aluminum, noncracking
04/21/1987US4659378 Thin layer alloy of cobalt, iron, and germanium
04/21/1987US4659157 Stamped circuitry assembly
04/21/1987US4659156 Coaxial connector with circuit board mounting features
04/21/1987US4659155 Backplane-daughter board connector
04/21/1987US4659004 Device for attaching modular electronic components to or removing them from an insulative device
04/21/1987US4659003 Heating device for generating a wave of solder in a wave soldering machine
04/21/1987US4659002 Apparatus for replacement of through-hole mounted PCB components
04/21/1987US4658494 Apparatus for drilling printed circuit boards
04/21/1987CA1220873A1 Molded circuit board and manufacturing method therefor
04/16/1987DE3536431A1 Soldering of surface mounted devices (SMDs)
04/16/1987DE3536304A1 Process for tinning printed circuit boards and a device for carrying out this method
04/15/1987EP0218022A2 Mounting structure for a surface-mounted-type component, and method of mounting a component of this type on a printed-circuit board
04/15/1987EP0217886A1 Process for the closing up of drill holes provided for in a printed circuit board
04/14/1987US4658332 Compliant layer printed circuit board
04/14/1987US4658330 Mounting a hybrid circuit to a circuit board
04/14/1987US4658327 Decoupling capacitor for surface mounted chip carrier
04/14/1987US4658104 Printed wiring board
04/14/1987US4658091 Inductor housing
04/14/1987US4657842 Photosensitive compositions of matter comprising epoxide compounds and functional anthraquinones
04/14/1987US4657839 Photoprinting process and apparatus for exposing paste-consistency photopolymers
04/14/1987US4657833 Photosensitive cathode for deposition of metal structures within organic polymeric films
04/14/1987US4657825 Electronic component using a silicon carbide substrate and a method of making it
04/14/1987US4657778 Electroless deposition of a copper seed layer, resist layer, copper electroplated, screen printed then air fired dielectric