Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
08/1987
08/05/1987EP0230984A2 Polyimide film having improved adhesive properties
08/05/1987EP0230936A2 Photosensitive compositions containing microgels
08/05/1987EP0230782A2 Method of applying a moistureproof insulator coating on packaged circuit boards
08/05/1987EP0230675A2 Ceramic wiring substrate and process for producing the same
08/04/1987US4685033 Multilayer wiring substrate
08/04/1987US4685030 Surface mounted circuits including hybrid circuits, having CVD interconnects, and method of preparing the circuits
08/04/1987US4685025 Conductive polymer circuit protection devices having improved electrodes
08/04/1987US4684974 Electrode connection structure of flat device
08/04/1987US4684916 Chip resistor
08/04/1987US4684594 Electrophotographic process for preparing printing forms using alkaline decoater solution
08/04/1987US4684560 Printed wiring board having carbon black-coated through holes
08/04/1987US4684545 Electroless plating with bi-level control of dissolved oxygen
08/04/1987US4684544 Solder fluxing method and apparatus
08/04/1987US4684543 Starting mixture for an insulating composition comprising a lead glass, silk-screening ink comprising such a mixture, and the use of said ink for the protection of hybrid microcircuits on ceramic substrates
08/04/1987US4684446 Increasing electroconductivity
08/04/1987US4684437 Selective metal etching in metal/polymer structures
08/04/1987US4684436 Method of simultaneously etching personality and select
08/04/1987US4684093 Fixation device for electronic display
08/04/1987US4684056 Vibratory wave soldering
08/04/1987US4684055 Method of selectively soldering the underside of a substrate having leads
08/04/1987US4684054 Automatic soldering apparatus and method of using the flux to heat the circuit board
08/04/1987US4683789 Method and apparatus for separating printed circuit boards from multi-board panels
08/04/1987US4683653 Method for producing a multilayer printed-circuit board
08/04/1987US4683652 Printed circuit repair process
08/04/1987CA1225163A1 Method and apparatus for laminating flexible printed circuits
08/04/1987CA1224957A1 Method for depositing a metal on a surface
07/1987
07/30/1987WO1987004584A1 Installation for coating and drying both sides of printed circuit boards or similar structures
07/30/1987WO1987004451A1 Process for regenerating solder stripping solutions
07/30/1987DE3644243A1 Agent for controlling the incipient etching of tin-lead alloys
07/29/1987EP0230128A2 Method of producing on a polymeric substrate conductive patterns
07/29/1987EP0229931A1 Apparatus for fitting a rotary member onto a rotary shaft
07/29/1987EP0229915A1 Process for the highly adhesive metallization of ceramic materials
07/29/1987EP0229850A1 Connection terminals between substrates and method of producing the same
07/29/1987EP0229842A1 Laminator
07/28/1987US4683075 Degreasing solvents, cleaning solder flux from printed circuits
07/28/1987US4683036 Method for electroplating non-metallic surfaces
07/28/1987US4682828 Bus bar bridged pc board for transitional termination of multiple cables and method
07/28/1987US4682723 Mask for wave soldering machine
07/28/1987US4682415 Method of making printed circuits
07/28/1987US4682414 Multi-layer circuitry
07/28/1987CA1224884A1 Method of producing multilayer circuit boards, a fixed layered structure produced by this method, and the use of this layered structure in this production method
07/28/1987CA1224664A1 Process for the production of images
07/22/1987EP0229553A1 Process for manufacturing and applying strain gauges and strain gauges obtained especially during this process
07/22/1987EP0229503A2 Dual printed circuit board module
07/22/1987EP0229344A1 Method for selective chemical plating
07/22/1987EP0229256A2 Fabrication-complex for the automated assembly and testing of flat electronic component assemblies
07/22/1987EP0229159A1 Method for producing enhanced bonds between surfaces and articles produced by the method.
07/21/1987US4682277 Movable light source type exposure apparatus
07/21/1987US4682271 Printed circuit board and method for fabrication thereof
07/21/1987US4682270 Integrated circuit chip carrier
07/21/1987US4682269 Heat dissipation for electronic components on a ceramic substrate
07/21/1987US4682207 On a printed circuit board
07/21/1987US4682040 Image pickup apparatus for a printed wiring board
07/21/1987US4682001 Multi-lead laser soldering apparatus
07/21/1987US4681774 Sensitization
07/21/1987US4681670 Bath and process for plating tin-lead alloys
07/21/1987US4681656 IC carrier system
07/21/1987US4681655 Masking and etching an anodized aluminum support
07/21/1987US4681654 Polyimide windows
07/21/1987US4681649 Multi-layer printed circuit board vacuum lamination method
07/21/1987US4681630 Method of making copper colloid for activating insulating surfaces
07/21/1987US4681453 Optoelectronic comparison apparatus for structures on plane surfaces or for planar structures
07/21/1987US4680897 Method for machining holes in composite materials
07/21/1987US4680855 Electronic device manufacturing methods
07/21/1987CA1224576A1 Solder interconnection structure for joining semiconductor devices to substrates that have improved fatigue life, and process for making
07/16/1987WO1987004317A1 Portable radio transceiver housing structurally supported by an integral battery
07/16/1987WO1987004316A1 Ultra high density pad array chip carrier
07/16/1987WO1987004315A1 Transfer material for printed circuit board and printed circuit board prepared using said transfer material and process for preparation thereof
07/16/1987WO1987004190A1 Fabrication of electrical conductor by augmentation replacement process
07/16/1987WO1987001827A3 Method for creating a design in relief in a hard smooth substrate and apparatus for use in the method
07/15/1987EP0228791A2 Materials for use in forming electronic interconnect
07/15/1987EP0228694A2 Process using combination of laser etching and another etchant in formation of conductive through-holes in a dielectric layer
07/15/1987EP0228664A1 Copper deposition from electroless plating bath
07/15/1987EP0228454A1 Compositions and methods for printed circuit board and/or printed wiring board cleaning and soldermask testing.
07/15/1987CN86107270A Device for positioning optical mask onto printed-circuit boards
07/14/1987US4680675 Printed circuit board terminal device
07/14/1987US4680627 Apparatus for checking patterns on printed circuit boards
07/14/1987US4680568 Electrical component having fuse element, and method of using same
07/14/1987US4680368 Ultraviolet curable ink composition
07/14/1987US4680249 Photopolymerizable composition containing carboxy benzotriazole
07/14/1987US4680244 Light-sensitive recording material for the production of a printing form or printed circuit with photoconductive layer and light-sensitive overlayer
07/14/1987US4680226 Heat sensitive type adhesive connector
07/14/1987US4680141 Thickener, flux
07/14/1987US4680079 Continuous lamination of baseboards
07/14/1987US4679889 Solder-bearing leads
07/14/1987US4679868 Multiconductor electrical cable terminations and methods and apparatus for making same
07/14/1987US4679723 Method of soldering the outer sleeve of a coaxial cable connector to a housing
07/14/1987US4679720 Mass soldering system providing a sweeping fluid blast
07/14/1987US4679321 Method for making coaxial interconnection boards
07/14/1987US4679320 Process for producing multilayer ceramic circuit board with copper
07/14/1987US4679318 Application tool and method for positioning electrical sockets on circuit boards for surface soldering
07/14/1987CA1224276A1 Process for producing printed circuits
07/14/1987CA1224051A1 Electronic circuit board for a timepiece
07/09/1987DE3640866A1 Membrane switch (diaphragm switch)
07/08/1987EP0228332A2 Automatic test system having a "true tester-per-pin" architecture
07/08/1987EP0228122A2 Fail-safe lead configuration for polar SMD components
07/08/1987EP0228119A1 Centering device for the realization of the pin insertion of a multipin case
07/08/1987EP0228017A2 Metal net
07/08/1987EP0227903A2 A method of etching through a metal layer in a metal/polymer layered structure
07/08/1987EP0227857A1 Process for making printed circuits