Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
02/1988
02/16/1988US4725716 Infrared apparatus for infrared soldering components on circuit boards
02/16/1988US4725692 Electronic device and lead frame used thereon
02/16/1988US4725504 Metal coated laminate products made from textured polyimide film
02/16/1988US4725478 Heating a curable ink on a heat shrinkable substrate
02/16/1988US4725374 Peroxydisulfuric acid and halide
02/16/1988US4725333 Metal-glass laminate and process for producing same
02/16/1988US4724856 Dynamic flood conveyor
02/16/1988CA1232978A1 Process for minimizing distortion in multilayer ceramic substrates
02/16/1988CA1232973A1 System for contact printing with liquid photopolymers
02/16/1988CA1232972A1 Equal density distribution process
02/16/1988CA1232971A1 Metal cored board and method for manufacturing same
02/16/1988CA1232864A1 Poly(arylene sulfide) printed circuit boards
02/11/1988WO1988000988A1 Method for manufacture of printed circuit boards
02/11/1988WO1987007196A3 Solder leveller
02/11/1988DE3626708A1 Method for producing printed circuit boards
02/10/1988EP0255607A2 Laminate for rigid-flexible printed circuit boards
02/10/1988EP0255557A2 Process for forming metal images
02/09/1988US4724514 Low cost compressively clamped circuit and heat sink assembly
02/09/1988US4724473 Micropackage for encapsulating an electronic component
02/09/1988US4724472 Semiconductor device
02/09/1988US4724465 Photofabrication using laser light to expose photoresist
02/09/1988US4724283 Stacks of aluminum nitride and wiring layers of aluminum nitride and refractory metal
02/09/1988US4724280 Package for integrated circuit
02/09/1988US4724182 Low surface roughness, accuracy
02/09/1988US4724040 Method for producing electric circuits on a base boad
02/09/1988US4724026 Process for selective transfer of metallic foils to xerographic images
02/09/1988US4724021 Applying and firing two different layers of dispersed dielectric solid and glass particles
02/09/1988US4724005 Electroplating conductive metal layers
02/09/1988US4723368 Display mounting arrangement
02/09/1988CA1232497A1 Stripped gold plating process
02/08/1988EP0198053A4 Injection molded multi-layer circuit board and method of making same.
02/04/1988DE3725143A1 Device for delivering a predetermined volume of a pasty fluid
02/04/1988DE3633907A1 Method for firmly bonding a copper body to a substrate
02/04/1988DE3625475A1 Electroplating apparatus for plate-like workpieces, in particular printed circuit boards
02/04/1988DE3624739A1 Switching device, especially for a projectile
02/03/1988EP0255129A2 Film peeling apparatus
02/03/1988EP0255073A1 Circuit device and resonance tag and method of making the same
02/03/1988EP0255063A2 Controlling resistivity of plated metal
02/03/1988EP0255012A2 Process for modifying the adhesion of electroless metal coatings or plastic materials
02/03/1988EP0254962A1 Apparatus for electroplating platelike articles, particularly circuit boards
02/03/1988EP0254961A1 Treatment apparatus, particularly for printed-circuit boards moving horizontally
02/03/1988EP0254948A2 Microelectronic device and thick film hybrid circuit
02/03/1988EP0254901A2 Lamination method and apparatus
02/02/1988US4723062 Hydrogen containing silicon nitride film over area to be cut with a laser beam
02/02/1988US4722960 Aluminum filled compositions
02/02/1988US4722765 Separating oxide layer for removal of carrier for reuse
02/02/1988US4722629 Adaptor for electronic element stick
02/02/1988US4722470 Method and transfer plate for applying solder to component leads
02/02/1988CA1232104A1 Electroless nickel initiator solution and process for rejuvenation
01/1988
01/28/1988WO1988000624A1 Azeotrope-like compositions of trichlorotrifluoroethane, methanol, nitromethane, acetone, and methyl acetate
01/28/1988DE3724703A1 Entkopplungskondensator fuer schaltkreisbausteine mit rasterfoermigen kontaktstiftanordnungen und daraus bestehende entkopplungsanordnungen Decoupling capacitor for circuit-blocks with rasterfoermigen-pin arrangements and existing arrangements resulting decoupling
01/28/1988DE3624727A1 Method for producing multilayer printed circuit boards, and boards produced in accordance with the method
01/28/1988DE3624412A1 Method for soldering a component as well as a printed circuit board having such a component
01/27/1988EP0254238A2 Porous bottom-layer dielectric composite structure
01/27/1988EP0254201A1 Method of metallizing ceramic substrates
01/27/1988EP0254200A1 Method for detecting defective plated-through holes in printed circuit boards
01/27/1988EP0254082A2 Multilayer printed circuit board having rigid and flexible parts
01/27/1988EP0254070A2 Electrical device
01/27/1988EP0254056A1 Longitudinally elongated racks with holding clamps for removably mounting circuit boards
01/27/1988EP0254030A1 Device for the electrolytic treatment of platelike articles
01/27/1988EP0253892A1 Transfer material for printed circuit board and printed circuit board prepared using said transfer material and process for preparation thereof
01/27/1988EP0253833A1 Multilayer printed circuit board.
01/27/1988CN87104516A Raised relief circuit board with soldered connections having nomenclature applied thereto
01/27/1988CN86105392A Method for mfg. printed circuit boards
01/26/1988US4722027 Hybrid circuit device
01/26/1988US4721980 Transfer type each-side exposure apparatus
01/26/1988US4721661 Selectively removing unwanted magnetic toner from magnetic member to provide uniform high resolution image
01/26/1988US4721550 Process for producing printed circuit board having improved adhesion
01/26/1988US4721549 Method and apparatus for treating at least one ceramic object in an alkali hydroxide melt
01/26/1988US4721472 Fixed connector for making electrical connections to surface-mount type printed board
01/26/1988US4721365 Electronic device including panels with electrical alignment means
01/26/1988US4720916 Process for producing protective envelopes in which corresponding electric-electronic circuit components are dipped
01/26/1988US4720915 Printed circuit board and process for its manufacture
01/26/1988US4720914 Method for forming thick film circuit using rotatable nozzle having wide discharge hole
01/26/1988CA1232081A1 Two layer circuit board with screening foil
01/21/1988DE3722749A1 Verfahren zur herstellung einer gedruckten leiterplatte A process for producing a printed circuit board
01/21/1988DE3635448C1 Method and device for reflow soldering of electronic components on printed circuit boards, conforming with SMD technology
01/21/1988DE3623906A1 Hearing aid
01/21/1988DE3623093A1 Method for producing through-connections in printed circuit boards or multilayer printed circuit boards having inorganic or organic/inorganic insulating layers
01/20/1988EP0253394A1 Apparatus for current supply to horizontally transported material for galvanizing
01/20/1988EP0253343A1 Glass cermic dielectric compositions
01/20/1988EP0253341A1 Glass ceramic dielectric compositions
01/20/1988EP0253244A1 Method of fabrication of illuminating panels containing electroluminescent diodes (LED) and traffic sign obtained with this method
01/20/1988EP0253237A2 Process of photoetching of superficial coatings based on polymeric materials
01/20/1988EP0253129A2 Photoplotting method and photoplotter for film exposure
01/20/1988EP0252977A1 Ultra high density pad array chip carrier
01/20/1988EP0252941A1 Fabrication of electrical conductor by augmentation replacement process
01/20/1988CN87103276A Metallized polymers
01/19/1988US4720798 Process for use in rapidly producing printed circuit boards using a computer controlled plotter
01/19/1988US4720740 Electronic device including uniaxial conductive adhesive and method of making same
01/19/1988US4720617 Apparatus for continuous processing in the directions of x- and y-coordinates
01/19/1988US4720470 Method of making electrical circuitry
01/19/1988US4720402 Method for dispensing viscous material
01/19/1988US4720401 Enhanced adhesion between metals and polymers
01/19/1988US4720324 Process for manufacturing printed circuit boards
01/19/1988US4720322 Plasma etching of blind vias in printed wiring board dielectric
01/19/1988US4720315 Method for preparing a selectively decorated resin film
01/19/1988US4720035 Method of reflow bonding electronic parts on printed circuit board and apparatus used therefor
01/19/1988US4720034 Apparatus and method of solder coating integrated circuit leads
01/19/1988US4719962 Method for selectively forming at least one coating strip consisting of a metal or alloy on a substrate consisting of another metal