Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
10/1987
10/20/1987US4701352 Adhesion promoting with alkali metal compounds
10/20/1987US4701351 Thin polymer layer complexes with noble metals; improves adhesion, consistency
10/20/1987US4701350 Pretreatment with polyelectrolyte adsorption modifier
10/20/1987US4701300 Polyamide ester photoresist formulations of enhanced sensitivity
10/20/1987US4701279 Anisotropically electroconductive adhesives
10/20/1987US4701244 Containing benzaldehyde, benzalacetone and/or aromatic pyridine compounds
10/20/1987US4700880 Process for manufacturing electrical equipment utilizing printed circuit boards
10/20/1987US4700878 Soldering apparatus
10/20/1987US4700488 Arrangement for aligning a printed circuit substrate in a printing machine
10/20/1987US4700474 Apparatus and method for temporarily sealing holes in printed circuit boards
10/20/1987US4700473 Method of making an ultra high density pad array chip carrier
10/20/1987CA1228267A1 Process for pretreating polyamide substrates for electroless metallisation
10/15/1987DE3612395A1 Dryer
10/15/1987DE3612269A1 Method for fitting a connecting conductor to the connecting contact of a photovoltaic solar cell
10/14/1987EP0241423A2 Process for the production of positive images
10/14/1987EP0241331A1 Process for making an electrically conductive pattern on the non-developable surface of an insulating substrate and device obtained
10/14/1987EP0241154A2 Automatic soldering device
10/14/1987EP0241088A1 Soldering device
10/14/1987EP0240785A1 Holding pliers
10/14/1987EP0240746A2 Metal layers for use in electronic circuit interconnection system
10/14/1987EP0240710A2 Near-linear spring connect structure for flexible interconnect circuits
10/14/1987EP0240654A1 Copper conductor compositions
10/14/1987EP0240528A1 Method and device for cleaning and drying electronic printed circuits
10/13/1987US4700276 Ultra high density pad array chip carrier
10/13/1987US4700214 Electrical circuitry
10/13/1987US4700044 Laser soldering apparatus and method
10/13/1987US4700016 Printed circuit board with vias at fixed and selectable locations
10/13/1987US4699867 Radiation-sensitive positive working composition and material with aqueous-alkaline soluble acryamide or methacryamide copolymer having hydroxyl or carboxyl groups
10/13/1987US4699827 Electric device provided with a silk-screening dielectric coated conductive laminate
10/13/1987US4699811 Chromium mask for electroless nickel or copper plating
10/13/1987US4699803 Method for forming electrical components comprising cured vinyl and/or acetylene terminated copolymers
10/13/1987US4699802 Moisture, uv rad curable poly dimethylsiloxane terminated with acrylate or methacrylate silanol components
10/13/1987US4699697 High-purity palladium-nickel alloy plating solution and process
10/13/1987US4699081 Means for detecting and adjusting metal salt concentration in an electroless plating bath
10/13/1987US4698907 Method for manufacturing a circuit board by a direct electrostatic transfer and deposition process
10/13/1987CA1228174A2 Wave soldering machine
10/08/1987EP0229159A4 Method for producing enhanced bonds between surfaces and articles produced by the method.
10/08/1987DE3611224A1 Production method of a combination part, consisting of plastic, with an insertion part
10/08/1987DE3610978A1 Seal
10/08/1987DE3610886A1 Fuse having a fuse body which is constructed as a printed circuit board
10/08/1987DE3610676A1 Fuse of an electronic controller
10/07/1987EP0240268A1 Process for metallizing glass surface
10/07/1987EP0240039A1 Solder carrier
10/07/1987EP0239839A1 Electrophoretic insulation of metal circuit board core
10/07/1987EP0239736A1 Elongate racks for the detachable attachment of circuit boards to be galvanized, and associated circuit boards and parts
10/06/1987US4698774 Method of and apparatus for controlling automatic soldering system
10/06/1987US4698660 Resin-molded semiconductor device
10/06/1987US4698294 Lamination of photopolymerizable film onto a substrate employing an intermediate nonphotosensitive liquid layer
10/06/1987US4698293 Process for forming positive tonable images using a photosensitive material containing at least 1,4-dihydropyridine
10/06/1987US4698284 Device for aligning a photomask onto a printed wiring board
10/06/1987US4698275 Phenolic resin adhesive layer
10/06/1987US4698240 Applying fluoropolymer dissolved in noncombustible low boiling orgainc solvent
10/06/1987US4698192 Applying ceramic slurry to endless belt, drying, printing conductive paste, repeating
10/06/1987US4698125 Method of producing a layered structure
10/06/1987US4698124 Oxidizing with inorganic chlorates, hypochlorites, peroxydisulfates
10/06/1987US4698026 Terminal connection pin for solderless connections
10/06/1987US4697964 Boring machine
10/06/1987US4697923 Method for visual inspection of multilayer printed circuit boards
10/06/1987US4697885 Layers of low and high conductive material and resin; wet or dry transfer mounting
10/06/1987US4697865 Edge clip and terminal
10/06/1987US4697335 Applying film pattern to backing, dissolving and transferring
10/06/1987EP0227746A4 Process for conditioning the surface of plastic substrates prior to metal plating.
10/06/1987CA1227767A1 Pickling, drying and metal coating carbonamide polymer prior to galvanic metal deposition
10/06/1987CA1227699A1 Electroformed charge plate for ink jet printers
09/1987
09/30/1987EP0239494A1 Integrated circuit housing
09/30/1987EP0239434A1 Serial thermal writing head for a printer
09/30/1987EP0239197A2 Process for producing a metallic pattern
09/30/1987EP0239158A2 Circuit board for printed circuits, and method of making such a board
09/30/1987EP0239033A1 Circuit supporting plate for laboratory purposes and process for its manufacture
09/30/1987EP0239017A2 Method for visual inspection of multilayer printed circuit boards
09/30/1987EP0238929A2 Process for providing circuit lines on a substrate
09/30/1987EP0238915A1 Connection and circuit arrangement
09/29/1987US4697204 Leadless chip carrier and process for fabrication of same
09/29/1987US4697001 Chemical synthesis of conducting polypyrrole
09/29/1987US4697000 Precipitation with oxidizers
09/29/1987US4696885 Method of forming a large surface area integrated circuit
09/29/1987US4696861 Improved adhesion, heat resistance
09/29/1987US4696851 Hybrid and multi-layer circuitry
09/29/1987US4696835 Polypyrroles, multilayer
09/29/1987US4696764 Electrically conductive adhesive composition
09/29/1987US4696105 Mounting method for electrical components having connections both on and off a circuit board
09/29/1987US4696104 Method and apparatus for placing and electrically connecting components on a printed circuit board
09/29/1987US4696101 Method and apparatus for placing and electrically connecting components on a printed circuit board
09/29/1987CA1227579A1 Electrically conductive adhesive sheet, circuit board and electrical connection structure using the same
09/24/1987WO1987005557A1 Lamination of sheet materials
09/24/1987WO1987005547A2 Solder delivery systems
09/24/1987WO1987005538A1 A system for the treatment of edge supported substrates
09/24/1987DE3610036A1 Kontaktieren von mikroelektronischen schaltungen Contact of microelectronic circuits
09/23/1987EP0238282A2 Hybrid IC device and method for manufacturing same
09/23/1987EP0238267A2 Printed circuit board capable of preventing electromagnetic interference
09/23/1987EP0238192A2 Circuit testers
09/23/1987EP0238161A2 A backup sheet for backing a worksheet during a small bore drilling process
09/23/1987EP0238118A2 Process for making metallized holes in a substrate having conductive and resistive paths and the product obtained by said process
09/23/1987EP0238017A2 Electrical device with at least one electrical consumer unit disposed on and removable from a surface
09/23/1987EP0237851A2 Method for contacting microelectric circuits
09/23/1987EP0237838A2 Film peeling apparatus having fluid injection device
09/23/1987EP0237808A2 Multilayered interposer board for powering high current chip modules
09/23/1987CN86105116A Multilayer ceramic bar printing and assembling apparatus
09/22/1987US4695927 Package for a surface mountable component
09/22/1987US4695926 Encapsulation and insulation of electronic circuit board structures