Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
07/1987
07/08/1987EP0227820A1 Treatment for copper foil.
07/08/1987EP0227746A1 Process for conditioning the surface of plastic substrates prior to metal plating
07/07/1987USH307 High "g" electronics system
07/07/1987US4679122 Metal core printed circuit board
07/07/1987US4678683 Process for cofiring structure comprised of ceramic substrate and refractory metal metallization
07/07/1987US4678552 Alkanesulfonic acid electrolyte
07/07/1987US4678545 Printed circuit board fine line plating
07/07/1987US4678531 Method and apparatus for screen printing solder paste onto a substrate with device premounted thereon
07/07/1987US4678250 Multi-pin electrical header
07/07/1987US4678169 Printed circuit board holder
07/06/1987EP0215024A4 Solder-bearing terminal.
07/02/1987WO1987004041A1 Housing for contact elements
07/02/1987WO1987004040A1 Multilayer printed circuit board
07/02/1987WO1987004009A1 Compressive pedestal for microminiature connections
07/02/1987WO1987004008A1 Lead finishing for a surface mount package
07/02/1987WO1987003915A1 A process and apparatus for electroplating copper foil
07/02/1987DE3546196A1 Printed circuit board, particularly for push-button dial blocks, and method of manufacturing such a printed circuit board
07/01/1987EP0227371A1 Ceramic substrates and methods of manufacturing same
07/01/1987EP0227066A1 A method of joining metallic components
07/01/1987EP0227002A1 Heat activatable adhesives for wire scribed circuit boards
07/01/1987EP0226904A2 Printed circuit, in particular for keyboards, and method for manufacturing such a printed circuit
07/01/1987EP0226620A1 Method of manufacturing printed circuit boards.
06/1987
06/30/1987US4677530 Printed circuit board and electric circuit assembly
06/30/1987US4677458 Ceramic IC package attachment apparatus
06/30/1987US4677303 Automatic printed circuit board imaging system
06/30/1987US4677254 Process for minimizing distortion in multilayer ceramic substrates and the intermediate unsintered green ceramic substrate produced thereby
06/30/1987US4676865 Plasma desmear/etchback system and method of use
06/30/1987US4676862 Heated rollers with adjustable nip and torsion tube; for printed circuits
06/30/1987US4676857 Method of making microwave heating material
06/30/1987US4676854 Adhesive layer by electrodepositing a high molecular weight resin
06/30/1987US4676566 Shunt connecting apparatus
06/30/1987US4676564 Access device unit for installed pin grid array
06/30/1987US4676426 Solder leveling technique
06/30/1987US4675989 Method of making an electrical circuit package
06/25/1987DE3545258A1 Method for producing circuits using thin-film technology
06/25/1987DE3545159A1 Process for producing basic materials having an optimised range of properties
06/25/1987DE3545074A1 Circuit for display and information purposes
06/25/1987DE3544736A1 Process and appliance for fabricating an electrooptical cell
06/24/1987EP0226433A2 High density printed wiring board
06/24/1987EP0226399A2 Process for preparation of a stencil or resist image
06/24/1987EP0226316A1 Multilayer wiring substrate
06/24/1987EP0226276A2 Electrical connection assembly for interconnecting a flexible circuit and another circuit means
06/24/1987EP0226193A1 Process for the adhesion of poly-P-xylylene to substrates and manufactured articles
06/24/1987EP0226050A1 Method for mounting an IC on a substrate
06/24/1987EP0225985A1 Method of making a printed circuit board
06/24/1987EP0225927A1 Method and device for boring films for film pasting apparatuses
06/23/1987US4675790 Three terminal electrolytic capacitor for surface mounting
06/23/1987US4675789 High density multilayer printed circuit board
06/23/1987US4675788 Multi-layer circuit board
06/23/1987US4675786 Flexible circuit board and method of making the same
06/23/1987US4675784 Printed circuit board
06/23/1987US4675346 Modified polysiloxane, fumed silica filler and photoinititato r
06/23/1987US4675243 Ceramic package for semiconductor devices
06/23/1987US4674182 Method for producing printed wiring board with flexible auxiliary board
06/23/1987US4674161 Connection method for piezo-electric acoustic transducers in electro-acoustic capsules
06/23/1987CA1223157A1 Method for controlling plating rate in an electroless plating system
06/23/1987CA1223118A1 Dielectric glass in multilayer circuits and thick- film circuits comprising same
06/19/1987DE3544631A1 Guide for film plugs
06/19/1987DE3544533A1 Relay with installation-simplifying retention on a board
06/18/1987WO1987003773A1 Method for selectively removing adhesives from polyimide substrates
06/18/1987WO1987003684A1 Method for fabricating and applying strain gauges, and strain gauges obtained particularly with such method
06/17/1987CN86108679A Circuit element mounting system
06/16/1987US4674008 Display element attachment holder
06/16/1987US4674007 Method and apparatus for facilitating production of electronic circuit boards
06/16/1987US4674006 Contact array assembly for a computer-controlled printed circuit board testing apparatus
06/16/1987US4673967 Surface mounted system for leaded semiconductor devices
06/16/1987US4673904 Micro-coaxial substrate
06/16/1987US4673773 Multilayer printed circuit board
06/16/1987US4673772 Electronic circuit device and method of producing the same
06/16/1987US4673660 Sintered oxide dielectric body of batium, tin, boron, titanium, silicon and manganese oxides
06/16/1987US4673521 Process for regenerating solder stripping solutions
06/16/1987US4673458 Method for preparing a printed circuit board
06/16/1987US4672914 System for the treatment of edge supported substrates
06/16/1987US4672872 Cutting device with a heated cutting wire
06/16/1987US4672739 Method for use in brazing an interconnect pin to a metallization pattern situated on a brittle dielectric substrate
06/16/1987EP0225651A2 Method of and apparatus for detecting pattern defects
06/16/1987EP0225570A2 Process for thermal separation of a two-layer or multilayer film
06/16/1987EP0225457A1 Exposure apparatus for photosensitive layered materials
06/16/1987EP0225451A2 Process for making a metal-clad material for a circuit board, and apparatus therefor
06/16/1987EP0225333A1 Mini chip carrier slotted array.
06/16/1987CA1223089A1 Barrierless high-temperature lift-off process
06/16/1987CA1223085A1 Partially aligned multi-layered circuitry
06/16/1987CA1223082A1 Process and apparatus for etching copper masked by a nickel-gold mask
06/16/1987CA1223081A1 Circuit board with contact positions, as used for telecommunications terminals and other apparatus
06/16/1987CA1223035A1 Horizontal battery holder for cylinder cells
06/11/1987DE3619226A1 Wiring support
06/11/1987DE3605498A1 Device for aligning and stamping image carriers
06/11/1987DE3539915C1 Cassette for exposing, in particular, printed circuit boards
06/10/1987EP0225238A1 Cards comprising a component and micromodule with edge contacts
06/10/1987EP0224922A2 Invar foil
06/10/1987EP0224699A2 Method of forming fine conductive lines, patterns and connnectors
06/10/1987EP0224572A1 Circuit board material and process of making
06/10/1987EP0041949B1 Recessed circuit module and method of making
06/09/1987US4672358 Surface-mounted power resistors
06/09/1987US4672152 Multilayer ceramic circuit board
06/09/1987US4672020 Crosslinked adhesive layer; printed circuits, printing plates
06/09/1987US4671984 Printed circuit boards
06/09/1987US4671968 Method for electroless deposition of copper on conductive surfaces and on substrates containing conductive surfaces
06/09/1987US4671928 Method of controlling the sintering of metal particles
06/09/1987US4671854 Method for preparing a printed circuit board with solder plated circuit and through-holes